JPH0246458A - Mask seam matching pattern - Google Patents
Mask seam matching patternInfo
- Publication number
- JPH0246458A JPH0246458A JP63198317A JP19831788A JPH0246458A JP H0246458 A JPH0246458 A JP H0246458A JP 63198317 A JP63198317 A JP 63198317A JP 19831788 A JP19831788 A JP 19831788A JP H0246458 A JPH0246458 A JP H0246458A
- Authority
- JP
- Japan
- Prior art keywords
- pattern
- mask
- directions
- alignment
- circular
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims abstract description 15
- 230000003247 decreasing effect Effects 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 208000023514 Barrett esophagus Diseases 0.000 description 1
- 241000405961 Scomberomorus regalis Species 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
Landscapes
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はマスク目合せパターンに関し、特に半導体装置
の製造に使用されるマスクの目合せパターンに関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a mask alignment pattern, and more particularly to a mask alignment pattern used in the manufacture of semiconductor devices.
半導体装置の製造にはホトリソグラフイ技術が多く用い
られている。ホトリソグラフィにおいては、下地基板に
塗布したホトレジスト膜にマスクのパターンを転写する
のであるが、その場合、位置合せのために、下地基板と
マスクの両方に目合せパターンが設けられている。Photolithography technology is often used in the manufacture of semiconductor devices. In photolithography, a mask pattern is transferred to a photoresist film coated on a base substrate, and in this case, alignment patterns are provided on both the base substrate and the mask for alignment.
目合せパターンには、第3図に示すように、下地基板パ
ターン6とマスクパターン7とが共に四角形で、例えば
マスクパターン7が下地基板パターン6の中に入れば良
いというもの、あるいは第4図に示すように、棒状の下
地パターン8とマスクパターン9を所定間隔に並べてお
き、重ね合せのずれ量を直読するものなどがある。As shown in FIG. 3, the alignment pattern may be one in which both the base substrate pattern 6 and the mask pattern 7 are square, and for example, the mask pattern 7 may fit inside the base substrate pattern 6, or the pattern shown in FIG. As shown in FIG. 2, there is a method in which a bar-shaped base pattern 8 and a mask pattern 9 are arranged at a predetermined interval, and the amount of misalignment in overlay is directly read.
上述した従来の目合せパターンは、下地基板パターンと
マスクのパターンのエツジの間隙を利用して目合せのず
れを読みとっている。このため、下地基板パターンが膜
成長などで不鮮明になったり、パターンエツジがぼけて
しまうと、パターンエツジ同志の間隙が不明確となり、
ずれ景を読みとる事が困難となってしまう欠点があった
。The conventional alignment pattern described above uses the gap between the edges of the underlying substrate pattern and the mask pattern to read alignment errors. For this reason, if the underlying substrate pattern becomes unclear due to film growth or the pattern edges become blurred, the gaps between the pattern edges become unclear.
The drawback was that it was difficult to read the misaligned scenery.
本発明のマスク目合せパターンは、下地基板のパターン
とマスクのパターンとの目合ぜの照合に使用する照合用
パターンか円形のパターンの組合せて構成されている。The mask alignment pattern of the present invention is composed of a combination of a matching pattern used to check the alignment between a pattern on a base substrate and a pattern on a mask, or a circular pattern.
第1図(Xl)へ−〈(〉は本発明a)第1グ)実施例
を説明するための平面模式図である。To FIG. 1 (Xl) - <(>) is a schematic plan view for explaining the a) first g) embodiment of the present invention.
本発明においては、下地基板パターン1及びマスクパタ
ーン2共に円形である。In the present invention, both the base substrate pattern 1 and the mask pattern 2 are circular.
第1図(a)は、目合ぜか正常に行われたときを示し、
この場合のずれ星はセロであり、真中のパターンは同心
円になる。FIG. 1(a) shows when the alignment is performed normally;
In this case, the shifting star is Cero, and the pattern in the middle becomes concentric circles.
第1図(1:l)、(C)は、目合ぜにずれを生じた場
合を示し、第1図(1〕)はX(+)方向にずれており
、第1図(C>はX(+)及びY(−)方向にずれてい
ることを示す。ここて、中心のずれのビッヂをX、Y方
向とも0.57.zmとした場合、第1し] (+1
)ではX(+)方向に0 、51−t rn、第1図(
C)ではX(+)方向に0.571m以上、Y(−)方
向に0.5/lrn以1ζずれている事になる。Figures 1 (1:l) and (C) show cases where misalignment occurs; Figure 1 (1) shows a shift in the X (+) direction, and Figure 1 (C> indicates a deviation in the X (+) and Y (-) directions.Here, if the center deviation bit is 0.57.zm in both the X and Y directions, then
), 0,51-trn in the X(+) direction, Fig. 1(
In C), there is a deviation of 0.571 m or more in the X (+) direction and 1ζ of 0.5/lrn or more in the Y (-) direction.
