JPH025291B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for forming non-evaporated parts by scattering vapor-deposited metal in a metal-deposited film for a capacitor, which is manufactured by vapor-depositing metal on the surface of a plastic film, and an apparatus therefor. be.

In general, a metal-deposited film for capacitors is shaped like a long strip and has a non-deposited part of a constant width along the length at one end of the metal-deposited film. The capacitors are stacked and wound so that they are opposite to each other, and the ends with the vapor deposited layer are connected to the respective electrode lead-out parts, thereby forming a wound capacitor. Such non-evaporated portions along the length of the film can be relatively easily formed by masking during vapor deposition. In a wound type capacitor like the one above,
When a small dielectric breakdown occurs inside the element, the electrodes in that area scatter due to heat and have a self-healing effect that restores the insulation on their own, but when the dielectric breakdown is relatively large, cannot recover by itself, and there is a risk that the short-circuit current will concentrate at the breakdown point after passing through a wide range of electrodes, eventually leading to a fire. For this reason, it has been considered to divide the metal vapor deposited layer on the film into smaller areas to create a structure in which groups of small capacitance capacitors are placed in parallel. Figure 1 is an example of this. In the figure, 1 is a metallized film, 2 is a metallized layer, 3 is a non-deposited part along the length of the film, and 4 is a non-deposited part in the width direction of the film. Department.

With such a structure, in the section containing the part where dielectric breakdown has occurred, the short circuit current will flow into the breakdown point only from the end of the vapor-deposited metal on the connection side with the electrode lead-out part, so the current density will be extremely high. As a result, the vapor-deposited metal on the electrode lead-out part and the connection end of this part flies off, and the vapor-deposited metal in the section including the breakdown point is disconnected, and only this section is released from the capacitor, so the entire capacitor continues to function. can do.

As mentioned above, in order to divide the vapor-deposited metal on the film into small areas, it is necessary to form non-evaporated parts in the width direction of the film. Unlike the non-deposited portions in the longitudinal direction, they cannot be formed by masking during vapor deposition, so they must be formed by scattering the vapor-deposited metal after the vapor deposition process. A method for scattering vapor-deposited metal is to apply a voltage between a primary electrode and a secondary electrode that are in electrical contact with the vapor-deposited metal surface to generate spark discharge between the electrode and the vapor-deposited metal surface. However, it is difficult to continuously and efficiently form non-evaporated portions at intervals.

The present inventor has studied various methods for continuously and efficiently scattering deposited metal. For example, a plurality of electrode rods are arranged at intervals on the outer circumferential surface of a rotating drum, a voltage is applied to each two adjacent electrode rods, and the metal vapor deposited layer is placed on the outer circumferential surface of the rotating drum. A method of moving the vapor deposited film and scattering the vapor deposited metal by discharging each time two adjacent electrode rods having a potential difference contact the metal vapor deposition layer at the same time, or a method of dispersing the vapor deposited metal on the outer peripheral surface of a rotating drum. A voltage is applied between each of these electrode rods and a conductive guide roller that contacts the metal vapor deposited layer of the metal vapor deposited film at another location, and a discharge is generated each time the metal vapor deposited layer touches the electrode rod. This method involves scattering the vapor-deposited metal in that area. However, with these methods, the scattered metal powder adheres to the electrode rod, and as a result, the electrode rod is covered with metal oxide, resulting in loss of conductivity and uneven contact. It is difficult to stably and clearly form undeposited areas on a film with a length of .
According to the inventor's experience, the maximum length of treatment is 20 m, and the electrode rod had to be cleaned each time.

The present inventor has conducted further research based on the above circumstances, and as a result, has arrived at the present invention.

The first invention of the present application is a method of scattering vapor-deposited metal of a metal-deposited film for a capacitor to form a non-vapor-deposited part, in which a metal-deposited film is placed between a roller having protrusions on its outer peripheral surface and a conductive roller. is passed through with its vapor-deposited surface facing the conductive roller, and a voltage is applied between the conductive roller and the conductive material in contact with the vapor-deposited surface of the metal-deposited film at another point, and the A non-evaporated portion of a metal-deposited film for a capacitor, characterized in that the vapor-deposited surface of the metal-deposited film is partially brought into electrical contact with the conductive roller by a protrusion, thereby scattering the vapor-deposited metal in that part. Regarding the forming method.

