JPH0260250U - - Google Patents
Info
- Publication number
- JPH0260250U JPH0260250U JP13894288U JP13894288U JPH0260250U JP H0260250 U JPH0260250 U JP H0260250U JP 13894288 U JP13894288 U JP 13894288U JP 13894288 U JP13894288 U JP 13894288U JP H0260250 U JPH0260250 U JP H0260250U
- Authority
- JP
- Japan
- Prior art keywords
- cap
- substrate
- electronic component
- insulating resin
- printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Casings For Electric Apparatus (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Description
第１図は本考案の一実施例の電子部品の一部破
断斜視図、第２図は基板上に絶縁樹脂を印刷した
状態の斜視図、第３図は基板上に電子回路を設け
た状態の斜視図、第４図はキヤツプの斜視図、第
５図は第１図に示す電子部品の側面図、第６図は
従来の電子部品の一例の斜視図、第７図は第６図
に示す電子部品の分解斜視図である。
〔符号の説明〕、１……電子部品、２……基板
、３，４……電極、５……絶縁樹脂、６……電子
回路、７……キヤツプ。
Figure 1 is a partially cutaway perspective view of an electronic component according to an embodiment of the present invention, Figure 2 is a perspective view of an insulating resin printed on a board, and Figure 3 is a diagram of an electronic circuit mounted on a board. 4 is a perspective view of the cap, FIG. 5 is a side view of the electronic component shown in FIG. 1, FIG. 6 is a perspective view of an example of a conventional electronic component, and FIG. 7 is a perspective view of the cap. FIG. 2 is an exploded perspective view of the electronic component shown in FIG. [Explanation of symbols] 1...electronic component, 2...substrate, 3, 4...electrode, 5...insulating resin, 6...electronic circuit, 7...cap.
Claims (1)
金属薄板成形品のキヤツプが接着され、その基板
とキヤツプの間に形成される空間内の基板上に電
子回路が設けられてなることを特徴とする電子部
品。 Insulating resin is printed on the substrate and cured, and then
An electronic component characterized in that a cap of a thin metal plate molded product is bonded to the cap, and an electronic circuit is provided on the substrate in a space formed between the substrate and the cap.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13894288U JPH0260250U (en) | 1988-10-25 | 1988-10-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13894288U JPH0260250U (en) | 1988-10-25 | 1988-10-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0260250U true JPH0260250U (en) | 1990-05-02 |
Family
ID=31401743
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13894288U Pending JPH0260250U (en) | 1988-10-25 | 1988-10-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0260250U (en) |
-
1988
- 1988-10-25 JP JP13894288U patent/JPH0260250U/ja active Pending
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