JPH025578Y2 - - Google Patents

Description

[Detailed explanation of the invention] This invention is an IC that is attached to a printed circuit board, etc.
The present invention relates to a heat dissipation device for cooling high heat generation elements such as resistors and semiconductor elements.

In recent years, semiconductor devices have become faster and more highly integrated, resulting in higher unit power consumption, and in many cases, the heat generated by the device itself causes the device to reach a high temperature, reducing its reliability.

Conventionally, a cooling heat dissipation fin as shown in FIG. 1 has been used to cool electronic equipment including high heat generating elements. That is, a heat dissipation fin 2 with a narrow groove 2a formed on the top surface is adhered to the top surface of the electronic device 1 in the direction shown by the arrow, and heat generated in the electronic device 1 is transferred to the heat dissipation fin 2 for cooling. be. However, this method has various problems. First of all, the direction of the grooves 2a of the heat radiation fins 2 must be aligned with the direction of air flow, which limits the mounting direction. Second,
It is necessary to maintain the adhesive state between the heat dissipation fin 2 and the package of the electronic device 1 by withstanding long-term thermal stress. Furthermore, with such an adhesion method, there is a risk that the heat dissipation fins 2 may come off when vibration or impact is applied to the electronic device. For this reason, a metal case A is used for shielding as shown in FIG. However, in this case, there is a problem that the electronic component 4 is placed in a narrow space surrounded by the shield upper cover 5 and the printed circuit board 3, and the heat emitted from the electronic component 4 cannot be sufficiently dissipated. Note that 6 is a lower shield cover.

The present invention was developed to solve the above-mentioned problems, and the purpose is to obtain a heat dissipation device for electronic devices that can sufficiently dissipate heat from electronic devices that include high heat generating elements shielded within the case. do.

In order to achieve the above object, the present invention consists of a thermally conductive heat sink with a female screw attached to the inner surface of a thermally conductive cover, an electronic device with a male screw that engages with the female screw of the heat sink, and a female screw in the center. A thermally conductive screw-type heat sink that presses against the equipment,
Provided is a heat dissipation device for electronic equipment comprising a thermally conductive fixing plate provided on the top of the heat sink through a cover, and a thermally conductive locking screw screwed into the female screw of the screw type heat sink through the fixing plate. It is something to do. The present invention will be explained below using the drawings.

FIG. 3 is a front view showing an embodiment of the present invention.
In the figure, 3 is a printed circuit board, 4 is an electronic component,
5 is a cover on the shield. Further, 7 is a screw type heat sink, 8 is a fixing plate on the upper surface, 9 is a heat sink, and 15 is a terminal lead pin, each of which has thermal conductivity. By the way, in the heat dissipation device according to the present invention, the height a between the top of the electronic component 4 and the component mounting surface of the printed circuit board 3 shown in FIG. It also differs depending on the work done when attaching to 3. For this reason, the height b is adjusted using a heat sink as shown in FIG. This will be explained in detail below.

5 is a side sectional view of the main part of FIG. 3, and FIG. 6 is a perspective view of the main part of FIG. As shown in FIG. 6, the screw type heat sink 7 has a cylindrical shape, and has a screw 7a on the outer periphery and a female screw 7c in the center.
is provided and is adapted to be screwed into locking screw 10 via upper fixing plate 8. Further, a groove 7b is provided on the upper surface of the screw type heat sink 7 so that it can be rotated with a flat head screwdriver. Furthermore, as shown in FIG. 5, the heat sink 9 attached to the shield upper case 5 is provided with a female thread so that the screw type heat sink 7 is screwed into the heat sink 9.
The screw-type heat sink 7 is screwed into a female thread 9a of the heat sink 9 through a hole 5a from above the upper shield case 5 to which the heat sink 9 is attached. Note that 11 is a thermally conductive rubber.

The operation of the present invention configured as above will be explained as follows. First, screw type heat sink 7
is screwed into the threaded portion of the heat sink 9 through the hole 5a at the top of the upper shield cover 5, and the electronic component 4 is tightened. Note that a rubber 11 having good thermal conductivity may be placed on the electronic component 4 in advance in order to smooth the contact between the two. At this time, the screw type heat sink 7 and the electronic component 4 come into contact with each other via the rubber 11. The distance c between the electronic component 4 and the heat sink 9 can be easily finely adjusted by simply rotating the screw type heat sink 7. Next, attach the upper fixing plate 8 onto the shield upper cover 5, and insert the lock screw 10 into the hole 8 from above the upper fixing plate 8.
a, and screw it into the female screw 7c to fix it. When the lock screw 10 is strongly tightened, the screw-type heat sink 7 is pulled up toward the upper fixing plate 8, thereby preventing the screw-type heat sink 7 from loosening. In this way, the position of the cylindrical heat sink 9 can be finely adjusted. By the way, the heat sink 9 and the screw type heat sink 7 have a large surface area because they are in contact with each other through the screw thread, and the heat transmitted from the electronic component 4 to the screw type heat sink 7 via the rubber 11 is easily transmitted to the heat sink 9 and is transferred onto the shield. Heat is emitted to the surrounding air through the cover 5 and the upper fixing plate 8. Furthermore, heat is also dissipated through the locking screw 10.

In the above description, thermally conductive rubber is used between the screw type heat sink 7 and the electronic component 4, but this may be omitted. In addition, although the case where only one heat sink 9 is used for cooling the electronic component 4 is shown, it is also possible to use a plurality of heat sinks, and the case where the shield upper case 5 and the heat sink 9 are configured separately is shown. Both may be configured integrally.

As is clear from the above description, according to the present invention, a screw type heat sink can be attached to any position on the shield upper cover, and the operation is easy. Further, even if the distance between the heat sink and the electronic component varies, appropriate contact pressure and contact surface can always be maintained. Furthermore, in order to tightly attach the screw type heat sink to the shield upper case with a lock screw,
In addition to improving thermal conductivity, it is possible to prevent the screw-type heat sink from falling off.

[Brief explanation of the drawing]

1 and 2 are a perspective view and a front view, respectively, showing an example of a conventional heat dissipation device, and FIGS. 3, 4, 5, and 6 are front views, respectively, showing an embodiment of the present invention. , a front view of a main part, a sectional side view, and a perspective view of a main part. 7...Screw type heat sink, 8...Fixing plate, 9
...Heat sink, 10...Lock screw.

Claims (1)

[Claims for Utility Model Registration] A thermally conductive cover including a heat sink member and formed to cover an electronic component on a board, and a thermal bonding disposed between the heat sink member and the electronic component. a heat radiating device that radiates heat generated in the electronic component to the heat sink member via the bonding member, the heat receiving end being heated in contact with the electronic component, and a female screw for locking. a male screw member that is screwed into a female screw formed on the heat sink member, and a fixing plate placed on the thermally conductive cover so as to cover the female screw member; The connecting member includes a locking screw that is screwed into a female locking screw to connect the female screw member and the fixing plate and bias them against each other, thereby preventing the female screw member from loosening. Heat dissipation device for electronic equipment.