JPH0259869B2 - - Google Patents

Info

Publication number: JPH0259869B2
Authority: JP; Japan
Prior art keywords: catalyst; electroless plating; plating; base material; film layer
Prior art date: 1987-03-27
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired

Application number

JP7500487A

Other languages

English (en)

Japanese (ja)

Other versions

JPS63241186A (ja

Inventor

Takao Sumi

Norimichi Isoda

Tatsuo Ishibashi

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Nissha Printing Co Ltd

Original Assignee

Nissha Printing Co Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1987-03-27

Filing date

1987-03-27

Publication date

1990-12-13

1987-03-27 Application filed by Nissha Printing Co Ltd filed Critical Nissha Printing Co Ltd

1987-03-27 Priority to JP7500487A priority Critical patent/JPS63241186A/ja

1988-10-06 Publication of JPS63241186A publication Critical patent/JPS63241186A/ja

1990-12-13 Publication of JPH0259869B2 publication Critical patent/JPH0259869B2/ja

Status Granted legal-status Critical Current

Links

238000007747 plating Methods 0.000 claims description 27
239000003054 catalyst Substances 0.000 claims description 26
238000007772 electroless plating Methods 0.000 claims description 23
239000000463 material Substances 0.000 claims description 21
239000002585 base Substances 0.000 claims description 20
238000000034 method Methods 0.000 claims description 20
229910052751 metal Inorganic materials 0.000 claims description 9
239000002184 metal Substances 0.000 claims description 9
239000003513 alkali Substances 0.000 claims description 7
239000012528 membrane Substances 0.000 claims description 6
239000000126 substance Substances 0.000 claims description 6
238000000576 coating method Methods 0.000 claims description 4
238000010306 acid treatment Methods 0.000 claims description 3
239000011248 coating agent Substances 0.000 claims description 3
229920002120 photoresistant polymer Polymers 0.000 claims description 3
238000000151 deposition Methods 0.000 claims description 2
229910010272 inorganic material Inorganic materials 0.000 claims description 2
239000011147 inorganic material Substances 0.000 claims description 2
238000000059 patterning Methods 0.000 claims description 2
238000007639 printing Methods 0.000 claims description 2
PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 15
239000000758 substrate Substances 0.000 description 15
VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical class O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 10
XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 9
KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 6
239000000243 solution Substances 0.000 description 6
239000011521 glass Substances 0.000 description 5
238000005406 washing Methods 0.000 description 5
229910018072 Al 2 O 3 Inorganic materials 0.000 description 4
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
229910052802 copper Inorganic materials 0.000 description 4
239000010949 copper Substances 0.000 description 4
239000000377 silicon dioxide Substances 0.000 description 4
KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
238000001035 drying Methods 0.000 description 3
229910001220 stainless steel Inorganic materials 0.000 description 3
239000010935 stainless steel Substances 0.000 description 3
TXUICONDJPYNPY-UHFFFAOYSA-N (1,10,13-trimethyl-3-oxo-4,5,6,7,8,9,11,12,14,15,16,17-dodecahydrocyclopenta[a]phenanthren-17-yl) heptanoate Chemical compound C1CC2CC(=O)C=C(C)C2(C)C2C1C1CCC(OC(=O)CCCCCC)C1(C)CC2 TXUICONDJPYNPY-UHFFFAOYSA-N 0.000 description 2
VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
229910021626 Tin(II) chloride Inorganic materials 0.000 description 2
239000002253 acid Substances 0.000 description 2
239000000919 ceramic Substances 0.000 description 2
239000000084 colloidal system Substances 0.000 description 2
239000013078 crystal Substances 0.000 description 2
230000000694 effects Effects 0.000 description 2
238000010292 electrical insulation Methods 0.000 description 2
239000007788 liquid Substances 0.000 description 2
239000000203 mixture Substances 0.000 description 2
229910052759 nickel Inorganic materials 0.000 description 2
239000011148 porous material Substances 0.000 description 2
238000007650 screen-printing Methods 0.000 description 2
239000007921 spray Substances 0.000 description 2
238000004544 sputter deposition Methods 0.000 description 2
239000001119 stannous chloride Substances 0.000 description 2
235000011150 stannous chloride Nutrition 0.000 description 2
230000003746 surface roughness Effects 0.000 description 2
229910052718 tin Inorganic materials 0.000 description 2
229910004298 SiO 2 Inorganic materials 0.000 description 1
BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
239000000853 adhesive Substances 0.000 description 1
230000001070 adhesive effect Effects 0.000 description 1
239000012670 alkaline solution Substances 0.000 description 1
238000007611 bar coating method Methods 0.000 description 1
QDWJUBJKEHXSMT-UHFFFAOYSA-N boranylidynenickel Chemical compound [Ni]#B QDWJUBJKEHXSMT-UHFFFAOYSA-N 0.000 description 1
238000007598 dipping method Methods 0.000 description 1
238000005516 engineering process Methods 0.000 description 1
238000001704 evaporation Methods 0.000 description 1
230000008020 evaporation Effects 0.000 description 1
238000007654 immersion Methods 0.000 description 1
229910003437 indium oxide Inorganic materials 0.000 description 1
PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
238000004519 manufacturing process Methods 0.000 description 1
150000002739 metals Chemical class 0.000 description 1
229910052763 palladium Inorganic materials 0.000 description 1
KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 1
PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 description 1
OFNHPGDEEMZPFG-UHFFFAOYSA-N phosphanylidynenickel Chemical compound [P].[Ni] OFNHPGDEEMZPFG-UHFFFAOYSA-N 0.000 description 1
238000005488 sandblasting Methods 0.000 description 1
229910052709 silver Inorganic materials 0.000 description 1
239000004332 silver Substances 0.000 description 1
238000001179 sorption measurement Methods 0.000 description 1
239000011135 tin Substances 0.000 description 1
238000007740 vapor deposition Methods 0.000 description 1
239000002699 waste material Substances 0.000 description 1
238000004065 wastewater treatment Methods 0.000 description 1

