JPH0254004B2 - - Google Patents

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Publication number
JPH0254004B2
JPH0254004B2 JP59204464A JP20446484A JPH0254004B2 JP H0254004 B2 JPH0254004 B2 JP H0254004B2 JP 59204464 A JP59204464 A JP 59204464A JP 20446484 A JP20446484 A JP 20446484A JP H0254004 B2 JPH0254004 B2 JP H0254004B2
Authority
JP
Japan
Prior art keywords
metal
ceramic member
holes
metallized film
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59204464A
Other languages
Japanese (ja)
Other versions
JPS6185003A (en
Inventor
Kenji Itakura
Tadashi Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP59204464A priority Critical patent/JPS6185003A/en
Publication of JPS6185003A publication Critical patent/JPS6185003A/en
Publication of JPH0254004B2 publication Critical patent/JPH0254004B2/ja
Granted legal-status Critical Current

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  • Insulating Bodies (AREA)
  • Installation Of Indoor Wiring (AREA)

Description

【発明の詳細な説明】 〔発明の技術分野〕 本発明はセラミツク部材に多数の金属棒を貫通
してなる封着構造体およびその製造方法に関す
る。
DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a sealing structure formed by penetrating a ceramic member with a large number of metal rods, and a method for manufacturing the same.

〔発明の技術的背景とその問題点〕[Technical background of the invention and its problems]

高温圧力容器においてその内外部を連絡する封
着構造体、例えば導電貫通路構造体として第6図
および第7図で示す構造のものが用いられてい
る。すなわち、ステンレス鋼などの金属からなる
円筒状の金属筒体3には円板状をなす2個のセラ
ミツクス部材1が間隔を存して嵌合してあり、こ
れらセラミツクス部材1には金属棒4を通すため
の多数の透孔2が並べて形成してある。セラミツ
クス部材1の各透孔2には、金属棒4を挿通する
ための透孔5aを形成したコバール合金などの封
着合金からなる金属キヤツプ5が被せてあり、こ
れら金属キヤツプ5とセラミツクス部材1とが接
合されている。金属キヤツプ5をセラミツクス部
材1に接合するためには、セラミツクス部材1の
表面上の透孔2囲りに、モリブデンなどの金属膜
6とニツケルなどのメツキ膜7とからなるメタラ
イズ膜8を形成し、金属キヤツプ5とメタライズ
膜8との接触部をろう付けにより接合固定する。
金属棒4は各セラミツクス部材1の透孔2と金属
キヤツプ5の透孔5aに挿通してあり、金属棒4
と金属キヤツプ5との接触部がろう付けにより接
合固定されている。金属棒4及び金属キヤツプ5
はコバール合金などから形成される。なお、セラ
ミツクス部材1と金属筒体3との接合部にはコバ
ール合金などからなる金属環9が設けられ、この
金属環9がセラミツクス部材1と金属筒体3にろ
う付けにより接合固定してある。
2. Description of the Related Art In a high-temperature pressure vessel, a sealing structure, for example, a conductive through-path structure, which communicates the inside and outside of the vessel, is used as shown in FIGS. 6 and 7. That is, two disc-shaped ceramic members 1 are fitted with a gap between them into a cylindrical metal cylinder body 3 made of metal such as stainless steel, and a metal rod 4 is fitted into these ceramic members 1. A large number of through holes 2 are formed side by side for passing through. Each through hole 2 of the ceramic member 1 is covered with a metal cap 5 made of a sealing alloy such as Kovar alloy, which has a through hole 5a through which the metal rod 4 is inserted. are joined. In order to bond the metal cap 5 to the ceramic member 1, a metallized film 8 consisting of a metal film 6 such as molybdenum and a plating film 7 such as nickel is formed around the through hole 2 on the surface of the ceramic member 1. The contact portion between the metal cap 5 and the metallized film 8 is bonded and fixed by brazing.
The metal rod 4 is inserted through the through hole 2 of each ceramic member 1 and the through hole 5a of the metal cap 5.
The contact portion between the metal cap 5 and the metal cap 5 is bonded and fixed by brazing. Metal rod 4 and metal cap 5
is made of Kovar alloy or the like. Note that a metal ring 9 made of Kovar alloy or the like is provided at the joint between the ceramic member 1 and the metal cylinder 3, and this metal ring 9 is bonded and fixed to the ceramic member 1 and the metal cylinder 3 by brazing. .