A second invention of the present application is an apparatus for forming a non-vaporized portion by scattering vapor-deposited metal of a metal-deposited film for a capacitor, comprising a roller provided with protrusions on the outer peripheral surface, a conductive roller, and a conductor, The outer circumferential surfaces of the roller provided with protrusions on the outer circumferential surface and the conductive roller are adjacent to each other, and the metal vapor-deposited film can pass between these two rollers, and the metal vapor-deposited film is formed by the protrusions. The vapor-deposited surface of the film is partially arranged so that it can be electrically contacted with the conductive roller, and the conductor is arranged in other parts so that it can be contacted with the vapor-deposited surface of the metal-deposited film, and The present invention relates to an apparatus for forming a non-vapor deposited part of a metal deposited film for a capacitor, characterized in that a voltage can be applied between the roller and the conductor.

The present invention will be explained below with reference to the drawings.

FIG. 2 is a sectional view showing an embodiment of the apparatus according to the second invention of the present application and a method according to the first invention of the present application carried out using this apparatus. FIG. 3 is a perspective view showing parts of the device. In the figure,
Reference numeral 5 denotes a roller having protrusions on its outer circumferential surface. In this case, the protrusions are a plurality of thin rods 6 attached to the outer circumferential surface of the roller at intervals, as shown in FIG. There is. Reference numeral 7 denotes a conductive roller, and the roller 5, which has protrusions on its outer peripheral surface, and the conductive roller 7 are arranged with their outer peripheral surfaces adjacent to each other. Reference numeral 8 indicates an unwinding roll, and reference numeral 9 indicates a take-up roll. The metallized film 10 is passed between the roller 5 and the conductive roller 7 with its vapor-deposited surface 11 facing the conductive roller 7. be forced to pass. The metal-deposited film 10 is pushed toward the conductive roller 7 by a thin rod 6 protruding from the outer peripheral surface of the roller 5, and the metal-deposited film 10 is pushed toward the conductive roller 7 by a thin rod 6 protruding from the outer peripheral surface of the roller 5.
must be electrically accessible. Therefore, the roller 5 and the conductive roller 7 are
The metallized film can pass between the two rollers, and the rods 6 space the metallized film at a distance such that the deposition surface 11 of the metallized film can be brought into electrical contact with the partially conductive roller 7. If the rod 6 is made of an elastic material, the rod 6 and the conductive roller 7 may be in contact with each other when the film is not allowed to pass through. 12 is a guide roller. 1
Reference numeral 3 denotes a conductive guide roller, which is in contact with the vapor deposition surface 11 of the metal vapor deposited film 10. 14 is a power source, and a voltage is applied between the conductive roller 7 and the conductive guide roller 13. The power source may be an alternating current power source or a high frequency power source, but is preferably a direct current power source. Regarding the direction of potential, either the conductive roller 7 or the conductive guide roller 13 may be set to a high potential.

The metal vapor deposited film 10 unwound from the unwinding roll 8 has a vapor deposition surface 11 placed on a conductive guide roller 1.
3, passes between the roller 5 and the conductive roller 7 with the vapor deposition surface 11 facing the conductive roller 7, and is taken up by the take-up roll 9 via the guide roller 12. . When passing between the roller 5 and the conductive roller 7, the thin rod 6
The deposition surface 11 is thereby brought into electrical contact with the conductive roller 7. A voltage is applied between the conductive roller 7 and the conductive guide roller 13, and the vapor deposition surface 11 contacts the conductive roller 7 in an area smaller than the contact surface with the guide roller 13. , the current density is higher in the contact area with the conductive roller 7, and spark discharge occurs in this area,
The deposited metal is scattered along the length of the rod 6.

In the present invention, the roller 5 having protrusions on its outer circumferential surface preferably has a plurality of thin rods 6 attached at intervals and obliquely to the direction in which the metal-deposited film passes, as shown in FIG. Use a roller that has been fitted. If such a roller is used, the contact point between the vapor deposition surface 11 of the metal vapor deposited film and the conductive roller 7 moves along the rod 6,
Since point contact is made continuously, current is concentrated at the contact area, and the metal is more reliably scattered.
Clear non-evaporated areas can be formed. When a roller equipped with an obliquely inclined rod as shown in FIG. 4 is used, the metal-deposited film with non-deposited portions becomes as shown in FIG. 5. In FIG. 5, 15 is a metal-deposited film, 16 is a metal-deposited layer, 17 is a previously formed non-deposited part in the length direction of the film, and 18 is an oblique non-deposited part formed by an obliquely attached rod. Department. Although the angle of inclination of the rod is not particularly limited, it is sufficient that both ends of the rod are deviated by two to three times the diameter of the rod in order for the contact point between the vapor deposition surface 11 and the conductive roller 7 to move.

