JPH02614A - One-pack thermosetting composition - Google Patents
One-pack thermosetting compositionInfo
- Publication number
- JPH02614A JPH02614A JP88175121A JP17512188A JPH02614A JP H02614 A JPH02614 A JP H02614A JP 88175121 A JP88175121 A JP 88175121A JP 17512188 A JP17512188 A JP 17512188A JP H02614 A JPH02614 A JP H02614A
- Authority
- JP
- Japan
- Prior art keywords
- compound
- group
- compounds
- solid
- composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 63
- 229920001187 thermosetting polymer Polymers 0.000 title claims abstract description 21
- 150000001875 compounds Chemical class 0.000 claims abstract description 117
- 239000007787 solid Substances 0.000 claims abstract description 47
- 229920001228 polyisocyanate Polymers 0.000 claims abstract description 35
- 239000005056 polyisocyanate Substances 0.000 claims abstract description 35
- 125000003739 carbamimidoyl group Chemical group C(N)(=N)* 0.000 claims abstract description 12
- 125000000717 hydrazino group Chemical group [H]N([*])N([H])[H] 0.000 claims abstract description 12
- 125000004397 aminosulfonyl group Chemical group NS(=O)(=O)* 0.000 claims abstract description 9
- 125000000524 functional group Chemical group 0.000 claims abstract description 6
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims abstract description 6
- 125000000623 heterocyclic group Chemical group 0.000 claims abstract description 5
- 239000001257 hydrogen Substances 0.000 claims description 19
- 229910052739 hydrogen Inorganic materials 0.000 claims description 19
- 125000001749 primary amide group Chemical group 0.000 claims description 11
- 238000009835 boiling Methods 0.000 claims description 10
- 125000001391 thioamide group Chemical group 0.000 claims description 9
- 229920005989 resin Polymers 0.000 abstract description 8
- 239000011347 resin Substances 0.000 abstract description 8
- 125000003277 amino group Chemical group 0.000 abstract description 7
- 229920000877 Melamine resin Polymers 0.000 abstract description 6
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 abstract description 6
- 239000000853 adhesive Substances 0.000 abstract description 5
- 230000001070 adhesive effect Effects 0.000 abstract description 5
- IBVAQQYNSHJXBV-UHFFFAOYSA-N adipic acid dihydrazide Chemical compound NNC(=O)CCCCC(=O)NN IBVAQQYNSHJXBV-UHFFFAOYSA-N 0.000 abstract description 4
- 238000000465 moulding Methods 0.000 abstract description 2
- ZGZUKKMFYTUYHA-HNNXBMFYSA-N (2s)-2-amino-3-(4-phenylmethoxyphenyl)propane-1-thiol Chemical group C1=CC(C[C@@H](CS)N)=CC=C1OCC1=CC=CC=C1 ZGZUKKMFYTUYHA-HNNXBMFYSA-N 0.000 abstract 1
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 239000003566 sealing material Substances 0.000 abstract 1
- -1 polyol compound Chemical class 0.000 description 18
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 17
- 238000001723 curing Methods 0.000 description 15
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 14
- 239000002253 acid Substances 0.000 description 14
- 229920005862 polyol Polymers 0.000 description 11
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 10
- 230000000052 comparative effect Effects 0.000 description 9
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 8
- 229910021536 Zeolite Inorganic materials 0.000 description 7
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 7
- 238000002844 melting Methods 0.000 description 7
- 230000008018 melting Effects 0.000 description 7
- 229920003986 novolac Polymers 0.000 description 7
- 239000010457 zeolite Substances 0.000 description 7
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 6
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 6
- 238000005259 measurement Methods 0.000 description 6
- 239000000454 talc Substances 0.000 description 6
- 229910052623 talc Inorganic materials 0.000 description 6
