JPH0254287U - - Google Patents
Info
- Publication number
- JPH0254287U JPH0254287U JP13356288U JP13356288U JPH0254287U JP H0254287 U JPH0254287 U JP H0254287U JP 13356288 U JP13356288 U JP 13356288U JP 13356288 U JP13356288 U JP 13356288U JP H0254287 U JPH0254287 U JP H0254287U
- Authority
- JP
- Japan
- Prior art keywords
- electronics modules
- electronic device
- electronics
- cooling
- partition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 claims description 5
- 238000005192 partition Methods 0.000 claims description 2
- 239000003507 refrigerant Substances 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図は、この考案の実施例を示す一部断面図
、第２図は、実装状態の電子機器を示す断面図、
第３図は、第２図の横断面図、第４図、第５図、
第６図は、従来の実施例を示す同様な図である。
図に於て、１はエレクトロニクスモジユール、
２は冷却ダクト平板部、３は冷却ダクト口金部、
４はエレクトロニクス発熱体、５ａ，５ｂはマニ
ホルド、６は仕切り、７は突起である。尚、図中
、同一或いは相当部分には同一符号を付して示し
てある。
FIG. 1 is a partial sectional view showing an embodiment of this invention, FIG. 2 is a sectional view showing an electronic device in a mounted state,
Figure 3 is a cross-sectional view of Figure 2, Figure 4, Figure 5,
FIG. 6 is a similar diagram showing a conventional embodiment. In the figure, 1 is the electronics module,
2 is a cooling duct flat plate part, 3 is a cooling duct mouthpiece part,
4 is an electronic heating element, 5a and 5b are manifolds, 6 is a partition, and 7 is a projection. In the drawings, the same or corresponding parts are designated by the same reference numerals.
Claims (1)
ユールを備えた電子機器に於て、中空直方体の複
数のエレクトロニクスモジユールと、これらエレ
クトロニクスモジユールに挾まれて位置し、内部
に、規則的に配列された多数の突起を有する仕切
りによつて分けられた２つの冷媒流路を持ち、冷
媒循環時に内圧により変形してエレクトロニクス
モジユールに接して冷却作用を行う冷却ダクトと
を備えたことを特徴とする電子機器。 In an electronic device equipped with a plurality of electronics modules that require cooling, a plurality of hollow rectangular parallelepiped electronics modules and a large number of regularly arranged electronics modules located between these electronics modules are used. An electronic device characterized by having two refrigerant flow paths separated by a partition having protrusions, and a cooling duct that deforms due to internal pressure during refrigerant circulation and performs a cooling action in contact with an electronics module. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13356288U JPH0254287U (en) | 1988-10-13 | 1988-10-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13356288U JPH0254287U (en) | 1988-10-13 | 1988-10-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0254287U true JPH0254287U (en) | 1990-04-19 |
Family
ID=31391538
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13356288U Pending JPH0254287U (en) | 1988-10-13 | 1988-10-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0254287U (en) |
-
1988
- 1988-10-13 JP JP13356288U patent/JPH0254287U/ja active Pending
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