JPH0252420B2 - - Google Patents

Info

Publication number
JPH0252420B2
JPH0252420B2 JP56109834A JP10983481A JPH0252420B2 JP H0252420 B2 JPH0252420 B2 JP H0252420B2 JP 56109834 A JP56109834 A JP 56109834A JP 10983481 A JP10983481 A JP 10983481A JP H0252420 B2 JPH0252420 B2 JP H0252420B2
Authority
JP
Japan
Prior art keywords
film
adhesive layer
capacitor
workability
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP56109834A
Other languages
Japanese (ja)
Other versions
JPS5810813A (en
Inventor
Yasumasa Araki
Nobuyuki Kume
Megumi Miura
Kazushi Kobayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP56109834A priority Critical patent/JPS5810813A/en
Publication of JPS5810813A publication Critical patent/JPS5810813A/en
Publication of JPH0252420B2 publication Critical patent/JPH0252420B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/018Dielectrics
    • H01G4/06Solid dielectrics
    • H01G4/14Organic dielectrics
    • H01G4/145Organic dielectrics vapour deposited
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/32Wound capacitors

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Description

【発明の詳細な説明】 本発明はプラスチツクフイルムコンデンサ又は
絶縁紙コンデンサ(以下総称してフイルムコンデ
ンサ)の誘電体及び保護材料に関するもので、そ
の目的とするところは誘電体相互間又は保護材料
相互間の密着性及び誘電体と電極の密着性を良く
し、コンデンサの短絡や誘電正接悪化の防止、絶
縁抵抗の低下を防止し静電容量のバラツキが少な
く高性能となると共に作業性が従来と比較して低
下することのないようにしようとするものであ
る。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a dielectric material and a protective material for a plastic film capacitor or an insulating paper capacitor (hereinafter collectively referred to as a film capacitor). It improves the adhesion between the dielectric and the electrode, prevents short circuits of the capacitor, worsens the dielectric loss tangent, and prevents a decrease in insulation resistance, resulting in less variation in capacitance, higher performance, and improved workability compared to conventional capacitors. The aim is to prevent this from deteriorating.

プラスチツクフイルム、又は金属化プラスチツ
クフイルム、又は絶縁紙、又は金属化絶縁紙(以
下総称してフイルム)を使用するフイルムコンデ
ンサにおいては、捲回もしくは積層した素子を加
熱と加圧により成型して成るが、従来のフイルム
を使用したコンデンサでは、成型後でも誘電体相
互間、又は保護フイルム相互間、及び誘電体と電
極との密着が不完全であつた。
Film capacitors that use plastic film, metalized plastic film, insulating paper, or metalized insulating paper (hereinafter collectively referred to as film) are formed by forming wound or laminated elements by heating and applying pressure. In capacitors using conventional films, even after molding, the adhesion between dielectrics, between protective films, and between dielectrics and electrodes was incomplete.

密着が不完全である場合には、次のような弊害
がみられる。
If the adhesion is incomplete, the following disadvantages may occur.

(1) 金属溶射によるメタリコン工程において、メ
タリコン粒子がフイルム間隙へ侵入し、コンデ
ンサが短絡する。
(1) In the metallicon process using metal spraying, metallicon particles enter the film gap and short circuit the capacitor.

(2) メタリコン工程において、素子側面をメタリ
コン粒子が流れないように、素子にマスキング
を行なうが、メタリコン後、このマスキングを
除去する際に保護フイルムの剥離が発生し、後
工程における作業性及び外観上の問題となる。
(2) In the metallicon process, the device is masked to prevent metallicon particles from flowing down the sides of the device, but when this masking is removed after metallicon, the protective film peels off, which affects workability and appearance in the subsequent process. The above problem arises.

(3) フイルム相互間の密着が不完全で、均一な含
浸が行なわれていない場合には水分が浸入しや
すく耐湿性に劣る。
(3) If the adhesion between the films is incomplete and the impregnation is not uniform, moisture will easily penetrate and the moisture resistance will be poor.