そして、この封着構造体は例えば高温圧力容器
に取付け、金属棒4を導電通路として使用され
る。
Then, this sealed structure is attached to, for example, a high temperature pressure vessel, and the metal rod 4 is used as a conductive path.

次に封着構造体を製造するに際して、セラミツ
クス部材1は次の方法により製造している。焼結
して得たセラミツクス焼結体に械加工により多数
の透孔2を形成し、次にスクリーン印刷によりセ
ラミツクス焼結体の表面上の各透孔2囲りに円形
状の金属膜6を形成し、その後に各金属膜6をリ
ード線で接続して電気メツキにより各金属膜6上
にメツキ膜7を形成してセラミツクス部材1を製
造する。
Next, when manufacturing the sealed structure, the ceramic member 1 is manufactured by the following method. A large number of through holes 2 are formed in the ceramic sintered body obtained by sintering by machining, and then a circular metal film 6 is formed around each through hole 2 on the surface of the ceramic sintered body by screen printing. After that, each metal film 6 is connected with a lead wire, and a plating film 7 is formed on each metal film 6 by electroplating to manufacture the ceramic member 1.

なお、封着構造体は第8図で示す組立て治具を
用いて組立てる。各セラミツクス部材1を金属環
9と組合せて基台21A上に重ねて配置し、上側
のセラミツクス部材1を持上げ分割形の筒状スペ
ーサ22により両セラミツクス部材1を位置決め
する。各セラミツクス部材1の透孔2に金属棒4
を挿通する。上側のセラミツクス部材1に金属ギ
ヤツプ5用および金属環9用のろう材を配置し、
このセラミツクス部材1から突出する金属棒4の
部分に金属キヤツプ5および位置決めパイプ23
を嵌合する。基台11Bをセラミツクス部材1上
に配置し、基台21Bに形成した位置決め孔21
aに金属棒4に嵌合した位置決めパイプ23を挿
入して金属棒4を位置決めする。各セラミツクス
部材1に外筒24を被せ基台21B上に治具台2
5を載せる。基台21Aを取外して組立体全を上
下逆向きにして同様の作業を繰り返す。組立て終
了後はろう付炉にてろう付けを行なう。
Note that the sealing structure is assembled using an assembly jig shown in FIG. Each ceramic member 1 is combined with a metal ring 9 and placed on a base 21A, and the upper ceramic member 1 is lifted and both ceramic members 1 are positioned using a split cylindrical spacer 22. A metal rod 4 is inserted into the through hole 2 of each ceramic member 1.
Insert. Place the brazing filler metal for the metal gap 5 and the metal ring 9 on the upper ceramic member 1,
A metal cap 5 and a positioning pipe 23 are attached to the metal rod 4 protruding from the ceramic member 1.
mate. The base 11B is placed on the ceramic member 1, and the positioning hole 21 formed in the base 21B is
The positioning pipe 23 fitted to the metal rod 4 is inserted into a to position the metal rod 4. Cover each ceramic member 1 with the outer cylinder 24 and place the jig stand 2 on the base 21B.
Put 5. Remove the base 21A, turn the entire assembly upside down, and repeat the same operation. After assembly is complete, brazing is performed in a brazing furnace.