The size of the roller to which the rod is attached, the size of the rod, the spacing between the rods, etc. can be appropriately selected depending on the dimensions of the product. Usually, the width of the undeposited part in the width direction of the film is 0.1 to 2.0 mm, generally 0.3 mm.
~1.0 mm, so use a rod with a diameter larger than this. In addition, the width of the metal deposited surface divided by the non-deposited part is 10 to 100 mm, preferably
Since it is about 20 to 40 mm, the spacing between the rods is determined by this, but the spacing between the rods does not necessarily have to be constant. The material of the rod is preferably an insulating and elastic material, such as a synthetic resin or a material with an insulating coating on the metal surface, but particularly desirable is a fluorine-based resin such as polyvinylidene fluoride. .

The protrusion attached to the roller 5 is preferably a rod as described above, but it is also possible to use another form, for example, an elongated wedge-shaped protrusion. Any form may be used as long as it can form a non-evaporated portion on the film.

Although the roller 7 and the guide roller 13 need to be made of conductive materials, the materials of the other rollers and the like are not particularly limited. The guide roller 13 is in contact with the vapor deposition surface 11 of the metal vapor deposited film 10, and if the contact area is small, the vapor deposited metal is likely to scatter even in this contact area, so the rod 6
It is necessary to make the contact area with the guide roller 13 larger than the contact area with the roller 7, and it is desirable that the area ratio be about 100 to 200 times or more. It is also possible to use a plurality of conductive guide rollers 13. The voltage applied between the conductive roller 7 and the conductive guide roller 13 is
20V or more, usually about 30 to 50V is appropriate. still,
In order to apply a voltage to the metal vapor deposited layer, it is not necessarily necessary to use a conductive guide roller; instead, a conductive body can be used separately from the guide roller and the voltage can be applied while it is in contact with the metal vapor deposited layer. You can also do it.

The method of the present invention can be carried out without any restrictions regarding the moving speed of the metallized film 10. Therefore, the device according to the present invention can be installed adjacent to an element winding device in the process of manufacturing a wound type capacitor, so that the film formed on the non-evaporated portion can be immediately wound into the element. , or
It is installed integrally with a slitter machine used in the process where metallized film is manufactured and cut into product widths. It can be cut and rolled up. In such a case, the moving speed of the metallized film in the method of the present invention can be adjusted to the speed of element winding or the speed of the slitter machine, respectively.

Although the arrangement of each part of the device according to the present invention is not particularly limited, it is better to place the conductive roller 7 on the lower side than the roller 5 provided with protrusions to prevent metal powder adhering to the surface of the conductive roller 7. This is desirable because it is easy to clean with a brush, etc. In addition, a conductive guide roller 13
Alternatively, the other conductive material is placed on the unwinding roll 8 so as to be in contact with the metallized film before the non-deposited portion is formed.
and the roller 5.

Note that by disposing a roll brush adjacent to the conductive roller 7 and rotating it, metal adhering to the surface of the conductive roller 7 can be automatically removed. Further, in order to facilitate the work of removing the adhered metal, a conductive roller 7 having a conductive film wrapped around its surface may be used, and this film may be replaced. Alternatively, a plurality of conductive rollers 7 may be arranged in a turret arrangement, and one roller may be used while the other rollers are being used for cleaning.

The metal-deposited film on which the non-vapor-deposited portion is formed by the method of the present invention is usually a general dielectric film such as polyester, stretched polyprene, or polycarbonate, in which a metal such as aluminum or zinc is deposited. It can also be applied to various cases where non-evaporated parts are formed by scattering the metal deposited on the plastic film.
A desired non-evaporated portion can be formed depending on the protrusions provided on the roller 5.

According to the method and apparatus of the present invention, the metal vapor deposited layer of the metal vapor deposited film partially contacts the conductive roller surface and the metal is scattered, so when a thin electrode rod is brought into contact with the metal vapor deposited layer, the area is small. Compared to the scattered metal that adheres to the electrode surface in a concentrated manner, the scattered metal adheres partially to the conductive roller surface over a wide area, so even very long films can be continuously and stably maintained. Clear non-deposited areas can be formed and cleaning is easy. Furthermore, if a thin rod is used as a protrusion on the outer peripheral surface of the roller and is attached diagonally to the direction in which the metal-deposited film passes, electrical contact between the metal-deposited surface and the conductive roller can be made continuously along the rod. It is possible to form a clearer non-deposited area.

