JPH024757U

JPH024757U -

Info

Publication number: JPH024757U
Application number: JP8145188U
Authority: JP
Priority date: 1988-06-20
Filing date: 1988-06-20
Publication date: 1990-01-12

Description

[Brief explanation of drawings]

第１図はこの考案を電鋳薄刃砥石に適用した場
合の一実施例を示す正面図であり、第２図および
第３図は同電鋳薄刃砥石を切断機に装着した状態
を示す図であつて、第２図は断面図、第３図は第
２図の―線矢視図である。第４図は従来の電
鋳薄刃砥石の正面図であり、第５図は同電鋳薄刃
砥石を切断機に装着した状態を示す断面図である
。第６図は従来のハブ付き電鋳薄刃砥石（薄刃砥
石）の断面図である。１０……電鋳薄刃砥石（極薄刃砥石）、１０ａ
……取付孔、１０ｂ……外周、Ｍ……合せマーク
。 Fig. 1 is a front view showing an example of applying this invention to an electroformed thin-blade grindstone, and Figs. 2 and 3 are views showing the same electroformed thin-blade grindstone installed in a cutting machine. FIG. 2 is a sectional view, and FIG. 3 is a view taken along the line -- in FIG. 2. FIG. 4 is a front view of a conventional electroformed thin-blade grindstone, and FIG. 5 is a sectional view showing the electroformed thin-blade grindstone installed in a cutting machine. FIG. 6 is a sectional view of a conventional electroformed thin-blade grindstone with a hub (thin-blade grindstone). 10...Electroformed thin blade whetstone (ultra thin blade whetstone), 10a
...Mounting hole, 10b...outer circumference, M...alignment mark.

Claims

[Claims for Utility Model Registration] (1) Disc-shaped, with a mounting hole drilled in the center, and an abrasive layer formed by fixing superabrasive grains in a binder on the outer periphery. and an ultra-thin blade grindstone in which the center of the outer periphery of the abrasive grain layer is eccentric with respect to the center of the mounting hole, characterized in that an alignment mark is provided on a straight line passing through the center of the mounting hole and the center of the outer periphery. Ultra thin blade whetstone. (2) It has a disc shape, has a mounting hole in the center, and has an abrasive layer formed by fixing superabrasive grains in a bonding agent on the outer periphery. On the other hand, in an ultra-thin whetstone in which the center of the outer periphery of the abrasive grain layer is eccentric, it is located on a straight line passing through the center of the mounting hole and the center of the outer periphery, and from the outer periphery of the abrasive grain layer to the center side. An ultra-thin whetstone characterized by having alignment marks within 3mm.