しかして、このような従来の封着構造体におい
ては次のような問題がある。封着構造体を電線貫
通路として使用し金属棒4に電流を流す場合に
は、各金属棒4間を電気的に絶縁するために各メ
タライズ膜8間の絶縁距離を充分確保する必要が
ある。しかしながらセラミツクス部材1には多数
の金属棒4を並べて貫通するために、各透孔2の
間の間隔が小さくセラミツクス部材1表面の各透
孔2の囲りに形成する各メタライズ膜8の間隔l
も大変小さくなる。このため、各メタライズ膜8
間の絶縁距離は最小限の大きさ程度しか確保でき
ず、しかも製造上の誤差により透孔2およびメタ
ライズ膜8の寸法にバラツキを生じて各メタライ
ズ膜8間の間隔寸法が縮小することがあり、この
場合には各メタライズ膜8間の最小絶縁距離を確
保できず各金属棒4を電気的に絶縁できなくな
る。なお、この対策としてメタライズ膜8の直径
を小さくすることが考えられるが、この場合には
金属キヤツプ5とメタライズ膜8とのろう付けが
不充分となり両者の接合強度が低下する。
However, such conventional sealing structures have the following problems. When using the sealed structure as a wire through-hole and passing current through the metal rods 4, it is necessary to ensure a sufficient insulation distance between each metallized film 8 in order to electrically insulate each metal rod 4. . However, since a large number of metal rods 4 are lined up and penetrated through the ceramic member 1, the intervals between the through holes 2 are small, and the intervals l between the metallized films 8 formed around the through holes 2 on the surface of the ceramic member 1 are small.
will also become very small. For this reason, each metallized film 8
The insulation distance between the two metallized films 8 can only be kept to a minimum level, and manufacturing errors may cause variations in the dimensions of the through holes 2 and the metallized films 8, resulting in a reduction in the distance between the metalized films 8. In this case, the minimum insulation distance between each metallized film 8 cannot be ensured, and each metal rod 4 cannot be electrically insulated. Note that as a countermeasure to this problem, reducing the diameter of the metallized film 8 may be considered, but in this case, the brazing between the metal cap 5 and the metallized film 8 will be insufficient, and the bonding strength between the two will be reduced.

またセラミツクス部材1の製造においては、メ
タライズ膜8を形成するために各透孔2毎に個別
に金属膜6およびメツキ膜7を形成するので、メ
タライズ膜形成作業が大変面倒である。
Furthermore, in manufacturing the ceramic member 1, in order to form the metallized film 8, the metal film 6 and the plating film 7 are individually formed for each through hole 2, so the work of forming the metallized film is very troublesome.

〔発明の目的〕[Purpose of the invention]

本発明は前記事情に基づいてなされたもので、
電気的絶縁性に優れて信頼性が高く、しかも容易
に製造できる封着構造体およびその製造方法を提
供することを目的とする。
The present invention was made based on the above circumstances, and
It is an object of the present invention to provide a sealed structure that has excellent electrical insulation properties, is highly reliable, and can be easily manufactured, and a method for manufacturing the same.

〔発明の概要〕[Summary of the invention]

本発明の封着構造体は、複数の透孔を設けたセ
ラミツクス部材の表面においてメタライズ膜を形
成する各透孔の周縁部を除いて各透孔の間に凹部
を形成したことを特徴とするもので、この凹部の
存在により各メタライズ膜間に充分な絶縁距離を
確保することができる。
The sealing structure of the present invention is characterized in that, on the surface of a ceramic member provided with a plurality of through holes, recesses are formed between each through hole except for the periphery of each through hole where a metallized film is formed. Due to the presence of this recess, a sufficient insulation distance can be secured between each metallized film.

また本発明による封着構造体の製造方法は、セ
ラミツクス焼結体の表面全体にメタライズ膜を形
成し、その後セラミツクス焼結体に透孔および各
透孔間の凹部を形成することにより不要なメタラ
イズ膜部分を除去してセラミツクス部材を製造す
ることを特徴とするもので、メタライズ膜を容易
に形成することができる。
In addition, the method for manufacturing a sealed structure according to the present invention involves forming a metallized film on the entire surface of a ceramic sintered body, and then forming through holes and recesses between the through holes in the ceramic sintered body, thereby eliminating unnecessary metallization. This method is characterized in that the ceramic member is manufactured by removing the film portion, and the metallized film can be easily formed.

〔発明の実施例〕[Embodiments of the invention]

以下本発明を図面で示す一実施例について説明
する。
An embodiment of the present invention illustrated in the drawings will be described below.