Example: Using the equipment shown in Figure 2, aluminum was vacuum-deposited on a polyester film with a width of 60 mm.
mm film, with a metallized film having a 2 mm non-deposited part along the length at one end.
A non-evaporated portion was formed in the width direction. As the roller 5, eight rods made of polyvinylidene fluoride and having a diameter of 2 mm were arranged at equal intervals on the outer peripheral surface of a roller having a diameter of 40 mm, so that half of the diameter of the rods protruded from the roller. In addition, the rod was attached diagonally by shifting both ends by 4 mm as shown in Figure 4.

When processing a length of 5000 m at a film moving speed of 150 m/min, the evaporation area was separated every 15.7 mm.
The film was divided into non-deposited areas with a width of 0.3 mm, and a film having the shape shown in FIG. 5 was obtained. The non-evaporated areas formed were clear, and the process was stable until the end.

[Brief explanation of drawings]

FIG. 1 is a partial plan view of a metal-deposited film in which the metal-deposited layer on the film is divided into small areas by non-deposited parts. FIG. 2 is a sectional view showing an embodiment of the device according to the present invention and the method according to the present invention carried out using this device, and FIGS. 3 and 4 are
3 is a perspective view showing a different configuration of the roller portion of the device of FIG. 2; FIG. FIG. 5 is a partial plan view of a metallized film having a non-deposited portion formed when the roller of the form shown in FIG. 4 is used. 1,15...Metal deposited film, 2,16...
Metal vapor-deposited layer, 3, 17... Non-evaporated part along the length direction of the film, 4, 18... Non-evaporated part along the width direction of the film, 5... Roller provided with protrusions, 6 ...rod, 7...conductive roller,
13... Conductive guide roller, 14... Power supply.

Claims (1)

[Claims] 1. In a method of scattering vapor-deposited metal of a metal-deposited film for a capacitor to form a non-vapor-deposited part, the metal-deposited film is disposed between a roller having protrusions on its outer peripheral surface and a conductive roller. is passed through with its vapor-deposited surface facing the conductive roller, and a voltage is applied between the conductive roller and the conductive material in contact with the vapor-deposited surface of the metal-deposited film at another point, and the A non-evaporated portion of a metal-deposited film for a capacitor, characterized in that the vapor-deposited surface of the metal-deposited film is partially brought into electrical contact with the conductive roller by a protrusion, thereby scattering the vapor-deposited metal in that part. Formation method. 2. The protrusion is a thin rod attached to the roller obliquely with respect to the passing direction of the metallized film, and the metallized film deposition surface and the conductive roller are connected continuously along the rod. A method for forming a non-vapor-deposited part of a metal-deposited film for a capacitor according to claim 1, wherein the non-vapor-deposited part is brought into point contact with the metal-deposited film for a capacitor. 3. An apparatus for forming a non-evaporated part by scattering vapor-deposited metal of a metal-deposited film for capacitors, which comprises a roller with protrusions on the outer circumferential surface, a conductive roller, and a conductor, and has protrusions on the outer circumferential surface. The outer peripheral surfaces of the roller provided with the conductive roller and the conductive roller are adjacent to each other,
The metal-deposited film can pass between these two rollers, and the protrusion allows the metal-deposited film to be partially electrically contacted with the conductive roller. A capacitor characterized in that the conductor is arranged so as to be able to come into contact with the deposition surface of the metal deposition film at another location, and a voltage can be applied between the conductive roller and the conductor. Equipment for forming non-evaporated parts of metal-deposited films. 4. The non-vapor deposited part forming apparatus of a metal deposited film for a capacitor according to claim 3, wherein the conductor is a conductive guide roller. 5. An apparatus for forming a non-vapor deposited part of a metal deposited film for a capacitor according to claim 3, wherein the protrusion is a thin rod. 6. The metallized film for capacitors according to claim 3, wherein the protrusions are a plurality of thin rods attached to the roller at intervals and obliquely with respect to the passing direction of the metallized film. Non-evaporated area forming device. 7. An apparatus for forming a non-evaporated portion of a metal-deposited film for a capacitor according to claim 5 or 6, wherein the rod is made of an insulating and elastic material.