JPH0247044U - - Google Patents

Info

Publication number
JPH0247044U
JPH0247044U JP12564288U JP12564288U JPH0247044U JP H0247044 U JPH0247044 U JP H0247044U JP 12564288 U JP12564288 U JP 12564288U JP 12564288 U JP12564288 U JP 12564288U JP H0247044 U JPH0247044 U JP H0247044U
Authority
JP
Japan
Prior art keywords
wafer
wafer transfer
transfer device
carrier
lifting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12564288U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12564288U priority Critical patent/JPH0247044U/ja
Publication of JPH0247044U publication Critical patent/JPH0247044U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図はこの考案に係る半導体ウエハ移換装置
を示す概略図、第2図は第1図のA―A断面図、
第3図は第2図の一部拡大図、第4図〜第9図は
第1図〜第3図に示した半導体ウエハ移換装置の
動作説明図である。 3a,3b……キヤリア、5……半導体ウエハ
、8a,8b……昇降部材、10a,10b……
ラツク、11a,11b……モータ、12a,1
2b……回転軸、14a,14b……ピニオン、
15a,15b……モータ、16a,16b……
回転軸、18a,18b……雄ネジ、19a,1
9b……雌ネジ部材、20a,20b……挾持部
材、22……ガイド部材、23……移動部材、2
4……保持部材。
FIG. 1 is a schematic diagram showing a semiconductor wafer transfer device according to this invention, FIG. 2 is a sectional view taken along line AA in FIG.
FIG. 3 is a partially enlarged view of FIG. 2, and FIGS. 4 to 9 are explanatory views of the operation of the semiconductor wafer transfer apparatus shown in FIGS. 1 to 3. 3a, 3b...Carrier, 5...Semiconductor wafer, 8a, 8b...Elevating member, 10a, 10b...
Rack, 11a, 11b...Motor, 12a, 1
2b... Rotating shaft, 14a, 14b... Pinion,
15a, 15b...Motor, 16a, 16b...
Rotating shaft, 18a, 18b...male thread, 19a, 1
9b... Female screw member, 20a, 20b... Clamping member, 22... Guide member, 23... Moving member, 2
4...Holding member.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] キヤリアに収納された複数枚のウエハを1枚ず
つ別のキヤリアに移し換えるウエハ移換装置にお
いて、上記ウエハを昇降するウエハ昇降手段と、
上記ウエハを保持しかつ移動するウエハ搬送手段
とを具備することを特徴とするウエハ移換装置。
In a wafer transfer device that transfers a plurality of wafers stored in a carrier one by one to another carrier, a wafer lifting means for lifting and lowering the wafer;
A wafer transfer device comprising wafer transfer means for holding and moving the wafer.
JP12564288U 1988-09-28 1988-09-28 Pending JPH0247044U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12564288U JPH0247044U (en) 1988-09-28 1988-09-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12564288U JPH0247044U (en) 1988-09-28 1988-09-28

Publications (1)

Publication Number Publication Date
JPH0247044U true JPH0247044U (en) 1990-03-30

Family

ID=31376427

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12564288U Pending JPH0247044U (en) 1988-09-28 1988-09-28

Country Status (1)

Country Link
JP (1) JPH0247044U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001237306A (en) * 2000-02-25 2001-08-31 Nikon Corp Substrate hand, transfer device, inspection device and flat substrate storage device
CN113799097A (en) * 2020-06-16 2021-12-17 电装波动株式会社 Clamping device and clamping method for plate-shaped workpiece

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001237306A (en) * 2000-02-25 2001-08-31 Nikon Corp Substrate hand, transfer device, inspection device and flat substrate storage device
CN113799097A (en) * 2020-06-16 2021-12-17 电装波动株式会社 Clamping device and clamping method for plate-shaped workpiece
CN113799097B (en) * 2020-06-16 2024-11-12 电装波动株式会社 Plate-shaped workpiece clamping device and plate-shaped workpiece clamping method
US12208511B2 (en) 2020-06-16 2025-01-28 Denso Wave Incorporated Gripping apparatus for plate-shaped workpiece and gripping method for plate-shaped workpiece

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