本発明は上記のような従来の問題を解消したも
ので、誘電体フイルム、もしくは保護フイルムと
して表面に常温では非粘着で、且つ60℃以上で粘
着性を有する接着剤層(例えば、ポリアルキレン
テレフタレートを主成分とする変成エーテル型ポ
リエステル樹脂で、具体的には東洋紡株式会社製
の商品名バイロン300、バイロン500などがある。)
をコーテイングしたフイルムを使用し、熱成型時
の熱でフイルム相互間又はフイルムと電極が密着
するようにしたものである。尚、常温でも粘着性
を有する接着剤層を使用するとフイルム巻取り工
程等、熱成型以前の工程において著しく作業性及
び歩留まりを低下させる。
The present invention solves the above-mentioned conventional problems, and uses an adhesive layer (for example, polyalkylene terephthalate) that is non-adhesive at room temperature and sticky at temperatures above 60°C as a dielectric film or protective film. It is a modified ether type polyester resin whose main component is Vylon 300 and Vylon 500 manufactured by Toyobo Co., Ltd.)
This method uses films coated with , and the heat during thermoforming brings the films into close contact with each other or the film and the electrode. Note that if an adhesive layer that is sticky even at room temperature is used, workability and yield will be significantly reduced in the film winding process and other processes prior to thermoforming.

粘着性を示す温度を20〜100℃の範囲内で異な
る接着剤を調製し、それぞれをポリプロピレンフ
イルムに塗布して、接着剤層を形成した。これら
フイルムを巻取り機で捲回して、フイルムコンデ
ンサを作製し、その作業性について、接着剤層を
塗布形成していない通常のポリプロピレンフイル
ムを使用したときと同じ条件で比較検討した。こ
のときの作業性は、フイルムの蛇行による巻き乱
れの発生度合で評価した。その結果を第1図に示
す。これから明らかなように、粘着性を示す温度
が60℃以上である接着剤を使用した時に、接着剤
層を塗布形成していないポリプロピレンフイルム
を使用した時と同等の結果が得られた。
Different adhesives were prepared with adhesive temperatures ranging from 20 to 100°C, and each was applied to a polypropylene film to form an adhesive layer. Film capacitors were prepared by winding these films with a winder, and their workability was compared and studied under the same conditions as when a normal polypropylene film without an adhesive layer was used. The workability at this time was evaluated based on the degree of occurrence of disordered winding due to meandering of the film. The results are shown in FIG. As is clear from this, when using an adhesive whose tackiness temperature is 60°C or higher, the same results as when using a polypropylene film without an adhesive layer applied were obtained.

これは次の理由によると推測される。すなわち
接着剤層を塗布形成したフイルムを捲回すると、
巻取り機のローラとの摩擦係数が増大するので、
従来の方法に比べてローラとフイルムとの摩擦熱
が増大する。このとき、粘着性を示す温度が低い
接着剤を塗布したフイルムでは、その接着剤がロ
ーラに付着するなどして、フイルムの巻き乱れが
生じて、フイルムコンデンサの作製の作業性が低
下する。
This is presumed to be due to the following reason. In other words, when a film coated with an adhesive layer is rolled,
As the coefficient of friction with the winder roller increases,
The frictional heat between the roller and the film increases compared to the conventional method. At this time, in the case of a film coated with an adhesive having a low tackiness temperature, the adhesive adheres to the roller, resulting in disordered winding of the film, which reduces the workability of manufacturing the film capacitor.

室温度下において、従来のように接着剤層を塗
布形成していないポリプロピレンフイルムを捲回
するとき、フイルム温度は35〜40℃以下であつた
のに対し、接着剤層を塗布形成したポリプロピレ
ンフイルムを同条件下で捲回すると、ローラとの
摩擦熱が大きくなつて、フイルムの温度がほぼ60
℃に上昇するためである。尚、第1図中、イは従
来フイルム使用時の作業性100%の線を示す。
When winding a conventional polypropylene film without an adhesive layer applied at room temperature, the film temperature was below 35 to 40°C; When the film is wound under the same conditions, the frictional heat with the roller increases, and the temperature of the film reaches approximately 60°C.
This is because the temperature rises to ℃. In Fig. 1, A indicates the 100% workability line when using conventional film.