第1図ないし第3図は本発明の封着構造体を組
込んだ一実施例を示すもので、第6図と同一部分
は同一符号を付している。すなわち1はセラミツ
クス部材、2は透孔、3は金属筒体、4は金属
棒、8は金属膜6およびメツキ膜7からなるメタ
ライズ膜、9は金属環である。
1 to 3 show an embodiment incorporating the sealing structure of the present invention, and the same parts as in FIG. 6 are given the same reference numerals. That is, 1 is a ceramic member, 2 is a through hole, 3 is a metal cylinder, 4 is a metal rod, 8 is a metallized film consisting of a metal film 6 and a plating film 7, and 9 is a metal ring.

セラミツクス部材1の表面において各透孔2の
間には、メタライズ膜8を形成する各透孔2の周
縁部2aを除いた部分に凹部10が形成されてい
る。各透孔2の周縁部2aの表面には透孔2の開
口を囲んでメタライズ膜8が形成してある。な
お、透孔2の周縁部2aの直径はメタライズ膜8
と金属座11とが充分ろう付けできる大きさであ
る。このためメタライズ膜8が形成された各透孔
2の周縁部2aは凹部10を介して隣り合うこと
になる。また各透孔2の周縁部2aのメタライズ
膜8上には、コバール合金などの合金で形成され
た透孔11aを有する円板状の金属座11が配置
してあり、この金属座11とメタライズ膜8との
接合部はろう付けにより固定されている。金属棒
4はこの金属座11の透孔11aとセラミツクス
部材1の透孔2を挿通しており、金属棒4と金属
座11との接合部はろう付けにより固定されてい
る。
A recess 10 is formed between the through holes 2 on the surface of the ceramic member 1 except for the peripheral edge 2 a of each through hole 2 forming the metallized film 8 . A metallized film 8 is formed on the surface of the peripheral edge 2 a of each through hole 2 so as to surround the opening of the through hole 2 . Note that the diameter of the peripheral edge 2a of the through hole 2 is equal to the diameter of the metallized film 8.
The size is such that the metal seat 11 and the metal seat 11 can be sufficiently brazed together. Therefore, the peripheral edges 2a of the through holes 2 on which the metallized film 8 is formed are adjacent to each other with the recess 10 interposed therebetween. Further, on the metallized film 8 at the peripheral edge 2a of each through hole 2, a disk-shaped metal seat 11 having a through hole 11a formed of an alloy such as Kovar alloy is arranged. The joint with the membrane 8 is fixed by brazing. The metal rod 4 is inserted through the through hole 11a of the metal seat 11 and the through hole 2 of the ceramic member 1, and the joint between the metal rod 4 and the metal seat 11 is fixed by brazing.

このような構造において、セラミツクス部材1
の表面にて各透孔2の囲りに形成された各メタラ
イズ膜8の間の絶縁距離は、隣り合う各透孔2の
周縁部2aの間の水平間隔lと、各透孔周縁部2
aの高さ(凹部10の深さ)l′×2とを加えた大
きさとなる。ここで、lは従来における各メタラ
イズ膜8間の間隔lと同じである。このため、本
発明では各メタライズ膜8の間の絶縁距離は従来
に比して2×l′分だけ大きくなり、各メタライズ
膜8間で充分絶縁距離を確保できる。そして、製
作上の誤差により各メタライズ膜8の寸法にバラ
ツキを生じて間隔lが縮小しても、l′×2の存在
により必要な絶縁距離を確保できる。
In such a structure, the ceramic member 1
The insulation distance between each metallized film 8 formed around each through hole 2 on the surface of
The size is the sum of the height of a (the depth of the recess 10) l'×2. Here, l is the same as the spacing l between each metallized film 8 in the prior art. Therefore, in the present invention, the insulation distance between each metallized film 8 is increased by 2×l' compared to the conventional method, and a sufficient insulation distance can be ensured between each metallized film 8. Even if the distance l is reduced due to variations in the dimensions of each metallized film 8 due to manufacturing errors, the necessary insulation distance can be secured due to the existence of l'×2.