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 5
- 239000000945 filler Substances 0.000 description 5
- OZJPLYNZGCXSJM-UHFFFAOYSA-N 5-valerolactone Chemical compound O=C1CCCCO1 OZJPLYNZGCXSJM-UHFFFAOYSA-N 0.000 description 4
- GVNWZKBFMFUVNX-UHFFFAOYSA-N Adipamide Chemical compound NC(=O)CCCCC(N)=O GVNWZKBFMFUVNX-UHFFFAOYSA-N 0.000 description 4
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 4
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 4
- POULHZVOKOAJMA-UHFFFAOYSA-N dodecanoic acid Chemical compound CCCCCCCCCCCC(O)=O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 description 4
- GAEKPEKOJKCEMS-UHFFFAOYSA-N gamma-valerolactone Chemical compound CC1CCC(=O)O1 GAEKPEKOJKCEMS-UHFFFAOYSA-N 0.000 description 4
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 4
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 4
- 229920000768 polyamine Polymers 0.000 description 4
- 150000003077 polyols Chemical class 0.000 description 4
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 4
- 239000000377 silicon dioxide Substances 0.000 description 4
- POILWHVDKZOXJZ-ARJAWSKDSA-M (z)-4-oxopent-2-en-2-olate Chemical compound C\C([O-])=C\C(C)=O POILWHVDKZOXJZ-ARJAWSKDSA-M 0.000 description 3
- FKTHNVSLHLHISI-UHFFFAOYSA-N 1,2-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC=C1CN=C=O FKTHNVSLHLHISI-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- KMTRUDSVKNLOMY-UHFFFAOYSA-N Ethylene carbonate Chemical compound O=C1OCCO1 KMTRUDSVKNLOMY-UHFFFAOYSA-N 0.000 description 3
- 239000004721 Polyphenylene oxide Substances 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 3
- 239000001361 adipic acid Substances 0.000 description 3
- 235000011037 adipic acid Nutrition 0.000 description 3
- 239000000440 bentonite Substances 0.000 description 3
- 229910000278 bentonite Inorganic materials 0.000 description 3
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 description 3
- 239000002981 blocking agent Substances 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 125000005442 diisocyanate group Chemical group 0.000 description 3
- 238000013007 heat curing Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000012948 isocyanate Substances 0.000 description 3
- 150000002513 isocyanates Chemical class 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- AQJVGSDIODOKTL-UHFFFAOYSA-N n-(4,6-diamino-1,3,5-triazin-2-yl)-1h-imidazole-2-carbohydrazide Chemical compound N=1C(N)=NC(N)=NC=1N(N)C(=O)C1=NC=CN1 AQJVGSDIODOKTL-UHFFFAOYSA-N 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 229920000570 polyether Polymers 0.000 description 3
- RUOJZAUFBMNUDX-UHFFFAOYSA-N propylene carbonate Chemical compound CC1COC(=O)O1 RUOJZAUFBMNUDX-UHFFFAOYSA-N 0.000 description 3
- 150000005846 sugar alcohols Polymers 0.000 description 3
- OJVAMHKKJGICOG-UHFFFAOYSA-N 2,5-hexanedione Chemical compound CC(=O)CCC(C)=O OJVAMHKKJGICOG-UHFFFAOYSA-N 0.000 description 2
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 2
- DLFVBJFMPXGRIB-UHFFFAOYSA-N Acetamide Chemical compound CC(N)=O DLFVBJFMPXGRIB-UHFFFAOYSA-N 0.000 description 2
- 229910002012 Aerosil® Inorganic materials 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 229920002261 Corn starch Polymers 0.000 description 2
- FBPFZTCFMRRESA-FSIIMWSLSA-N D-Glucitol Natural products OC[C@H](O)[C@H](O)[C@@H](O)[C@H](O)CO FBPFZTCFMRRESA-FSIIMWSLSA-N 0.000 description 2
- FBPFZTCFMRRESA-JGWLITMVSA-N D-glucitol Chemical compound OC[C@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-JGWLITMVSA-N 0.000 description 2
- ZRALSGWEFCBTJO-UHFFFAOYSA-N Guanidine Chemical compound NC(N)=N ZRALSGWEFCBTJO-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 2
- ATHHXGZTWNVVOU-UHFFFAOYSA-N N-methylformamide Chemical compound CNC=O ATHHXGZTWNVVOU-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 2
