JPH0247062U - - Google Patents

Info

Publication number: JPH0247062U
Authority: JP; Japan
Prior art keywords: back side; lead frame; chip; insulating coating; board
Prior art date: 1988-09-26
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Pending

Application number

JP1988125866U

Other languages

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1988-09-26

Filing date

1988-09-26

Publication date

1990-03-30

1988-09-26 Application filed filed Critical

1988-09-26 Priority to JP1988125866U priority Critical patent/JPH0247062U/ja

1990-03-30 Publication of JPH0247062U publication Critical patent/JPH0247062U/ja

Status Pending legal-status Critical Current

Links

Classifications

- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/30—Die-attach connectors
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/073—Connecting or disconnecting of die-attach connectors
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

Die Bonding (AREA)
Lead Frames For Integrated Circuits (AREA)

JP1988125866U 1988-09-26 1988-09-26 Pending JPH0247062U (th)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
JP1988125866U JPH0247062U (th)	1988-09-26	1988-09-26

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP1988125866U JPH0247062U (th)	1988-09-26	1988-09-26

Publications (1)

Publication Number	Publication Date
JPH0247062U true JPH0247062U (th)	1990-03-30

Family

ID=31376851

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP1988125866U Pending JPH0247062U (th)	1988-09-26	1988-09-26

Country Status (1)

Country	Link
JP (1)	JPH0247062U (th)

1988
- 1988-09-26 JP JP1988125866U patent/JPH0247062U/ja active Pending

Publication	Publication Date	Title
JPH0247062U (th)	1990-03-30
JPH0399466U (th)	1991-10-17
JPS6333665U (th)	1988-03-04
JPS63164239U (th)	1988-10-26
JPS6371570U (th)	1988-05-13
JPH0217854U (th)	1990-02-06
JPH01133745U (th)	1989-09-12
JPS62163956U (th)	1987-10-17
JPS63147831U (th)	1988-09-29
JPS63170971U (th)	1988-11-07
JPH0474457U (th)	1992-06-30
JPH0236045U (th)	1990-03-08
JPH0245676U (th)	1990-03-29
JPS6240884U (th)	1987-03-11
JPS62112144U (th)	1987-07-17
JPH03101529U (th)	1991-10-23
JPH03120052U (th)	1991-12-10
JPH0474458U (th)	1992-06-30
JPS64332U (th)	1989-01-05
JPS62170632U (th)	1987-10-29
JPH0456340U (th)	1992-05-14
JPS6316455U (th)	1988-02-03
JPS63174460U (th)	1988-11-11
JPH0323944U (th)	1991-03-12
JPH0351868U (th)	1991-05-20