JPH0247059U - - Google Patents

Info

Publication number
JPH0247059U
JPH0247059U JP12643288U JP12643288U JPH0247059U JP H0247059 U JPH0247059 U JP H0247059U JP 12643288 U JP12643288 U JP 12643288U JP 12643288 U JP12643288 U JP 12643288U JP H0247059 U JPH0247059 U JP H0247059U
Authority
JP
Japan
Prior art keywords
resin body
external leads
semiconductor device
flat plate
plate surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12643288U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12643288U priority Critical patent/JPH0247059U/ja
Publication of JPH0247059U publication Critical patent/JPH0247059U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図a及びbは本考案による半導体装置の一
実施例を示すプリント基板に実装された半導体装
置の平面図及び側面図、第2図a及びbは従来の
半導体装置をプリント基板に実装した状態を示す
側面図である。 1……樹脂体、2……外部リード、3……プリ
ント基板、4……パツド、5……配線。
1A and 1B are a plan view and a side view of a semiconductor device mounted on a printed circuit board showing an embodiment of the semiconductor device according to the present invention, and FIGS. 2A and 2B are views of a conventional semiconductor device mounted on a printed circuit board. It is a side view which shows a state. 1... Resin body, 2... External lead, 3... Printed circuit board, 4... Pad, 5... Wiring.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体チツプを内蔵する樹脂体と前記樹脂体の
側面より突出する平板状の複数の外部リードとか
らなる半導体装置において、前記外部リードの前
記樹脂体から突出する平板面に対して前記外部リ
ードの先端部の平板面が前記外部リードの伸る方
向を中心軸として直角に捩じられていることを特
徴とする半導体装置。
In a semiconductor device comprising a resin body containing a semiconductor chip and a plurality of flat external leads protruding from a side surface of the resin body, the tips of the external leads are aligned with respect to the flat plate surface of the external leads protruding from the resin body. A semiconductor device characterized in that a flat plate surface of the portion is twisted at right angles with the central axis in the direction in which the external lead extends.
JP12643288U 1988-09-27 1988-09-27 Pending JPH0247059U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12643288U JPH0247059U (en) 1988-09-27 1988-09-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12643288U JPH0247059U (en) 1988-09-27 1988-09-27

Publications (1)

Publication Number Publication Date
JPH0247059U true JPH0247059U (en) 1990-03-30

Family

ID=31377951

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12643288U Pending JPH0247059U (en) 1988-09-27 1988-09-27

Country Status (1)

Country Link
JP (1) JPH0247059U (en)

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