- 229920006362 Teflon® Polymers 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- VHRGRCVQAFMJIZ-UHFFFAOYSA-N cadaverine Chemical compound NCCCCCN VHRGRCVQAFMJIZ-UHFFFAOYSA-N 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 239000008120 corn starch Substances 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- ZWLIYXJBOIDXLL-UHFFFAOYSA-N decanedihydrazide Chemical compound NNC(=O)CCCCCCCCC(=O)NN ZWLIYXJBOIDXLL-UHFFFAOYSA-N 0.000 description 2
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- JBKVHLHDHHXQEQ-UHFFFAOYSA-N epsilon-caprolactam Chemical compound O=C1CCCCCN1 JBKVHLHDHHXQEQ-UHFFFAOYSA-N 0.000 description 2
- HYBBIBNJHNGZAN-UHFFFAOYSA-N furfural Chemical compound O=CC1=CC=CO1 HYBBIBNJHNGZAN-UHFFFAOYSA-N 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- IPCSVZSSVZVIGE-UHFFFAOYSA-N hexadecanoic acid Chemical compound CCCCCCCCCCCCCCCC(O)=O IPCSVZSSVZVIGE-UHFFFAOYSA-N 0.000 description 2
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 2
- 150000002431 hydrogen Chemical class 0.000 description 2
- 230000002209 hydrophobic effect Effects 0.000 description 2
- 150000002460 imidazoles Chemical class 0.000 description 2
- ZXEKIIBDNHEJCQ-UHFFFAOYSA-N isobutanol Chemical compound CC(C)CO ZXEKIIBDNHEJCQ-UHFFFAOYSA-N 0.000 description 2
- 150000002596 lactones Chemical class 0.000 description 2
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 2
- 239000011976 maleic acid Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 125000000250 methylamino group Chemical group [H]N(*)C([H])([H])[H] 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 239000004014 plasticizer Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920005906 polyester polyol Polymers 0.000 description 2
- KIDHWZJUCRJVML-UHFFFAOYSA-N putrescine Chemical compound NCCCCN KIDHWZJUCRJVML-UHFFFAOYSA-N 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 150000003377 silicon compounds Chemical class 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000000600 sorbitol Substances 0.000 description 2
- 239000003381 stabilizer Substances 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- KZNICNPSHKQLFF-UHFFFAOYSA-N succinimide Chemical compound O=C1CCC(=O)N1 KZNICNPSHKQLFF-UHFFFAOYSA-N 0.000 description 2
- 239000002562 thickening agent Substances 0.000 description 2
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- DPZSNGJNFHWQDC-ARJAWSKDSA-N (z)-2,3-diaminobut-2-enedinitrile Chemical compound N#CC(/N)=C(/N)C#N DPZSNGJNFHWQDC-ARJAWSKDSA-N 0.000 description 1
- BSSNZUFKXJJCBG-UPHRSURJSA-N (z)-but-2-enediamide Chemical compound NC(=O)\C=C/C(N)=O BSSNZUFKXJJCBG-UPHRSURJSA-N 0.000 description 1
- AVQQQNCBBIEMEU-UHFFFAOYSA-N 1,1,3,3-tetramethylurea Chemical compound CN(C)C(=O)N(C)C AVQQQNCBBIEMEU-UHFFFAOYSA-N 0.000 description 1
- ZXHZWRZAWJVPIC-UHFFFAOYSA-N 1,2-diisocyanatonaphthalene Chemical compound C1=CC=CC2=C(N=C=O)C(N=C=O)=CC=C21 ZXHZWRZAWJVPIC-UHFFFAOYSA-N 0.000 description 1
- GEYOCULIXLDCMW-UHFFFAOYSA-N 1,2-phenylenediamine Chemical compound NC1=CC=CC=C1N GEYOCULIXLDCMW-UHFFFAOYSA-N 0.000 description 1
- WZRRRFSJFQTGGB-UHFFFAOYSA-N 1,3,5-triazinane-2,4,6-trithione Chemical compound S=C1NC(=S)NC(=S)N1 WZRRRFSJFQTGGB-UHFFFAOYSA-N 0.000 description 1
- RTTZISZSHSCFRH-UHFFFAOYSA-N 1,3-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC(CN=C=O)=C1 RTTZISZSHSCFRH-UHFFFAOYSA-N 0.000 description 1
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 1
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 1
- CUDYUNNRMLWYTR-UHFFFAOYSA-N 1-amino-2,2-dimethylcyclopropane-1-carboxylic acid Chemical compound CC1(C)CC1(N)C(O)=O CUDYUNNRMLWYTR-UHFFFAOYSA-N 0.000 description 1
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 description 1
- SYENVBKSVVOOPS-UHFFFAOYSA-N 2,2-bis(hydroxymethyl)butyl prop-2-enoate Chemical compound CCC(CO)(CO)COC(=O)C=C SYENVBKSVVOOPS-UHFFFAOYSA-N 0.000 description 1
