JPH0247058U - - Google Patents
Info
- Publication number
- JPH0247058U JPH0247058U JP12683588U JP12683588U JPH0247058U JP H0247058 U JPH0247058 U JP H0247058U JP 12683588 U JP12683588 U JP 12683588U JP 12683588 U JP12683588 U JP 12683588U JP H0247058 U JPH0247058 U JP H0247058U
- Authority
- JP
- Japan
- Prior art keywords
- insulating base
- lead terminal
- external lead
- wiring layer
- wall member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の半導体素子収納用パツケージ
の一実施例を示す断面図、第２図は第１図に示す
パツケージの絶縁基体の平面図、第３図は第２図
に示すパツケージの丸部拡大平面図、第４図は本
考案の他の実施例を示し、外部リード端子のロウ
付け部先端の形状を説明するための部分拡大平面
図、第５図は従来の半導体素子収納用パツケージ
の断面図、第６図は第５図に示すパツケージの絶
縁基体の平面図である。
１……絶縁基体、１ａ……壁部材、５……メタ
ライズ配線層、６……外部リード端子、７……ロ
ウ材、Ａ……外部リード端子のロウ付け部先端。
FIG. 1 is a sectional view showing an embodiment of the package for housing semiconductor elements of the present invention, FIG. 2 is a plan view of the insulating base of the package shown in FIG. 1, and FIG. FIG. 4 shows another embodiment of the present invention, and is a partially enlarged plan view for explaining the shape of the tip of the soldering part of the external lead terminal. FIG. 5 shows a conventional package for housing semiconductor elements. FIG. 6 is a plan view of the insulating base of the package shown in FIG. DESCRIPTION OF SYMBOLS 1... Insulating base, 1a... Wall member, 5... Metallized wiring layer, 6... External lead terminal, 7... Brazing material, A... The tip of the brazed part of the external lead terminal.
Claims (1)
該絶縁基体上に形成された枠状の壁部材とを有し
、前記壁部材の外方に露出したメタライズ配線層
の一端に外部リード端子をロウ付けして成る半導
体素子収納用パツケージにおいて、前記外部リー
ド端子のロウ付け部先端が平面視したとき円弧状
もしくは傾斜状となるように形成したことを特徴
とする半導体素子収納用パツケージ。 an insulating base having a metallized wiring layer on the top surface;
a frame-shaped wall member formed on the insulating base, and an external lead terminal is brazed to one end of the metallized wiring layer exposed to the outside of the wall member, 1. A package for housing a semiconductor device, characterized in that the tip of a brazed portion of an external lead terminal is formed to have an arc shape or an inclined shape when viewed from above.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12683588U JPH0247058U (en) | 1988-09-27 | 1988-09-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12683588U JPH0247058U (en) | 1988-09-27 | 1988-09-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0247058U true JPH0247058U (en) | 1990-03-30 |
Family
ID=31378717
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12683588U Pending JPH0247058U (en) | 1988-09-27 | 1988-09-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0247058U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49116964A (en) * | 1972-05-10 | 1974-11-08 | ||
| JPS571250A (en) * | 1980-06-03 | 1982-01-06 | Nec Corp | Equipping structure of outside lead |
-
1988
- 1988-09-27 JP JP12683588U patent/JPH0247058U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49116964A (en) * | 1972-05-10 | 1974-11-08 | ||
| JPS571250A (en) * | 1980-06-03 | 1982-01-06 | Nec Corp | Equipping structure of outside lead |
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