第2図は本発明の一実施例で、捲回型コンデン
サの素子1に対する外周保護フイルム2の材料と
して、本発明の常温非粘着で、且つ60℃で粘着性
を有する接着剤層3を表面にコーテイングしたフ
イルムを使用した場合の図である。
FIG. 2 shows an embodiment of the present invention, in which the adhesive layer 3 of the present invention, which is non-adhesive at room temperature and tacky at 60°C, is applied to the surface of the outer protective film 2 for the element 1 of a wound capacitor. FIG. 3 is a diagram showing a case where a film coated with

第3図はメタリコン工程におけるマスキングを
除去した後のフイルム剥離状態を示す図で、1は
素子、3は常温非粘着で且つ60℃で粘着性を有す
る接着剤層を示す。
FIG. 3 is a diagram showing the peeled state of the film after removing the masking in the metallicon process, where 1 indicates the element and 3 indicates the adhesive layer which is non-tacky at room temperature and tacky at 60°C.

以上のように本発明の常温非粘着で且つ60℃以
上で粘着性を有する接着剤層を表面にコーテイン
グしたフイルムを保護フイルムとして使用すれ
ば、フイルム剥離が大幅に低減され、後工程にお
ける作業性及び外観上の歩留まりに大きく貢献す
るようになつた。すなわち、保護フイルム剥離の
発生率は従来のフイルムを使用した場合は5.8%
だつたのに対し、本発明の接着剤層を表面にコー
テイングしたフイルムを使用した場合0.02%に低
減された、又、この常温非粘着で且つ60℃以上で
粘着性を有する接着剤層を巻始め部保護フイルム
及び誘電体フイルムにコーテイングして使用すれ
ば、メタリコン粒子のフイルム間隙への侵入によ
るコンデンサの短絡や誘電正接(TANΔ)悪化を
防止でき、第4図aで、イは本発明品、ロは従来
品を示す。又、外装樹脂の侵入による絶縁抵抗
(IR)の低下も防止可能となつた。第4図bでは
イの本発明品、ロは従来品を示す。本発明の構造
にすれば、常温非粘着で且つ60℃以上で粘着性を
有する接着剤層が含浸剤のかわりとなるため空気
間隙の少ない均一的な成型が可能となるため、静
電容量のバラツキが少なくコロナ開始電圧(第4
図c参照)及び短時間破壊電圧(第4図d参照)
が高く、さらに耐湿性の優れたコンデンサを提供
することができた。
As described above, if the film of the present invention whose surface is coated with an adhesive layer that is non-tacky at room temperature and tacky at 60°C or higher is used as a protective film, peeling of the film can be greatly reduced and workability in post-processing can be improved. And it has come to greatly contribute to the yield in terms of appearance. In other words, the incidence of protective film peeling is 5.8% when using conventional film.
On the other hand, when using the film coated with the adhesive layer of the present invention on the surface, it was reduced to 0.02%. If used by coating a protective film and a dielectric film, it is possible to prevent short circuits and deterioration of the dielectric loss tangent (T AN Δ) of the capacitor due to penetration of metallicon particles into gaps between the films. Product and B indicate the conventional product. In addition, it has become possible to prevent the insulation resistance (IR) from decreasing due to the intrusion of the exterior resin. In FIG. 4b, A shows a product of the present invention, and B shows a conventional product. With the structure of the present invention, the adhesive layer, which is non-tacky at room temperature and sticky at 60°C or higher, replaces the impregnating agent, allowing uniform molding with few air gaps, thereby reducing capacitance. Corona starting voltage (4th
(see figure c) and short-time breakdown voltage (see figure 4 d)
We were able to provide a capacitor with high moisture resistance and excellent moisture resistance.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は接着剤層の粘着性が発生する温度と、
熱成型工程以前の工程における作業性との関係を
示す図、第2図は本発明の常温非粘着で且つ60℃
以上で粘着性を有する接着剤層を、表面にコーテ
イングしたフイルムを捲回型コンデンサの保護フ
イルムとして使用したときの巻取り状態を示す斜
視図、第3図はメタリコン時のマスキングを除去
する際に保護フイルムが剥離した状態を示す斜視
図、第4図はコンデンサの一次特性を本発明品イ
と従来品ロと比較して示した図で、aは誘電正接
(TANΔ)、bは絶縁抵抗(IR)、cはコロナ開始
電圧、dは短時間破壊電圧を示す図である。 1……素子、2……保護フイルム、3……接着
剤層。
Figure 1 shows the temperature at which the adhesive layer becomes sticky, and
Figure 2 shows the relationship between workability and workability in processes before the thermoforming process.
The above is a perspective view showing the winding state when the film coated with the adhesive layer on the surface is used as a protective film for a wound type capacitor. Figure 4 is a perspective view showing the state in which the protective film has been peeled off, and Figure 4 is a diagram comparing the primary characteristics of the capacitor with the present invention product A and the conventional product B, where a is the dielectric loss tangent (T AN Δ) and b is the insulation value. It is a diagram showing the resistance (IR), c is the corona onset voltage, and d is the short-time breakdown voltage. 1... Element, 2... Protective film, 3... Adhesive layer.