- FPZWZCWUIYYYBU-UHFFFAOYSA-N 2-(2-ethoxyethoxy)ethyl acetate Chemical compound CCOCCOCCOC(C)=O FPZWZCWUIYYYBU-UHFFFAOYSA-N 0.000 description 1
- AMCOCUDBDKVWRZ-UHFFFAOYSA-N 2-(2-hydroxyethoxy)phenol Chemical compound OCCOC1=CC=CC=C1O AMCOCUDBDKVWRZ-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- JBCUKQQIWSWEOK-UHFFFAOYSA-N 2-(benzenesulfonyl)aniline Chemical compound NC1=CC=CC=C1S(=O)(=O)C1=CC=CC=C1 JBCUKQQIWSWEOK-UHFFFAOYSA-N 0.000 description 1
- FALRKNHUBBKYCC-UHFFFAOYSA-N 2-(chloromethyl)pyridine-3-carbonitrile Chemical compound ClCC1=NC=CC=C1C#N FALRKNHUBBKYCC-UHFFFAOYSA-N 0.000 description 1
- XWKAVQKJQBISOL-UHFFFAOYSA-N 2-(phenylazaniumyl)propanoate Chemical compound OC(=O)C(C)NC1=CC=CC=C1 XWKAVQKJQBISOL-UHFFFAOYSA-N 0.000 description 1
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 1
- PTJWCLYPVFJWMP-UHFFFAOYSA-N 2-[[3-hydroxy-2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)COCC(CO)(CO)CO PTJWCLYPVFJWMP-UHFFFAOYSA-N 0.000 description 1
- PQAMFDRRWURCFQ-UHFFFAOYSA-N 2-ethyl-1h-imidazole Chemical compound CCC1=NC=CN1 PQAMFDRRWURCFQ-UHFFFAOYSA-N 0.000 description 1
- XSXYESVZDBAKKT-UHFFFAOYSA-N 2-hydroxybenzohydrazide Chemical compound NNC(=O)C1=CC=CC=C1O XSXYESVZDBAKKT-UHFFFAOYSA-N 0.000 description 1
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 1
- TZMACLAARXHRRZ-UHFFFAOYSA-N 2-hydroxypropane-1,2,3-tricarbohydrazide Chemical compound NNC(=O)CC(O)(C(=O)NN)CC(=O)NN TZMACLAARXHRRZ-UHFFFAOYSA-N 0.000 description 1
- MPQPXMRGNQJXGO-UHFFFAOYSA-N 2-hydroxypropane-1,2,3-tricarboxamide Chemical compound NC(=O)CC(O)(C(N)=O)CC(N)=O MPQPXMRGNQJXGO-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- ROHTVIURAJBDES-UHFFFAOYSA-N 2-n,2-n-bis(prop-2-enyl)-1,3,5-triazine-2,4,6-triamine Chemical compound NC1=NC(N)=NC(N(CC=C)CC=C)=N1 ROHTVIURAJBDES-UHFFFAOYSA-N 0.000 description 1
- OVRFOLFTHPVIFF-UHFFFAOYSA-N 3-(2-hydroxyethoxy)-2-[2-[2-hydroxy-6-(2-hydroxyethoxy)phenyl]propan-2-yl]phenol Chemical compound CC(C)(C1=C(C=CC=C1OCCO)O)C2=C(C=CC=C2OCCO)O OVRFOLFTHPVIFF-UHFFFAOYSA-N 0.000 description 1
- ZBMISJGHVWNWTE-UHFFFAOYSA-N 3-(4-aminophenoxy)aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=CC(N)=C1 ZBMISJGHVWNWTE-UHFFFAOYSA-N 0.000 description 1
- VHZWVWGZZQFKCQ-UHFFFAOYSA-N 3-(diaminomethylideneamino)propanamide Chemical compound NC(=O)CCNC(N)=N VHZWVWGZZQFKCQ-UHFFFAOYSA-N 0.000 description 1
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 1
- NDWUBGAGUCISDV-UHFFFAOYSA-N 4-hydroxybutyl prop-2-enoate Chemical compound OCCCCOC(=O)C=C NDWUBGAGUCISDV-UHFFFAOYSA-N 0.000 description 1
- BTJIUGUIPKRLHP-UHFFFAOYSA-N 4-nitrophenol Chemical compound OC1=CC=C([N+]([O-])=O)C=C1 BTJIUGUIPKRLHP-UHFFFAOYSA-N 0.000 description 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- GZVHEAJQGPRDLQ-UHFFFAOYSA-N 6-phenyl-1,3,5-triazine-2,4-diamine Chemical compound NC1=NC(N)=NC(C=2C=CC=CC=2)=N1 GZVHEAJQGPRDLQ-UHFFFAOYSA-N 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- GUBGYTABKSRVRQ-XLOQQCSPSA-N Alpha-Lactose Chemical compound O[C@@H]1[C@@H](O)[C@@H](O)[C@@H](CO)O[C@H]1O[C@@H]1[C@@H](CO)O[C@H](O)[C@H](O)[C@H]1O GUBGYTABKSRVRQ-XLOQQCSPSA-N 0.000 description 1
- XNCOSPRUTUOJCJ-UHFFFAOYSA-N Biguanide Chemical compound NC(N)=NC(N)=N XNCOSPRUTUOJCJ-UHFFFAOYSA-N 0.000 description 1
- 229940123208 Biguanide Drugs 0.000 description 1
- KXDHJXZQYSOELW-UHFFFAOYSA-M Carbamate Chemical compound NC([O-])=O KXDHJXZQYSOELW-UHFFFAOYSA-M 0.000 description 1
- FBPFZTCFMRRESA-KVTDHHQDSA-N D-Mannitol Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-KVTDHHQDSA-N 0.000 description 1
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 description 1
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- 239000004593 Epoxy Substances 0.000 description 1
- 239000004386 Erythritol Substances 0.000 description 1
