JPH0249201U - - Google Patents

Info

Publication number
JPH0249201U
JPH0249201U JP12718788U JP12718788U JPH0249201U JP H0249201 U JPH0249201 U JP H0249201U JP 12718788 U JP12718788 U JP 12718788U JP 12718788 U JP12718788 U JP 12718788U JP H0249201 U JPH0249201 U JP H0249201U
Authority
JP
Japan
Prior art keywords
carrier
microwave circuit
dielectric substrate
case
bond
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12718788U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12718788U priority Critical patent/JPH0249201U/ja
Publication of JPH0249201U publication Critical patent/JPH0249201U/ja
Pending legal-status Critical Current

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Landscapes

  • Waveguide Connection Structure (AREA)
  • Waveguides (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案の一実施例のマイクロ波回路装
置の上面図、第2図は第1図の―線断面図、
第3図は本実施例におけるキヤリアの斜視図、第
4図は従来のマイクロ波回路装置の上面図、第5
図は第4図の―線断面図である。 1……ケース、2……誘電体基板、3……キヤ
リア、4……マイクロストリツプ線路、5……ネ
ジ、6……同軸コネクタ、7……切削部。
Fig. 1 is a top view of a microwave circuit device according to an embodiment of the present invention, Fig. 2 is a sectional view taken along the line - - of Fig. 1,
FIG. 3 is a perspective view of the carrier in this embodiment, FIG. 4 is a top view of a conventional microwave circuit device, and FIG.
The figure is a sectional view taken along the line -- in FIG. DESCRIPTION OF SYMBOLS 1... Case, 2... Dielectric substrate, 3... Carrier, 4... Microstrip line, 5... Screw, 6... Coaxial connector, 7... Cutting part.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 誘電体基板を金属板より成るキヤリアの上面に
接着した後、前記キヤリアをマイクロ波回路装置
のケースに固定する構成のものにおいて、前記キ
ヤリア上面に切削部を設けたことを特徴とするマ
イクロ波回路装置。
A microwave circuit configured to bond a dielectric substrate to the upper surface of a carrier made of a metal plate and then fix the carrier to a case of a microwave circuit device, characterized in that a cutting portion is provided on the upper surface of the carrier. Device.
JP12718788U 1988-09-30 1988-09-30 Pending JPH0249201U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12718788U JPH0249201U (en) 1988-09-30 1988-09-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12718788U JPH0249201U (en) 1988-09-30 1988-09-30

Publications (1)

Publication Number Publication Date
JPH0249201U true JPH0249201U (en) 1990-04-05

Family

ID=31379390

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12718788U Pending JPH0249201U (en) 1988-09-30 1988-09-30

Country Status (1)

Country Link
JP (1) JPH0249201U (en)

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