次に本発明の製造方法によりセラミツクス部材
1を製造する場合について説明する。
Next, the case where the ceramic member 1 is manufactured by the manufacturing method of the present invention will be explained.

まず、第4図で示すように焼結により円板状の
セラミツクス焼結体1′を得る。次にセラミツク
ス焼結体1′の表面全体にスクリーン印刷で金属
膜6を形成するとともに、金属膜6の全面にメツ
キ膜7を形成してメタライズ膜8を形成する。そ
の後に超音波加工によりセラミツクス焼結体1′
に各透孔2を形成するとともに、各透孔2の周縁
部2aを残して各透孔2間に凹部10を形成す
る。これによりセラミツクス焼結体1′の表面全
体に形成したメタライズ膜8における凹部10に
面する部分が除去され、各透孔2の周縁部2a上
に面する部分のみが残される。
First, as shown in FIG. 4, a disk-shaped ceramic sintered body 1' is obtained by sintering. Next, a metal film 6 is formed on the entire surface of the ceramic sintered body 1' by screen printing, and a plating film 7 is formed on the entire surface of the metal film 6 to form a metallized film 8. After that, the ceramic sintered body 1' is made by ultrasonic processing.
The through holes 2 are formed in the holes 2, and the recesses 10 are formed between the through holes 2, leaving the peripheral edge 2a of each through hole 2. As a result, the portion of the metallized film 8 formed on the entire surface of the ceramic sintered body 1' facing the recess 10 is removed, leaving only the portion facing the peripheral edge 2a of each through hole 2.

このようにしてセラミツクス部材1を製造する
ことによりメタライズ膜8を各透孔2毎に形成す
る場合に比して容易に形成できる。また超音波加
工により透孔2を精度良く形成できる。
By manufacturing the ceramic member 1 in this manner, the metallized film 8 can be formed more easily than in the case where the metallized film 8 is formed for each through hole 2. Further, the through hole 2 can be formed with high accuracy by ultrasonic processing.

なお、封着構造体は第5図で示す治具を用いて
組立てる。図中31はカーボンからなる円筒状の
支持治具で、円筒を軸方向に沿い2分割した分割
体31A,31Bを組合せて構成され、内周両端
部には支持溝31a,31aが形成されている。
セラミツクス部材1を金属環9と組合せて支持治
具31の支持溝31a,31aに嵌め込み、セラ
ミツクス部材1を位置決めする。支持治具31の
外側にカーボンからなる外筒32を嵌合する。こ
れまで組立てたものを垂直にして支持台33上に
載せる。各セラミツクス部材1の各透孔2に金属
棒4を挿通する。上側のセラミツクス部材1に金
属座11用および金属環9用ろう材を置き、この
セラミツクス部材1から突出する金属棒4の部分
に金属座11および押えパイプ34を嵌合する。
組立体の下部から治具台33を外して組立体の上
部に被せる。組立体を上下逆向きにして前記と同
じ組立作業を行なう。組立終了後組立体をろう付
炉に入れてろう付けを行なう。なお、外筒32は
すり割り32aを形成してろう付け時の熱による
収縮を逃げる。ろう付けの後に外筒32および支
持治具31を取り外す。
Note that the sealing structure is assembled using a jig shown in FIG. In the figure, reference numeral 31 denotes a cylindrical support jig made of carbon, which is constructed by combining divided bodies 31A and 31B obtained by dividing a cylinder into two along the axial direction, and support grooves 31a and 31a are formed at both ends of the inner circumference. There is.
The ceramic member 1 is combined with the metal ring 9 and fitted into the support grooves 31a, 31a of the support jig 31 to position the ceramic member 1. An outer cylinder 32 made of carbon is fitted to the outside of the support jig 31. Place what has been assembled so far on the support stand 33 vertically. A metal rod 4 is inserted into each through hole 2 of each ceramic member 1. A brazing material for the metal seat 11 and the metal ring 9 is placed on the upper ceramic member 1, and the metal seat 11 and the holding pipe 34 are fitted into the portion of the metal rod 4 protruding from the ceramic member 1.
The jig stand 33 is removed from the bottom of the assembly and placed over the top of the assembly. Perform the same assembly process as above with the assembly upside down. After assembly is completed, the assembly is placed in a brazing furnace and brazed. Note that the outer cylinder 32 forms a slot 32a to escape shrinkage due to heat during brazing. After brazing, the outer cylinder 32 and the support jig 31 are removed.