Claims (1)

【特許請求の範囲】[Claims] 1 コンデンサにおける、誘電体相互間、又は保
護材料相互間の密着及び誘電体と電極の密着を目
的として、表面に、常温非粘着で且つ60℃以上で
粘着性を有する接着剤層をコーテイングしたプラ
スチツクフイルム、又は金属化プラスチツクフイ
ルム、又は絶縁紙、又は金属化絶縁紙を使用する
ことを特徴としたコンデンサ。
1 Plastic whose surface is coated with an adhesive layer that is non-adhesive at room temperature and sticky at 60°C or higher for the purpose of adhesion between dielectric materials or protective materials and adhesion between dielectric materials and electrodes in capacitors. A capacitor characterized by using a film, a metalized plastic film, an insulating paper, or a metalized insulating paper.
JP56109834A 1981-07-13 1981-07-13 Condenser Granted JPS5810813A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56109834A JPS5810813A (en) 1981-07-13 1981-07-13 Condenser

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56109834A JPS5810813A (en) 1981-07-13 1981-07-13 Condenser

Publications (2)

Publication Number Publication Date
JPS5810813A JPS5810813A (en) 1983-01-21
JPH0252420B2 true JPH0252420B2 (en) 1990-11-13

Family

ID=14520379

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56109834A Granted JPS5810813A (en) 1981-07-13 1981-07-13 Condenser

Country Status (1)

Country Link
JP (1) JPS5810813A (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5963713A (en) * 1982-10-04 1984-04-11 ニツセイ電機株式会社 Method of producing film condenser
JPS5963712A (en) * 1982-10-04 1984-04-11 ニツセイ電機株式会社 Method of producing film condenser
JPH0754781B2 (en) * 1985-02-25 1995-06-07 松下電器産業株式会社 Capacitor
JPS61194816A (en) * 1985-02-25 1986-08-29 松下電器産業株式会社 Capacitor
JPS61207009A (en) * 1985-03-12 1986-09-13 太陽通信工業株式会社 Manufacture of capacitor for high pressure

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4897045A (en) * 1972-03-24 1973-12-11
JPS4985546A (en) * 1972-12-23 1974-08-16
JPS50114566A (en) * 1974-02-26 1975-09-08
JPS50156658A (en) * 1974-06-08 1975-12-18
JPS5381942A (en) * 1976-12-20 1978-07-19 Marukon Denshi Kk Method of making capacitor
JPS53132755A (en) * 1977-04-22 1978-11-18 Matsushita Electric Industrial Co Ltd Laminated capacitor
JPS5412445A (en) * 1977-06-30 1979-01-30 Nichicon Capacitor Ltd Film capacitor
JPS5412444A (en) * 1977-06-30 1979-01-30 Nichicon Capacitor Ltd Film capacitor
JPS5928978B2 (en) * 1978-02-02 1984-07-17 松下電器産業株式会社 Double-sided lacquering/double-sided metallized film multilayer capacitor
JPS54113061A (en) * 1978-02-22 1979-09-04 Matsushita Electric Industrial Co Ltd Layerrbuilt capacitor
JPS54136648A (en) * 1978-04-14 1979-10-23 Fujitsu Ltd Method of producing film condensor
JPS56155525A (en) * 1980-05-02 1981-12-01 Unitika Ltd Plastic film capacitor
JPS5715412A (en) * 1980-06-30 1982-01-26 Unitika Ltd Plastic film capacitor

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Publication number Publication date
JPS5810813A (en) 1983-01-21

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