JPH0257699A - partial plating equipment - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a partial plating apparatus for partially plating parts that require plating, such as IC lead frames.

BACKGROUND OF THE INVENTION In recent years, when plating frames for electronic components such as IC lead frames with precious metals such as silver, partial plating has been carried out in which plating is applied only to particularly necessary lead wire connection portions.

A conventional example of a partial plating apparatus for this purpose is disclosed in, for example, Japanese Unexamined Patent Publication No. 161790/1983. FIG. 3 shows the configuration of the partial plating apparatus disclosed in the publication. In FIG. 3, 40 is a plating Shibukawa tank having a plating opening 41 on its upper surface, and 42 is a nozzle disposed within the tank 40 with its tip directed toward the opening 41 for spouting a plating solution. 43
A lead frame is placed as an object to be plated, and a hole 44 is punched out in a portion of the lead frame 43 to be plated. 45 is an upper part that presses down the lead frame 43 from above, and upper M45
A recess is formed below the plate to accommodate the plating solution that is sprayed from below. Reference numeral 46 designates a bypass pipe for returning the plating waves remaining in the recess into the tank 40. 47 is the nozzle 4 that sucks the plating solution from the tank 40.
This is a pump for ejecting water from 2. The lead frame 43 has a clamping portion provided on the top surface of the tank 40 and an upper lid 45.
At the same time, the parts of the lead frame 43 that do not require plating are hidden, and only the parts that require plating are exposed to the plating solution sprayed from below.

Plating in the partial plating apparatus configured as described above is performed by jetting the plating solution vigorously from the nozzle 42 and passing the plating solution between the electrode (organized in the nozzle 42 and the upper M45) and the lead frame 43. This is done by passing a current through.

At this time, a part of the plating solution spouted from the nozzle 42 returns to the tank 40 through the nozzle 42 side, and also flows into the other recess formed in the upper lid 45 and passes through the bypass pipe 46 to the tank 40. Return to

Problems to be Solved by the Invention However, with the above configuration, although it is possible to quickly form a plating layer with a uniform thickness on both sides of the lead frame 43, the plating solution cannot be circulated directly to the tank 40. Since the method of circulating the plating solution is used, the plating solution mixes violently with air during circulation, and a large amount of air is trapped in the plating solution, which causes the plating solution to overflow from the tank 40 and cause loss of plating solution. There was a problem with letting it work.

Means for Solving the Problems In order to solve this evacuation problem, the present invention provides a foamed resin plate in the part from the slope of the circulation path of the plating solution flowing out from the jig and returning to the tank to the liquid level of the tank. Become.

Function: With this configuration, the plating solution flows smoothly even when the tank liquid level rises and falls, so that foaming of the plating solution is suppressed.

EXAMPLE Hereinafter, an example of the present invention will be described in detail with reference to the drawings. Note that this example is particularly suitable for mass production processes,
Plating is performed simultaneously on a plurality of parts of the lead frame connected to the coil that require plating, and the connected lead frames are plated several at a time. For this purpose, the lead frame is set in a partial plating device, and then the plating solution is allowed to flow. When plating is completed, the flow of the plating solution is reduced and the lead frame is moved.

First, FIG. 1 is a schematic diagram showing the configuration of a partial plating apparatus in an embodiment of the present invention. Here, 1 is a liquid receiving tank having a plating solution spout 1a at the bottom, the plating solution pumped by a pump 2 passes through the spout 1a, and is applied to a plating jig 3 located above the spout 1a. Passes through the inside of and receives liquid 4f! 1. 4 is a liquid circulation path, which is located at a distance of 30 mm from the bottom of the liquid receiving tank 1.
The tip of the liquid circulation path 4 reaches near the liquid level of the main tank 5 that stores the plating solution. A foamed resin plate 6 floats on the liquid surface of the main tank 5 and is fixed to the tip of the liquid circulation path 4. This foamed resin board 6 has a length such that its tip is always parallel to the surface of the plating solution, and due to its moderate hardness, it curves gently as the surface of the plating solution rises and falls. .

After setting the lead frame in the plating jig 3 in the above configuration, the pump 2 is started to circulate the plating solution. When the plating is completed, the lead frame is removed from the jig 3, but the operation of the old pump 2 is stopped. Next, set the lead frame to be plated and perform the next plating.

Here, the pump 2 repeatedly starts and stops, but when the pump 2 starts operating and the liquid level in the main tank 5 momentarily drops, the foamed resin plate 6 descends according to the liquid level and connects with the tip of the liquid circulation path 5. It absorbs the drop that occurs between the liquid level and maintains a smooth slope. The plating solution flowing into the liquid receiving tank 1 flows out along the liquid circulation path 4 due to the head difference, and smoothly flows into the liquid level of the main tank 5 using the foamed resin plate 6 as a guide. Further, the plating solution that has flowed into the main tank 5 and is stored is again forcedly fed to the spout 1a of the liquid receiving tank 1 by the pump 2, and the circulation is repeated.

Effects of the Invention As described above, the present invention provides an upward-opening type liquid receiving tank for temporarily collecting the plating solution flowing out from the plating jig, and improves the plating liquid level in the circulation path having an inclined surface in the drop from the liquid receiving tank to the tank. By forming a foamed resin plate in the area up to this point, even if a large amount of plating solution flows out, it will not hit the plating solution surface in the main tank, the inflow speed will be extremely slow, and foaming will be minimal. Therefore, there is no loss of plating solution spilled from the main tank, making high-speed plating possible. Additionally, since the foamed resin plate moves up and down to maintain the slope when the liquid level drops during pump operation, adjustment of the liquid level can be simplified.

[Brief explanation of the drawing]

Fig. 1 is a schematic diagram showing the configuration of a partial plating apparatus according to an embodiment of the present invention, Fig. 2 is an enlarged view of the tip of the circulation path of the partial plating apparatus shown in Fig. 1, and Fig. 3 is a conventional part. FIG. 1 is a schematic diagram showing the configuration of a plating apparatus. 3... Plating jig, 4... Liquid circulation path, 5... Main tank, 6... Foamed resin board

Claims (1)

[Scope of Claims] An upward-opening liquid receiving tank having a plating solution spout, a plating jig provided above the liquid receiving tank spout, a tank for storing the plating solution, and the plating solution. a liquid circulation path having an inclined surface through which the plating solution flows from the plating jig to the tank; a pressurizing pump that sucks the plating solution from the tank, pressurizes it, and supplies it to the liquid receiving tank; and the liquid circulation path. A partial plating apparatus comprising: a foamed resin plate provided in a portion extending from the tank to the liquid level of the tank.