この組立作業は、セラミツクス部材1の透孔2
が超音波加工により精度良く形成されているため
に、従来の組立作業にて使用した基台11A,1
1Bを用いずに金属棒4をセラミツクス部材1の
透孔2に挿通するだけで金属棒4を正確に位置決
めすることができる。
This assembly work consists of the through hole 2 of the ceramic member 1.
The bases 11A and 1 used in conventional assembly work are formed with high precision by ultrasonic processing.
The metal rod 4 can be accurately positioned simply by inserting the metal rod 4 into the through hole 2 of the ceramic member 1 without using the metal rod 1B.

〔発明の効果〕〔Effect of the invention〕

以上説明したように本発明の封着構造体によれ
ば、複数の透孔を設けたセラミツクス部材の表面
に各透孔の開口を囲んでメタライズ膜を形成する
とともに、各透孔のメタライズ膜に金属座を接合
し、さらにセラミツクス部材の表面にメタライズ
膜を形成した各透孔の周縁部を残して各透孔の間
に凹部を形成することにより、各透孔のメタライ
ズ膜の間の絶縁距離を長くして、セラミツクス部
材の各透孔に挿通する各金属棒の間の絶縁を充分
に確保することができる。また、金属座の採用に
より金属座をセラミツクス部材のメタライズ膜に
強固に接合できるとともに、金属棒を金属座に強
固に接合でき、結果として金属棒をセラミツクス
部材に強固に接合できる。また、超音波加工の採
用によりセラミツクス部材を容易に製造すること
ができる。
As explained above, according to the sealing structure of the present invention, a metallized film is formed on the surface of a ceramic member provided with a plurality of through holes, surrounding the opening of each through hole, and a metallized film of each through hole is formed. The insulation distance between the metallized films of each through hole can be reduced by bonding the metal seat and forming a recess between each through hole, leaving the periphery of each through hole with a metallized film formed on the surface of the ceramic member. By increasing the length of the metal rods, sufficient insulation can be ensured between the metal rods inserted into the through holes of the ceramic member. Further, by employing the metal seat, the metal seat can be firmly bonded to the metallized film of the ceramic member, and the metal bar can be firmly bonded to the metal seat, and as a result, the metal bar can be firmly bonded to the ceramic member. Further, by employing ultrasonic processing, ceramic members can be easily manufactured.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図ないし第5図は本発明の一実施例を示す
もので、第1図および第2図は封着構造体を示す
縦断面図および平面図、第3図はセラミツクス部
材と金属棒との接合部を拡大して示す断面図、第
4図a,bはセラミツクス部材の製造方法を示す
説明図、第5図a,bは封着構造体の組立時を示
す縦断面図および平面図、第6図ないし第8図は
従来例を示すもので、第6図は封着構造体を示す
縦断面図、第7図はセラミツクス部材と金属棒と
の接合部を拡大して示す断面図、第8図は封着構
造体の組立時を示す縦断面図である。 1……セラミツクス部材、2……透孔、3……
金属筒体、4……金属棒、5……金属ギヤツプ、
6……金属膜、7……メツキ膜、8……メタライ
ズ膜、9……金属環、10……凹部、11……金
属座。
1 to 5 show an embodiment of the present invention. FIGS. 1 and 2 are longitudinal cross-sectional views and plan views showing a sealing structure, and FIG. 3 is a diagram showing a ceramic member and a metal rod. FIGS. 4a and 4b are explanatory diagrams showing the method of manufacturing the ceramic member, and FIGS. 5a and 5b are longitudinal sectional views and plan views showing the sealing structure when assembled. , FIGS. 6 to 8 show conventional examples, in which FIG. 6 is a longitudinal sectional view showing a sealing structure, and FIG. 7 is an enlarged sectional view showing a joint between a ceramic member and a metal rod. , FIG. 8 is a longitudinal cross-sectional view showing the sealing structure when assembled. 1...Ceramics member, 2...Through hole, 3...
Metal cylindrical body, 4...metal rod, 5...metal gap,
6...metal film, 7...plated film, 8...metalized film, 9...metal ring, 10...recess, 11...metal seat.

