JPH0256413U - - Google Patents
Info
- Publication number
- JPH0256413U JPH0256413U JP13561088U JP13561088U JPH0256413U JP H0256413 U JPH0256413 U JP H0256413U JP 13561088 U JP13561088 U JP 13561088U JP 13561088 U JP13561088 U JP 13561088U JP H0256413 U JPH0256413 U JP H0256413U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- plate member
- main plate
- wide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 238000004804 winding Methods 0.000 description 1
Landscapes
- Coils Or Transformers For Communication (AREA)
Description
第１図は本考案の一実施例の分離した形で示す
斜視図、第２図は本考案の他の実施例の斜視図、
第３図は従来例の分離した形で示す斜視図である
。
図において、１は印刷配線板、２−１，２−２
，５１はスルーホール、５はボビン、６は角形フ
ランジ、１０は端子、１０ａはピン部、１５−１
，１５−２は磁心、２０は巻線、３０−１，３０
−２，３０Ａ−１，３０Ａ−２は熱伝達板、３１
は主板部材、３２はピン形突片、３６は水平板部
材、３８は脚片、５０は広面積パターン、５０Ａ
はアースパターン、６０は締着バンドを示す。
FIG. 1 is a perspective view of one embodiment of the present invention shown in separated form; FIG. 2 is a perspective view of another embodiment of the present invention;
FIG. 3 is a perspective view of a conventional example shown in separated form. In the figure, 1 is a printed wiring board, 2-1, 2-2
, 51 is a through hole, 5 is a bobbin, 6 is a square flange, 10 is a terminal, 10a is a pin part, 15-1
, 15-2 is a magnetic core, 20 is a winding wire, 30-1, 30
-2, 30A-1, 30A-2 is a heat transfer plate, 31
3 is a main plate member, 32 is a pin-shaped projecting piece, 36 is a horizontal plate member, 38 is a leg piece, 50 is a wide area pattern, 50A
indicates a ground pattern, and 60 indicates a fastening band.
Claims (1)
材３１を有する、金属板よりなる熱伝達板３０−
１，３０−２が、磁心１５−１，１５−２の外側
面に密着されてなり、 該主板部材３１の下部が、該印刷配線板１の広
面積パターン５０に半田付けされたことを特徴と
する線輪体の放熱構造。[Claims for Utility Model Registration] A heat transfer plate 30- made of a metal plate and having a main plate member 31 with a wide area reaching the mounting surface of the printed wiring board 1.
1 and 30-2 are closely attached to the outer surfaces of the magnetic cores 15-1 and 15-2, and the lower part of the main plate member 31 is soldered to the wide-area pattern 50 of the printed wiring board 1. The heat dissipation structure of the wire body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13561088U JPH0256413U (en) | 1988-10-18 | 1988-10-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13561088U JPH0256413U (en) | 1988-10-18 | 1988-10-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0256413U true JPH0256413U (en) | 1990-04-24 |
Family
ID=31395391
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13561088U Pending JPH0256413U (en) | 1988-10-18 | 1988-10-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0256413U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020088127A (en) * | 2018-11-22 | 2020-06-04 | ヤマハ株式会社 | Electrical component and electrical equipment |
-
1988
- 1988-10-18 JP JP13561088U patent/JPH0256413U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020088127A (en) * | 2018-11-22 | 2020-06-04 | ヤマハ株式会社 | Electrical component and electrical equipment |