JPH0252441U - - Google Patents

Info

Publication number
JPH0252441U
JPH0252441U JP1988130489U JP13048988U JPH0252441U JP H0252441 U JPH0252441 U JP H0252441U JP 1988130489 U JP1988130489 U JP 1988130489U JP 13048988 U JP13048988 U JP 13048988U JP H0252441 U JPH0252441 U JP H0252441U
Authority
JP
Japan
Prior art keywords
capillary
bonding
wire bonding
view
tip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988130489U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988130489U priority Critical patent/JPH0252441U/ja
Publication of JPH0252441U publication Critical patent/JPH0252441U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図は本考案実施例のワイヤボンデイング用
キヤピラリの全体説明図、第２図ａは第１図のＡ
部分の拡大断面説明図、第２図ｂはワイヤボンデ
イング用キヤピラリの先端を示す平面説明図、第
３図は従来のワイヤボンデイング用キヤピラリの
説明図、第４図はボンデイング状態を示す側面説
明図、第５図は長尺のイメージセンサの平面説明
図、第６図はボンデイング状態を示す側面説明図
である。 １……キヤピラリ、４……テーパ部、６ａ，６
ｂ……面取り部、７……ボンデイング面。

Claims (1)

    【実用新案登録請求の範囲】
  1. 先端の外周形状をボンデイング方向に細長く形
    成したことを特徴とするワイヤボンデイング用キ
    ヤピラリ。
JP1988130489U 1988-10-06 1988-10-06 Pending JPH0252441U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988130489U JPH0252441U (ja) 1988-10-06 1988-10-06

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988130489U JPH0252441U (ja) 1988-10-06 1988-10-06

Publications (1)

Publication Number Publication Date
JPH0252441U true JPH0252441U (ja) 1990-04-16

Family

ID=31385704

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988130489U Pending JPH0252441U (ja) 1988-10-06 1988-10-06

Country Status (1)

Country Link
JP (1) JPH0252441U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011253875A (ja) * 2010-06-01 2011-12-15 Denso Corp ワイヤボンディング方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62256447A (ja) * 1986-04-28 1987-11-09 Mitsubishi Electric Corp ワイヤボンデイング用キヤピラリチツプ

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62256447A (ja) * 1986-04-28 1987-11-09 Mitsubishi Electric Corp ワイヤボンデイング用キヤピラリチツプ

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011253875A (ja) * 2010-06-01 2011-12-15 Denso Corp ワイヤボンディング方法

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