Classifications

- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating

Landscapes

Engineering & Computer Science (AREA)
Manufacturing & Machinery (AREA)
Microelectronics & Electronic Packaging (AREA)
Chemically Coating (AREA)
Manufacturing Of Printed Wiring (AREA)

JP7500487A 1987-03-27 1987-03-27 無電解メツキ方法 Granted JPS63241186A (ja)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
JP7500487A JPS63241186A (ja)	1987-03-27	1987-03-27	無電解メツキ方法

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP7500487A JPS63241186A (ja)	1987-03-27	1987-03-27	無電解メツキ方法

Publications (2)

Publication Number	Publication Date
JPS63241186A JPS63241186A (ja)	1988-10-06
JPH0259869B2 true JPH0259869B2 (de)	1990-12-13

Family

ID=13563618

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP7500487A Granted JPS63241186A (ja)	1987-03-27	1987-03-27	無電解メツキ方法

Country Status (1)

Country	Link
JP (1)	JPS63241186A (de)

1987
- 1987-03-27 JP JP7500487A patent/JPS63241186A/ja active Granted

Also Published As

Publication number	Publication date
JPS63241186A (ja)	1988-10-06

Legal Events

Date	Code	Title	Description
2004-11-30	R250	Receipt of annual fees	Free format text: JAPANESE INTERMEDIATE CODE: R250
2005-11-29	R250	Receipt of annual fees	Free format text: JAPANESE INTERMEDIATE CODE: R250
2006-12-13	LAPS	Cancellation because of no payment of annual fees

Publication	Publication Date	Title
US4748104A (en)	1988-05-31	Selective metallization process and additive method for manufactured printed circuit boards
JP3117386B2 (ja)	2000-12-11	基板を選択的に金属被覆する方法
JPH022949B2 (de)	1990-01-19
EP0273374A2 (de)	1988-07-06	Verfahren zur Herstellung von Mehrschichtschaltungen unter Verwendung von eingebetteten Katalysatorrezeptoren
EP0273376A1 (de)	1988-07-06	Eingebettete Rezeptoren für Katalysatoren zur Metallisierung von Dielektrika
JPS60207395A (ja)	1985-10-18	スルーホールメツキした電気プリント回路板の製造法
US4782007A (en)	1988-11-01	Additive method for manufacturing printed circuit boards using aqueous alkaline developable and strippable photoresists
US3481777A (en)	1969-12-02	Electroless coating method for making printed circuits
US3669770A (en)	1972-06-13	Method of making abrasion-resistant metal-coated glass photomasks
US3619285A (en)	1971-11-09	Method of making a patterned metal film article
US3878007A (en)	1975-04-15	Method of depositing a pattern of metal plated areas on an insulating substrate
JP3650514B2 (ja)	2005-05-18	メッキした抵抗体をもつ印刷回路板の製造方法
JPH08253868A (ja)	1996-10-01	基板上への金属の無電解堆積プロセス
JPH0259869B2 (de)	1990-12-13
JP3821868B2 (ja)	2006-09-13	絶縁基材上にめっきする方法及びその方法にて得られるめっき付与物
JPH026833B2 (de)	1990-02-14
JP3474291B2 (ja)	2003-12-08	ガラス又はセラミックス基板へのめっき層の形成方法
JPH0337878B2 (de)	1991-06-06
RU2040129C1 (ru)	1995-07-20	Способ изготовления двусторонних печатных плат из стеклотекстолита
JP2943231B2 (ja)	1999-08-30	導電パターンの形成方法
JPH0232616B2 (de)	1990-07-23
JPH02130891A (ja)	1990-05-18	セラミツク回路基板の製造法
JPH0585637B2 (de)	1993-12-08
JPS58128789A (ja)	1983-08-01	プリント基板の製法
JPS59129766A (ja)	1984-07-26	無電解メツキ法