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- 150000001298 alcohols Chemical class 0.000 description 1
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- 125000002947 alkylene group Chemical group 0.000 description 1
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- 239000001273 butane Substances 0.000 description 1
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- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
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- 239000003054 catalyst Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
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- PBCFZTOCSCULAL-UHFFFAOYSA-N cyclohexanecarboximidamide Chemical compound NC(=N)C1CCCCC1 PBCFZTOCSCULAL-UHFFFAOYSA-N 0.000 description 1
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- 238000006471 dimerization reaction Methods 0.000 description 1
- SWSQBOPZIKWTGO-UHFFFAOYSA-N dimethylaminoamidine Natural products CN(C)C(N)=N SWSQBOPZIKWTGO-UHFFFAOYSA-N 0.000 description 1
- ROORDVPLFPIABK-UHFFFAOYSA-N diphenyl carbonate Chemical class C=1C=CC=CC=1OC(=O)OC1=CC=CC=C1 ROORDVPLFPIABK-UHFFFAOYSA-N 0.000 description 1
- GRGBENNNGZARRZ-UHFFFAOYSA-N dodecanedihydrazide Chemical compound NNC(=O)CCCCCCCCCCC(=O)NN GRGBENNNGZARRZ-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- UNXHWFMMPAWVPI-ZXZARUISSA-N erythritol Chemical compound OC[C@H](O)[C@H](O)CO UNXHWFMMPAWVPI-ZXZARUISSA-N 0.000 description 1
- 229940009714 erythritol Drugs 0.000 description 1
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- 125000000031 ethylamino group Chemical group [H]C([H])([H])C([H])([H])N([H])[*] 0.000 description 1
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- 150000002483 hydrogen compounds Chemical class 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- QZUPTXGVPYNUIT-UHFFFAOYSA-N isophthalamide Chemical compound NC(=O)C1=CC=CC(C(N)=O)=C1 QZUPTXGVPYNUIT-UHFFFAOYSA-N 0.000 description 1
- 150000003951 lactams Chemical class 0.000 description 1
- 239000008101 lactose Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
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- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000011572 manganese Substances 0.000 description 1
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- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- ANGDWNBGPBMQHW-UHFFFAOYSA-N methyl cyanoacetate Chemical compound COC(=O)CC#N ANGDWNBGPBMQHW-UHFFFAOYSA-N 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- LSHROXHEILXKHM-UHFFFAOYSA-N n'-[2-[2-[2-(2-aminoethylamino)ethylamino]ethylamino]ethyl]ethane-1,2-diamine Chemical compound NCCNCCNCCNCCNCCN LSHROXHEILXKHM-UHFFFAOYSA-N 0.000 description 1
- WHIVNJATOVLWBW-UHFFFAOYSA-N n-butan-2-ylidenehydroxylamine Chemical compound CCC(C)=NO WHIVNJATOVLWBW-UHFFFAOYSA-N 0.000 description 1
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- ZWLFGLCGZUVIEA-UHFFFAOYSA-N nonanedihydrazide Chemical compound NNC(=O)CCCCCCCC(=O)NN ZWLFGLCGZUVIEA-UHFFFAOYSA-N 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- PRCNQQRRDGMPKS-UHFFFAOYSA-N pentane-2,4-dione;zinc Chemical compound [Zn].CC(=O)CC(C)=O.CC(=O)CC(C)=O PRCNQQRRDGMPKS-UHFFFAOYSA-N 0.000 description 1
- JMIWEBTUNLDJLA-UHFFFAOYSA-N pentanediimidamide Chemical compound NC(=N)CCCC(N)=N JMIWEBTUNLDJLA-UHFFFAOYSA-N 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 1
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- 229920000642 polymer Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
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- HNJBEVLQSNELDL-UHFFFAOYSA-N pyrrolidin-2-one Chemical compound O=C1CCCN1 HNJBEVLQSNELDL-UHFFFAOYSA-N 0.000 description 1
- 238000007151 ring opening polymerisation reaction Methods 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- DUIOPKIIICUYRZ-UHFFFAOYSA-N semicarbazide Chemical compound NNC(N)=O DUIOPKIIICUYRZ-UHFFFAOYSA-N 0.000 description 1
