JPH0260274U - - Google Patents
Info
- Publication number
- JPH0260274U JPH0260274U JP13892088U JP13892088U JPH0260274U JP H0260274 U JPH0260274 U JP H0260274U JP 13892088 U JP13892088 U JP 13892088U JP 13892088 U JP13892088 U JP 13892088U JP H0260274 U JPH0260274 U JP H0260274U
- Authority
- JP
- Japan
- Prior art keywords
- thermal expansion
- expansion coefficient
- mounting seat
- circuit board
- outsert molding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Injection Moulding Of Plastics Or The Like (AREA)
- Structure Of Printed Boards (AREA)
Description
図は本考案の一実施例を示したものであり、第
１図は回路基板にアウトサート成形を施す手順を
示したフローチヤート、第２図はアウトサート成
形を施した回路基板の平面図、第３図乃至第５図
は基板に設けた取付座の要部を示す縦断面図、第
６図は基板に電子部品及び機構部品を搭載した状
態を示す要部の縦断面図である。
１……基板、５……取付座。
The figures show one embodiment of the present invention, in which Figure 1 is a flowchart showing the procedure for performing outsert molding on a circuit board, Figure 2 is a plan view of a circuit board that has been subjected to outsert molding, 3 to 5 are vertical cross-sectional views showing the main parts of the mounting seat provided on the board, and FIG. 6 is a vertical cross-sectional view of the main parts showing a state in which electronic components and mechanical parts are mounted on the board. 1... Board, 5... Mounting seat.
Claims (1)
ラミツク基板に、熱膨張率１５×１０−６〜３０
×１０−６の樹脂にてアウトサート成形を施して
取付座を形成したことを特徴とする回路基板。 A ceramic substrate with a thermal expansion coefficient of 5×10 −6 to 10×10 −6 has a thermal expansion coefficient of 15×10 −6 to 30
A circuit board characterized in that a mounting seat is formed by outsert molding of x10 -6 resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13892088U JPH0610716Y2 (en) | 1988-10-25 | 1988-10-25 | Circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13892088U JPH0610716Y2 (en) | 1988-10-25 | 1988-10-25 | Circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0260274U true JPH0260274U (en) | 1990-05-02 |
| JPH0610716Y2 JPH0610716Y2 (en) | 1994-03-16 |
Family
ID=31401700
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13892088U Expired - Lifetime JPH0610716Y2 (en) | 1988-10-25 | 1988-10-25 | Circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0610716Y2 (en) |
-
1988
- 1988-10-25 JP JP13892088U patent/JPH0610716Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0610716Y2 (en) | 1994-03-16 |
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