JPH0260298U - - Google Patents
Info
- Publication number
- JPH0260298U JPH0260298U JP13988188U JP13988188U JPH0260298U JP H0260298 U JPH0260298 U JP H0260298U JP 13988188 U JP13988188 U JP 13988188U JP 13988188 U JP13988188 U JP 13988188U JP H0260298 U JPH0260298 U JP H0260298U
- Authority
- JP
- Japan
- Prior art keywords
- shield case
- frame
- circuit board
- side edge
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 238000005476 soldering Methods 0.000 description 3
- 210000000078 claw Anatomy 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Description
第１図、第２図は、本考案の実施例に関し、第
１図はシールドケースの分解斜視図、第２図は同
デイツプ半田後を示す断面の説明図である。第３
図〜第４図ｂは従来例に関し、第３図はシールド
ケースの分解斜視図、第４図ａは同デイツプ半田
前を示す断面の説明図、第４図ｂは同デイツプ半
田後を示す断面の説明図である。
１……プリント基板、２……枠体、２ａ，２ｂ
……開口部側縁部、３……シールド用カバー、４
，１０……金属被膜、５……銅箔パターン、５ａ
……接地回路電極、６……電気部品、７……め
爪、８……爪穴、９……半田。
1 and 2 relate to an embodiment of the present invention; FIG. 1 is an exploded perspective view of the shield case, and FIG. 2 is an explanatory cross-sectional view showing the shield case after dip soldering. Third
Figures to Figure 4b relate to the conventional example, Figure 3 is an exploded perspective view of the shield case, Figure 4a is an explanatory diagram of a cross section showing the same before dip soldering, and Figure 4b is a cross section showing the same after dip soldering. FIG. 1... Printed circuit board, 2... Frame, 2a, 2b
...Opening side edge, 3...Shield cover, 4
, 10...Metal coating, 5...Copper foil pattern, 5a
...Ground circuit electrode, 6...Electrical component, 7...Claw, 8...Claw hole, 9...Solder.
Claims (1)
るためのシールドケースを形成する導電性の枠体
の開口部側縁部に、枠体の他の部分よりも半田付
着性の悪い導電性の金属被膜が形成されているこ
とを特徴とするシールドケース。 A conductive metal coating that has poor solder adhesion than other parts of the frame is applied to the side edge of the opening of the conductive frame that forms a shield case to house the printed circuit board and prevent electromagnetic waves from entering and exiting. A shield case characterized by being formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13988188U JPH0260298U (en) | 1988-10-26 | 1988-10-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13988188U JPH0260298U (en) | 1988-10-26 | 1988-10-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0260298U true JPH0260298U (en) | 1990-05-02 |
Family
ID=31403552
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13988188U Pending JPH0260298U (en) | 1988-10-26 | 1988-10-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0260298U (en) |
-
1988
- 1988-10-26 JP JP13988188U patent/JPH0260298U/ja active Pending
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