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- 229940014800 succinic anhydride Drugs 0.000 description 1
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- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 239000005061 synthetic rubber Substances 0.000 description 1
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- 235000002906 tartaric acid Nutrition 0.000 description 1
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- FAGUFWYHJQFNRV-UHFFFAOYSA-N tetraethylenepentamine Chemical compound NCCNCCNCCNCCN FAGUFWYHJQFNRV-UHFFFAOYSA-N 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
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- 238000005829 trimerization reaction Methods 0.000 description 1
- ODHXBMXNKOYIBV-UHFFFAOYSA-N triphenylamine Chemical compound C1=CC=CC=C1N(C=1C=CC=CC=1)C1=CC=CC=C1 ODHXBMXNKOYIBV-UHFFFAOYSA-N 0.000 description 1
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- 235000014692 zinc oxide Nutrition 0.000 description 1
- DVSILEVINNCNTQ-UHFFFAOYSA-L zinc;3-oxobutanoate Chemical compound [Zn+2].CC(=O)CC([O-])=O.CC(=O)CC([O-])=O DVSILEVINNCNTQ-UHFFFAOYSA-L 0.000 description 1
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Landscapes
- Adhesives Or Adhesive Processes (AREA)
- Sealing Material Composition (AREA)
- Polyurethanes Or Polyureas (AREA)
- Paints Or Removers (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、−波型熱硬化性組成物に関し、特に、接着剤
、シーリング材、塗料、樹脂成形体などの用途に適した
貯蔵可能な一液型熱硬化性組成物に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a corrugated thermosetting composition, particularly a storable composition suitable for use in adhesives, sealants, paints, resin moldings, etc. This invention relates to a one-component thermosetting composition.
従来、ポリイソシアネート化合物と活性水素を有する化
合物、例えばポリオール化合物とからなる熱硬化性組成
物は、それぞれを別に貯蔵し、使用直前に混合して使用
する2液型として用いられてきた。しかし、この2液型
の組成物は使用前に混合する操作が必要なこと、および
それぞれの成分の混合比を常に一定に保つことが困難な
ことなどの欠点があるため、ポリイソシアネート化合物
と活性水素を有する化合物を予め混合した形の一液型の
組成物が検討されている。Conventionally, thermosetting compositions consisting of a polyisocyanate compound and a compound having active hydrogen, such as a polyol compound, have been used as a two-component type in which the two components are stored separately and mixed immediately before use. However, this two-component composition has drawbacks such as the need for mixing before use and the difficulty of keeping the mixing ratio of each component constant. One-component compositions in which hydrogen-containing compounds are premixed are being considered.
この−波型の組成物として、芳香族ポリイソシアネート
化合物の液状プレポリマー中に固形ボリヒドロキン化合
物を分散させてなるものが特公昭61.−26927号
公報に、有機ポリイソシアネートとジフェニルアニリン
の金属錯体からなるものが特開昭56−26922号公
報および特開昭57−177014号公報に開示されて
いる。This wave-type composition is prepared by dispersing a solid polyhydroquine compound in a liquid prepolymer of an aromatic polyisocyanate compound. JP-A No. 26927-26927, and those comprising metal complexes of organic polyisocyanate and diphenylaniline are disclosed in JP-A-56-26922 and JP-A-57-177014.
しかしながら、特公昭61−26927号公報に記載の
組成物は、貯蔵安定性が低く、かつ硬化のために130
℃以上もの高温を必要とするという問題があり、特開昭
56−26922号公報および特開昭57177014
号公報に記載の組成物も、約1ケ月程度貯蔵すると熱硬
化能を失ってしまうという問題があった。However, the composition described in Japanese Patent Publication No. 61-26927 has low storage stability and requires 130
There is a problem that a high temperature of ℃ or higher is required, and Japanese Patent Application Laid-Open No. 56-26922 and Japanese Patent Application Laid-open No. 57177014
The composition described in the publication also had a problem in that it lost its thermosetting ability when stored for about one month.
本発明は、以上の如き問題点を解決し、貯蔵安定性が高
く、かつ硬化温度の低い一液型熱硬化性組成物を提供す
ることを目的とする。An object of the present invention is to solve the above-mentioned problems and provide a one-component thermosetting composition that has high storage stability and a low curing temperature.
