JPH0259860U - - Google Patents
Info
- Publication number
- JPH0259860U JPH0259860U JP14059788U JP14059788U JPH0259860U JP H0259860 U JPH0259860 U JP H0259860U JP 14059788 U JP14059788 U JP 14059788U JP 14059788 U JP14059788 U JP 14059788U JP H0259860 U JPH0259860 U JP H0259860U
- Authority
- JP
- Japan
- Prior art keywords
- solder
- ceramic wiring
- wiring board
- flux
- bump
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 12
- 239000000919 ceramic Substances 0.000 claims description 7
- 230000004907 flux Effects 0.000 claims description 6
- 238000005476 soldering Methods 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims 2
- 238000000576 coating method Methods 0.000 claims 2
- 238000010438 heat treatment Methods 0.000 claims 2
- 239000011261 inert gas Substances 0.000 claims 1
- 238000005507 spraying Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 210000000078 claw Anatomy 0.000 description 1
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案の一実施例の機能ブロツク図、
第２図は本考案の一実施例の斜視図、第３図は半
田槽３を通過後の基板８の側断面図、第４図は従
来のセラミツクス配線基板用ソルダーマシーンの
機能ブロツク図である。
１……噴流式フラツクス塗布手段、２……第一
の赤外線ヒーター、３……噴流式半田槽、４……
余剰半田除去手段、５……第二の噴流式フラツク
ス塗布手段、６……第二の赤外線ヒーター、７…
…チエーンコンベア、８……セラミツクス配線基
板、９……チエーン、１０……爪、１１……ノズ
ル、１２……バンプ。
FIG. 1 is a functional block diagram of an embodiment of the present invention.
Fig. 2 is a perspective view of an embodiment of the present invention, Fig. 3 is a side sectional view of the board 8 after passing through the solder bath 3, and Fig. 4 is a functional block diagram of a conventional soldering machine for ceramic wiring boards. . DESCRIPTION OF SYMBOLS 1... Jet type flux application means, 2... First infrared heater, 3... Jet type soldering bath, 4...
Excess solder removal means, 5... second jet flux application means, 6... second infrared heater, 7...
... Chain conveyor, 8 ... Ceramic wiring board, 9 ... Chain, 10 ... Claw, 11 ... Nozzle, 12 ... Bump.
Claims (1)
面にフラツクスを均一に塗布するフラツクス塗布
手段と、フラツクス塗布後の前記セラミツクス配
線基板を一定温度に予熱する予熱手段と、予熱後
の前記セラミツクス配線基板のバンプ面に半田を
コーテイングする半田槽と、半田コーテイング後
の前記バンプ面の余分な半田を高温の不活性ガス
をノズルより噴射し除去する余剰半田除去手段と
、余剰半田除去後の前記バンプ面にフラツクスを
再度均一に塗布する第二のフラツクス塗布手段と
、余剰半田除去後の前記バンプ面を再度加熱し半
田を均一に溶かす加熱手段と、前記セラミツクス
配線基板を上記の各手段間に順次搬送する基板搬
送手段とを含むことを特徴とするセラミツクス配
線基板用ソルダーマシーン。 A flux application means for uniformly applying flux to the surface of the external connection bumps on the surface of the ceramic wiring board, a preheating means for preheating the ceramic wiring board to a constant temperature after applying the flux, and a bump on the ceramic wiring board after preheating. a solder bath for coating the bump surface with solder; an excess solder removal means for removing excess solder on the bump surface after the solder coating by spraying hot inert gas from a nozzle; and a means for removing excess solder on the bump surface after removing the excess solder. a second flux applying means for uniformly applying the solder again; a heating means for heating the bump surface again after excess solder has been removed to uniformly melt the solder; and a substrate for sequentially transporting the ceramic wiring board between the above-mentioned means. 1. A soldering machine for ceramic wiring boards, comprising a conveying means.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14059788U JPH0259860U (en) | 1988-10-27 | 1988-10-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14059788U JPH0259860U (en) | 1988-10-27 | 1988-10-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0259860U true JPH0259860U (en) | 1990-05-01 |
Family
ID=31404914
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14059788U Pending JPH0259860U (en) | 1988-10-27 | 1988-10-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0259860U (en) |
-
1988
- 1988-10-27 JP JP14059788U patent/JPH0259860U/ja active Pending
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