Claims (1)

【特許請求の範囲】 1 複数の透孔を有するセラミツクス部材と、こ
のセラミツクス部材の前記各透孔の開口を囲んで
形成したメタライズ膜に接合され且つ前記セラミ
ツクス部材の透孔に対応する透孔を有する複数の
金属座と、前記セラミツクス部材の各透孔および
これら各透孔の開口を囲んで形成した前記メタラ
イズ膜に接合された前記各金属座の透孔に挿通さ
れて前記セラミツクス部材および金属座に接合さ
れた複数の金属棒とを具備し、前記セラミツクス
部材の表面には、前記メタライズ膜を形成した前
記各透孔の周縁部を残して前記各透孔の間に凹部
が形成されていることを特徴とする封着構造体。 2 セラミツクス焼結体の表面全体にメタライズ
膜を形成し、次いで超音波加工により前記セラミ
ツクス焼結体に複数の透孔を形成するとともに、
前記セラミツクス焼結体の表面に前記複数の透孔
の周縁部を除いて前記複数の透孔の間に超音波加
工により凹部を形成して、この凹部に面した前記
メタライズ膜を除去することによりセラミツクス
部材を製造する工程を具備することを特徴とする
封着構造体の製造方法。
[Scope of Claims] 1. A ceramic member having a plurality of through holes, and a metallized film formed surrounding the openings of each of the through holes of this ceramic member, and having through holes corresponding to the through holes of the ceramic member. The ceramic member and the metal seats are inserted into the through holes of each of the metal seats bonded to each through hole of the ceramic member and the metallized film formed surrounding the opening of each of these through holes. a plurality of metal rods joined to the ceramic member, and a recess is formed on the surface of the ceramic member between each of the through holes, leaving a peripheral edge of each of the through holes in which the metallized film is formed. A sealed structure characterized by: 2. Forming a metallized film on the entire surface of the ceramic sintered body, and then forming a plurality of through holes in the ceramic sintered body by ultrasonic processing,
By forming recesses on the surface of the ceramic sintered body by ultrasonic machining between the plurality of through-holes except for the peripheral edges of the plurality of through-holes, and removing the metallized film facing the recesses. 1. A method for manufacturing a sealed structure, comprising a step of manufacturing a ceramic member.
JP59204464A 1984-09-29 1984-09-29 Sealing structure and manufacture thereof Granted JPS6185003A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59204464A JPS6185003A (en) 1984-09-29 1984-09-29 Sealing structure and manufacture thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59204464A JPS6185003A (en) 1984-09-29 1984-09-29 Sealing structure and manufacture thereof

Publications (2)

Publication Number Publication Date
JPS6185003A JPS6185003A (en) 1986-04-30
JPH0254004B2 true JPH0254004B2 (en) 1990-11-20

Family

ID=16490966

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59204464A Granted JPS6185003A (en) 1984-09-29 1984-09-29 Sealing structure and manufacture thereof

Country Status (1)

Country Link
JP (1) JPS6185003A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5072289B2 (en) * 2006-08-30 2012-11-14 京セラ株式会社 Airtight terminal
JP7237546B2 (en) * 2018-11-29 2023-03-13 株式会社東芝 Electric wiring penetration device and manufacturing method thereof

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59106815A (en) * 1982-12-10 1984-06-20 株式会社明電舎 Insulator for high voltage conductor

Also Published As

Publication number Publication date
JPS6185003A (en) 1986-04-30

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