以上の問題点は、本発明(1)によれば、(A)ポリイ
ソシアネート化合物に、
(B)[1]ヒドラジノ基、第一アミド基、第一チオア
ミド基およびスルファモイル基から選ばれる少なくとも
一種の官能基を有する固形の多官能化合物、
■アミジノ基を有する固形の化合物、
ならびに
■複素環および複数の活性水素を有する固形の化合物
から選ばれる少なくとも1種の化合物
が分散されてなることを特徴とする一液型熱硬化性組成
物により、
また本発明(2)によれば、
(A)ポリイソシアネート化合物と高沸点極性化合物か
らなる混合物に、
(B)活性水素を有する固形の多官能化合物が分散され
てなることを特徴とする一液型熱硬化性組成物により、
解決される。According to the present invention (1), the above problem can be solved by adding at least one type of sulfamoyl group to the (A) polyisocyanate compound; A solid polyfunctional compound having a functional group; (1) a solid compound having an amidino group; and (2) a solid compound having a heterocycle and a plurality of active hydrogens. According to the present invention (2), (B) a solid polyfunctional compound having active hydrogen is added to (A) a mixture of a polyisocyanate compound and a high-boiling polar compound. With a one-component thermosetting composition characterized by being dispersed,
resolved.
本発明(1)および(2)の組成物において用いられる
(A)成分であるポリイソシアネート化合物は、分子中
に複数の、好ましくは2〜3個のイソシアネート基を有
する化合物である。このポリイソシアネート化合物とし
ては、例えば脂肪族、芳香族、脂環式などの各種のポリ
イソシアネート化合物を用いることができる。The polyisocyanate compound which is the component (A) used in the compositions of the present invention (1) and (2) is a compound having a plurality of isocyanate groups, preferably 2 to 3 isocyanate groups in the molecule. As this polyisocyanate compound, various polyisocyanate compounds such as aliphatic, aromatic, and alicyclic polyisocyanate compounds can be used.
斯かるポリイソシアネート化合物としては、例えばキシ
リレンジイソシアネート、ポリフェニルメタンジイソシ
アネート、4,4′−ジフェニルメタンジイソシアネー
ト、インホロンジイソシアネート、トリレンジイソシア
ネート、ヘキサメチレンジイソシアネート、ナフタレン
ジイソシアネート、水添ジフェニルメタンジイソシアネ
ート、水添キシリレンジイソシアネート、ジシクロヘキ
シルメタンジイソシア不一トなどのジイソシアネート化
合物、あるいはこれらの重合物を挙げることができ、さ
らに、分子内にアロファネート結合、イソ/アネ−ト結
合、カルボジイミド結合などを含有し、分子中に複数の
インシアネート基を有する化合物、例えば上記ジイソシ
アネート化合物の二1化物や三里化物、ポリメリックジ
フェニルメタンジイソシアネートなどを用いることもで
きる。Examples of such polyisocyanate compounds include xylylene diisocyanate, polyphenylmethane diisocyanate, 4,4'-diphenylmethane diisocyanate, inphorone diisocyanate, tolylene diisocyanate, hexamethylene diisocyanate, naphthalene diisocyanate, hydrogenated diphenylmethane diisocyanate, and hydrogenated xylylene diisocyanate. Examples include diisocyanate compounds such as isocyanate, dicyclohexylmethane diisocyanate, and polymers thereof, and furthermore, they contain allophanate bonds, iso/anate bonds, carbodiimide bonds, etc. in the molecule. It is also possible to use compounds having a plurality of incyanate groups, such as the diisocyanate compound, the trichloride compound, and the polymeric diphenylmethane diisocyanate.
更にまた、本発明(1)および(2)におけるポリイソ
シアネート化合物は、ポリオール化合物、ポリアミン化
合物などの活性水素を含有する活性水素化合物を反応さ
せて得られる、分子中に複数のイソ/アネート基を有す
るプレポリマーの形態で用いることもできる。斯かるプ
レポリマーは、例えば上記のようなポリイソシアネート
化合物と、活性水素化合物とを、例えば20〜90℃で
1〜6時間反応させることによって得ることができる。Furthermore, the polyisocyanate compounds in the present invention (1) and (2) have multiple iso/anate groups in the molecule, which are obtained by reacting active hydrogen compounds containing active hydrogen such as polyol compounds and polyamine compounds. It can also be used in the form of a prepolymer. Such a prepolymer can be obtained, for example, by reacting a polyisocyanate compound as described above and an active hydrogen compound at, for example, 20 to 90°C for 1 to 6 hours.