更に詳しい情報か必要な場合は、ピッチを小さくしてX
、Y方向の円の数を増やせばよい。下地基板パターンか
不鮮明であっても、円形ならばその中心の推測は比較的
楽である3、本実施例は目合せた2つの円形パターンの
中心かX、Y方向にずれている事を判別するたりて良い
ため、下地パターンか不鮮明な場合、効果を発揮する。If you need more information, reduce the pitch and press
, just increase the number of circles in the Y direction. Even if the underlying substrate pattern is unclear, if it is circular, it is relatively easy to guess the center. 3. In this embodiment, it is determined that the center of two aligned circular patterns is shifted in the X and Y directions. Since it is easy to apply, it is effective when the underlying pattern is unclear.
第2図(a)〜(C)は本発明の第2の実施例を説明す
るための平面模式図である。FIGS. 2(a) to 2(C) are schematic plan views for explaining a second embodiment of the present invention.
第2の実施例か第1の実施例と異なる点は、第1図にお
ける真中の円形パターンか省かれていることである。そ
の代りに、下地基板パターン3とマスクパターン4は、
X、Yの(+) 、 (−)方向には目合せマージン
5の分たけ中心かずれる様にパターンか配置されている
。The difference between the second embodiment and the first embodiment is that the central circular pattern in FIG. 1 is omitted. Instead, the underlying substrate pattern 3 and mask pattern 4 are
In the (+) and (-) directions of X and Y, patterns are arranged so as to be offset from the center by the alignment margin 5.
第2121(a)はl・1音ぜずれかセロの場合を示す
。No. 2121(a) shows the case of l/1 sound being shifted or cello.
第2LK(a>、(ト))は1丁1合せずれかある場合
を示し、第2図(b)は目合せマージン内のずれの場合
を、第21XI (c )は[1音せマージンを超えた
ずれを生した場合を示す。The 2nd LK (a>, (G)) shows the case where there is a misalignment of only 1 note, the 21st XI (c) shows the case where there is a misalignment within the alignment margin, and the 21st XI (c) shows the case where there is a misalignment of only 1 note. Indicates a case where the deviation exceeds .
この実施例では下地基板パターンとマスクパターンの目
合せの良否判定を一目て行なえるという利点がある。This embodiment has the advantage that it is possible to judge at a glance whether the alignment between the underlying substrate pattern and the mask pattern is good or bad.
以上説明したように、本発明は、目合せパターンに円形
パターンの組合せを用い、パターンエツジ同志の間隙で
はなく、円形パターンの中心を推測して目合せずれを判
定する為、下地基板パターンが不鮮明であっても目合せ
ずれを読みとる事を可能とする効果かある。As explained above, the present invention uses a combination of circular patterns as an alignment pattern and judges misalignment by estimating the center of the circular pattern rather than the gap between the pattern edges, so the underlying substrate pattern is unclear. Even so, it has the effect of making it possible to read the misalignment.
・・・目合せマージン、6・・・下地基板パターン、7
・・・マスクパターン、8・・・下地基板パターン、9
・・マスクパターン。... Alignment margin, 6... Base board pattern, 7
...Mask pattern, 8... Base board pattern, 9
・Mask pattern.
Claims (1)
合に使用する照合用パターンが円形のパターンの組合せ
で構成されていることを特徴とするマスク目合せパター
ン。A mask alignment pattern characterized in that a matching pattern used to match the alignment between a pattern on a base substrate and a pattern on a mask is composed of a combination of circular patterns.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63198317A JPH0246458A (en) | 1988-08-08 | 1988-08-08 | Mask seam matching pattern |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63198317A JPH0246458A (en) | 1988-08-08 | 1988-08-08 | Mask seam matching pattern |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0246458A true JPH0246458A (en) | 1990-02-15 |
Family
ID=16389111
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63198317A Pending JPH0246458A (en) | 1988-08-08 | 1988-08-08 | Mask seam matching pattern |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0246458A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5057778A (en) * | 1973-09-17 | 1975-05-20 | ||
| JPS5492062A (en) * | 1977-12-28 | 1979-07-20 | Fujitsu Ltd | Pattern exposing mask |
| JPS6219856A (en) * | 1985-07-18 | 1987-01-28 | Rohm Co Ltd | Positioning method for substrate where pattern is to be formed |
| JPS6236820A (en) * | 1985-08-12 | 1987-02-17 | Canon Inc | Alignment device and its mask |
-
1988
- 1988-08-08 JP JP63198317A patent/JPH0246458A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5057778A (en) * | 1973-09-17 | 1975-05-20 | ||
| JPS5492062A (en) * | 1977-12-28 | 1979-07-20 | Fujitsu Ltd | Pattern exposing mask |
| JPS6219856A (en) * | 1985-07-18 | 1987-01-28 | Rohm Co Ltd | Positioning method for substrate where pattern is to be formed |
| JPS6236820A (en) * | 1985-08-12 | 1987-02-17 | Canon Inc | Alignment device and its mask |
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