JPH0253868U - - Google Patents
Info
- Publication number
- JPH0253868U JPH0253868U JP13239588U JP13239588U JPH0253868U JP H0253868 U JPH0253868 U JP H0253868U JP 13239588 U JP13239588 U JP 13239588U JP 13239588 U JP13239588 U JP 13239588U JP H0253868 U JPH0253868 U JP H0253868U
- Authority
- JP
- Japan
- Prior art keywords
- solder
- lifting
- carrier
- lead
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 9
- 238000005476 soldering Methods 0.000 claims description 3
- 230000001174 ascending effect Effects 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 4
- 230000009194 climbing Effects 0.000 description 3
- 230000000630 rising effect Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図ａは本考案の一実施例を示す側面図、第
１図ｂは本考案のコネクタリード部半田面離脱時
の説明図、第１図ｃは第１図ａのＢ部拡大図、第
１図ｄは第１図ｃの側面図、第２図ａは従来の半
田付方式を示す側面図、第２図ｂは従来方式のコ
ネクタリード部の半田面離脱時の説明図、第２図
ｃはＡ１，Ａ２の詳細図、第３図ａはリード部実
装基板正面図、第３図ｂはリード部実装基板側面
図、第４図ａは基板上昇方向を示すベクトル図、
第４図ｂは基板上昇方向の分解ベクトル図である
。
１……基板、２……キヤリア、３……基板搬送
用チエーン、３ａ……上昇用チエーン、４……半
田槽、５……半田、６……リード部品実装基板、
７……コネクタ、９……上昇レール、１０……酸
化膜、１１……上昇車輪、１２……リード、Ａ１
，Ａ２……基板実装キヤリア、θ１°……従来例
の上昇角度、θ２°……本考案の上昇角度、ｌ１
……従来例の上昇距離、ｌ２……本案の上昇距離
、ｘ……水平距離、Ｂ部……上昇車輪部。
FIG. 1a is a side view showing an embodiment of the present invention, FIG. 1b is an explanatory diagram of the present invention when the solder surface of the connector lead part is detached, FIG. 1c is an enlarged view of part B of FIG. 1a, Fig. 1 d is a side view of Fig. 1 c, Fig. 2 a is a side view showing the conventional soldering method, Fig. 2 b is an explanatory diagram when the soldering surface of the connector lead part of the conventional method is detached, and Fig. 2 Figure c is a detailed view of A 1 and A 2 , Figure 3 a is a front view of the lead part mounting board, Figure 3 b is a side view of the lead part mounting board, and Figure 4 a is a vector diagram showing the upward direction of the board.
FIG. 4b is an exploded vector diagram in the upward direction of the substrate. 1... Board, 2... Carrier, 3... Board transport chain, 3a... Lifting chain, 4... Solder tank, 5... Solder, 6... Lead component mounting board,
7... Connector, 9... Rising rail, 10... Oxide film, 11... Rising wheel, 12... Lead, A 1
, A 2 ... Board mounting carrier, θ 1 ° ... Rise angle of conventional example, θ 2 ° ... Rise angle of the present invention, l 1
... Climbing distance of the conventional example, l 2 ... Climbing distance of the present invention, x... Horizontal distance, Part B... Climbing wheel portion.
Claims (1)
長手方向に懸架し、該半田槽の上方に上昇するよ
うに配設した基板搬送用チエーン上に、リード部
品を実装した基板を、キヤリアにより移動中に該
リード部品のリードを半田槽にデイツピングする
ようにしたリード部分の半田付装置において、前
記半田槽の上昇用チエーンの傾斜角と、平行四辺
形の二辺をなす上昇レールと、該上昇レール上に
転動する上昇車輪をキヤリア後端部に設け、該キ
ヤリアを水平状態で急速上昇を行う手段を有する
ことを特徴とする、静止型半田槽におけるリード
部品実装基板上昇機構。 A board with lead components mounted thereon is suspended in the longitudinal direction parallel to the solder surface of a stationary solder tank with a gap therebetween, and is disposed so as to rise above the solder tank. In a lead part soldering device that dips the leads of the lead component into a solder bath while being moved by a carrier, the inclination angle of the ascending chain of the solder bath and the ascending rails forming two sides of a parallelogram are determined. A mechanism for lifting a lead component mounted board in a stationary solder tank, characterized in that a lifting wheel that rolls on the lifting rail is provided at the rear end of the carrier, and means for rapidly lifting the carrier in a horizontal state.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13239588U JPH0253868U (en) | 1988-10-12 | 1988-10-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13239588U JPH0253868U (en) | 1988-10-12 | 1988-10-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0253868U true JPH0253868U (en) | 1990-04-18 |
Family
ID=31389316
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13239588U Pending JPH0253868U (en) | 1988-10-12 | 1988-10-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0253868U (en) |
-
1988
- 1988-10-12 JP JP13239588U patent/JPH0253868U/ja active Pending
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