JPH0249193U - - Google Patents
Info
- Publication number
- JPH0249193U JPH0249193U JP12628488U JP12628488U JPH0249193U JP H0249193 U JPH0249193 U JP H0249193U JP 12628488 U JP12628488 U JP 12628488U JP 12628488 U JP12628488 U JP 12628488U JP H0249193 U JPH0249193 U JP H0249193U
- Authority
- JP
- Japan
- Prior art keywords
- casing
- circuit board
- high frequency
- lid
- uneven surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010586 diagram Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Description
第1図は、本考案の高周波のシールド構造の実
施例を示す斜視図、第2図は、同構造の断面図、
第3図及び第4図は、同構造の製造方法を示す図
、第5図は、凹凸状の表面を示す平面図、第6図
は、本考案の高周波のアース構造を示す断面図、
第7図は、本考案の高周波のシールド及びアース
構造を示す断面図、第8図は、もれ信号を説明す
る図、第9図〜第12図は、従来の高周波のシー
ルド構造を示す図である。
1……筐体、2……開口部、3……縁部、4…
…蓋体、5……凹凸状の表面、7……回路基板。
FIG. 1 is a perspective view showing an embodiment of the high frequency shielding structure of the present invention, and FIG. 2 is a sectional view of the same structure.
3 and 4 are diagrams showing a manufacturing method of the same structure, FIG. 5 is a plan view showing the uneven surface, and FIG. 6 is a sectional view showing the high frequency earthing structure of the present invention.
FIG. 7 is a sectional view showing the high frequency shielding and grounding structure of the present invention, FIG. 8 is a diagram explaining leakage signals, and FIGS. 9 to 12 are diagrams showing the conventional high frequency shielding structure. It is. 1... Housing, 2... Opening, 3... Edge, 4...
... Lid body, 5 ... uneven surface, 7 ... circuit board.
Claims (1)
された筐体1と、 該筐体の開口部を覆い、筐体と電気的に接続さ
れる蓋体4と、 該筐体と蓋体が接触する部分の少なくともいず
れか一方に設けられた凹凸状の表面5を有し、前
記筐体及び蓋体の電気的接続を良好とした高周波
のシールド構造。 2 高周波回路を有する回路基板7と、 該回路基板を固定し、アース電位とされた筐体
1と、 該筐体において回路基板との間の接触部分に設
けられた凹凸状の表面5を有し、前記筐体及び回
路基板のアース接続を良好とした高周波のアース
構造。 3 前記請求項2記載の回路基板7を前記請求項
1記載の筐体1及び蓋体4が形成する内部空間に
配置した高周波のシールド及びアース構造。[Scope of Claim for Utility Model Registration] 1. A casing 1 that is at ground potential to shield the internal space; a lid 4 that covers the opening of the casing and is electrically connected to the casing; A high frequency shielding structure that has an uneven surface 5 provided on at least one of the parts where the casing and the lid come into contact, and improves the electrical connection between the casing and the lid. 2. A circuit board 7 having a high frequency circuit, a casing 1 to which the circuit board is fixed and which is at ground potential, and an uneven surface 5 provided at a contact portion between the casing and the circuit board. and a high frequency grounding structure with good grounding connection between the casing and the circuit board. 3. A high frequency shielding and grounding structure in which the circuit board 7 according to claim 2 is arranged in an internal space formed by the casing 1 and lid body 4 according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12628488U JPH0249193U (en) | 1988-09-29 | 1988-09-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12628488U JPH0249193U (en) | 1988-09-29 | 1988-09-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0249193U true JPH0249193U (en) | 1990-04-05 |
Family
ID=31377670
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12628488U Pending JPH0249193U (en) | 1988-09-29 | 1988-09-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0249193U (en) |
-
1988
- 1988-09-29 JP JP12628488U patent/JPH0249193U/ja active Pending
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