JPH0258325U - - Google Patents
Info
- Publication number
- JPH0258325U JPH0258325U JP4609689U JP4609689U JPH0258325U JP H0258325 U JPH0258325 U JP H0258325U JP 4609689 U JP4609689 U JP 4609689U JP 4609689 U JP4609689 U JP 4609689U JP H0258325 U JPH0258325 U JP H0258325U
- Authority
- JP
- Japan
- Prior art keywords
- exterior body
- electronic component
- lead terminals
- lead
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000001681 protective effect Effects 0.000 claims description 2
Landscapes
- Details Of Resistors (AREA)
Description
第１図は、本考案の実施例を示すリード端子付
チツプ形電子部品を回路基板に搭載した状態の斜
視図、第２図は、同状態を中央で断面した側面図
、第３図は、従来例を示すリード端子付チツプ形
電子部品を回路基板に搭載した状態の斜視図、第
４図は、同状態を中央で断面した側面図である。
１……外装体、２……リード端子、３……リー
ド端子の屈曲部、６……保護材。
Fig. 1 is a perspective view of a chip-type electronic component with lead terminals mounted on a circuit board, showing an embodiment of the present invention; Fig. 2 is a side view of the same state taken in cross section at the center; FIG. 4 is a perspective view of a conventional example of a chip-type electronic component with lead terminals mounted on a circuit board, and FIG. 4 is a side view of the same state taken in section at the center. DESCRIPTION OF SYMBOLS 1... Exterior body, 2... Lead terminal, 3... Bent part of lead terminal, 6... Protective material.
Claims (1)
品本体８に接続され、外装体１から導出されたリ
ード端子２，２とを有し、リード端子２，２が外
装体１から引き出された導出基部で外装体１に添
うよう屈曲されたリード端子付チツプ形電子部品
において、上記外装体１から導出されたリード端
子２，２の屈曲部３を覆うように、保護材６，６
が塗布されたことを特徴とするリード端子付チツ
プ形電子部品。 It has an electronic component body 8 covered with an exterior body 1 and lead terminals 2, 2 connected to the electronic component body 8 and led out from the exterior body 1, with the lead terminals 2, 2 being drawn out from the exterior body 1. In a chip-type electronic component with a lead terminal that is bent along the exterior body 1 at the lead-out base, protective materials 6, 6 are provided so as to cover the bent portions 3 of the lead terminals 2, 2 led out from the exterior body 1.
A chip-shaped electronic component with lead terminals coated with.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4609689U JPH0258325U (en) | 1988-06-20 | 1989-04-19 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8126588 | 1988-06-20 | ||
| JP4609689U JPH0258325U (en) | 1988-06-20 | 1989-04-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0258325U true JPH0258325U (en) | 1990-04-26 |
Family
ID=31717957
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4609689U Pending JPH0258325U (en) | 1988-06-20 | 1989-04-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0258325U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0492623U (en) * | 1990-12-28 | 1992-08-12 |
-
1989
- 1989-04-19 JP JP4609689U patent/JPH0258325U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0492623U (en) * | 1990-12-28 | 1992-08-12 |