JPH0247106B2 - - Google Patents

Info

Publication number
JPH0247106B2
JPH0247106B2 JP59074988A JP7498884A JPH0247106B2 JP H0247106 B2 JPH0247106 B2 JP H0247106B2 JP 59074988 A JP59074988 A JP 59074988A JP 7498884 A JP7498884 A JP 7498884A JP H0247106 B2 JPH0247106 B2 JP H0247106B2
Authority
JP
Japan
Prior art keywords
epoxy resin
resin
flame retardant
semiconductor device
molded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59074988A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60219755A (ja
Inventor
Toshuki Hidaka
Hisashi Sakamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP59074988A priority Critical patent/JPS60219755A/ja
Publication of JPS60219755A publication Critical patent/JPS60219755A/ja
Publication of JPH0247106B2 publication Critical patent/JPH0247106B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP59074988A 1984-04-16 1984-04-16 樹脂モ−ルド型半導体装置 Granted JPS60219755A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59074988A JPS60219755A (ja) 1984-04-16 1984-04-16 樹脂モ−ルド型半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59074988A JPS60219755A (ja) 1984-04-16 1984-04-16 樹脂モ−ルド型半導体装置

Publications (2)

Publication Number Publication Date
JPS60219755A JPS60219755A (ja) 1985-11-02
JPH0247106B2 true JPH0247106B2 (fr) 1990-10-18

Family

ID=13563164

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59074988A Granted JPS60219755A (ja) 1984-04-16 1984-04-16 樹脂モ−ルド型半導体装置

Country Status (1)

Country Link
JP (1) JPS60219755A (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06105724B2 (ja) * 1985-12-02 1994-12-21 株式会社日立製作所 半導体装置の製造方法

Also Published As

Publication number Publication date
JPS60219755A (ja) 1985-11-02

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees