JPH0247056U - - Google Patents
Info
- Publication number
- JPH0247056U JPH0247056U JP1988125869U JP12586988U JPH0247056U JP H0247056 U JPH0247056 U JP H0247056U JP 1988125869 U JP1988125869 U JP 1988125869U JP 12586988 U JP12586988 U JP 12586988U JP H0247056 U JPH0247056 U JP H0247056U
- Authority
- JP
- Japan
- Prior art keywords
- sealed
- resin
- lead frame
- exterior plating
- tie bar
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988125869U JPH0247056U (cs) | 1988-09-26 | 1988-09-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988125869U JPH0247056U (cs) | 1988-09-26 | 1988-09-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0247056U true JPH0247056U (cs) | 1990-03-30 |
Family
ID=31376856
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988125869U Pending JPH0247056U (cs) | 1988-09-26 | 1988-09-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0247056U (cs) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018113351A (ja) * | 2017-01-12 | 2018-07-19 | 大口マテリアル株式会社 | リードフレーム及びその製造方法 |
-
1988
- 1988-09-26 JP JP1988125869U patent/JPH0247056U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018113351A (ja) * | 2017-01-12 | 2018-07-19 | 大口マテリアル株式会社 | リードフレーム及びその製造方法 |