このようなプレポリマーを得るためにポリイソシアネー
ト化合物と反応させるポリオール化合物の具体例として
は、エチレングリコール、プロピレングリコーノベポリ
エチレングリコール、ポリプロピレングリコール、Lリ
メチロールプロパン、ジエチレングリコール、トリエチ
レングリコーノペヘキサメチレングリコーノペグリセリ
ン、1.3ブチレングリコーノペ1,4−ブタンジオー
ノペヘキサントリオール、ペンクエリスリトール誘導体
、ソルビトール、ネオペンチルグリコールなどの多価ア
ルコール類;前記多価アルコール頌と、エチレンオキサ
イド、プロピレンオキサイドなどのアルキレンオキサイ
ドとの付加重合により得られるポリエーテルポリオール
;前記多価アルコール類と、マレイン酸、コハク酸、ア
ジピン酸、セバシン酸、酒石酸、テレフタル酸、イソフ
タル酸などの多塩基酸類との縮合反応により得られるポ
リエステルポリオール;ε−カプロラクトン、γ−バレ
ロラクトンなどのラクトン類の開環重合により得られる
ポリエステルポリオール;アクリル酸ヒドロキシエチル
、アクリル酸ヒドロキシブチル、トリメチロールプロパ
ンモノアクリレートナトの水酸基を含有する重合性モノ
マーを単独で重合して、またはこれらと共重合可能なモ
ノマー、例えばアクリル酸、メタクリル酸、スチレン、
アクリロニトリjlz、α−メチルスチレンなどとを共
重合して得られるアクリルポリオール;ヒマシ油もしく
はその誘導体;両末端にエポキシ基を有するエポキシ樹
脂と、モノエタノールアミン、ジェタノールアミンなど
とを反応させて得られるエポキシポリオールなどを挙げ
ることができる。Specific examples of polyol compounds reacted with polyisocyanate compounds to obtain such prepolymers include ethylene glycol, propylene glycol, polyethylene glycol, polypropylene glycol, L-rimethylolpropane, diethylene glycol, triethylene glycol, and pehexamethylene glycol. Polyhydric alcohols such as nopeglycerin, 1,3 butylene glyconope 1,4-butane dionopehexanetriol, penquerythritol derivatives, sorbitol, neopentyl glycol; the above polyhydric alcohols, ethylene oxide, propylene oxide Polyether polyols obtained by addition polymerization with alkylene oxides such as; condensation reaction of the polyhydric alcohols with polybasic acids such as maleic acid, succinic acid, adipic acid, sebacic acid, tartaric acid, terephthalic acid, and isophthalic acid. Polyester polyol obtained by ring-opening polymerization of lactones such as ε-caprolactone and γ-valerolactone; Polymerization containing hydroxyl groups of hydroxyethyl acrylate, hydroxybutyl acrylate, and trimethylolpropane monoacrylate monomers that can be polymerized alone or copolymerized with these monomers, such as acrylic acid, methacrylic acid, styrene,
Acrylic polyol obtained by copolymerizing acrylonitrile, α-methylstyrene, etc.; Castor oil or its derivatives; Acrylic polyol obtained by reacting an epoxy resin having epoxy groups at both ends with monoethanolamine, jetanolamine, etc. Examples include epoxy polyols.
また、プレポリマーを得るためにポリイソシアネート化
合物と反応させるポリアミン化合物の具体例としては、
エチレンジアミン、ジエチレントリアミン、トリエチレ
ンテトラミン、テトラエチレンペンタミン、ペンタエチ
レンへキサミン、テトラメチレンジアミン、ペンタメチ
レンジアミン、ヘキサメチレンジアミン、シクロヘキシ
レンジアミン、インホロンジアミン、メラミンおよびこ
れらの誘導体などの脂肪族ポリアミン化合物;0フエニ
レンジアミン、m−フェニレンジアミン、p−フェニレ
ンジアミン、4.4°−ジアミノジフェニルメタン、4
.4’ −’;アミノジフェニルスルホン、4.4°−
ジアミノジフェニルエーテル、2.4−ジアミノジフェ
ニルアミン、1.5−ジアミノナフタレン、1.8−ジ
アミノナフタレン、2.4−ジアミノトルエンなどの芳
香族ポリアミン化合物を挙げることができる。In addition, specific examples of polyamine compounds to be reacted with polyisocyanate compounds to obtain prepolymers include:
Aliphatic polyamine compounds such as ethylenediamine, diethylenetriamine, triethylenetetramine, tetraethylenepentamine, pentaethylenehexamine, tetramethylenediamine, pentamethylenediamine, hexamethylenediamine, cyclohexylenediamine, inphorondiamine, melamine and derivatives thereof; 0 phenylene diamine, m-phenylene diamine, p-phenylene diamine, 4.4°-diaminodiphenylmethane, 4
.. 4'-'; aminodiphenyl sulfone, 4.4°-
Aromatic polyamine compounds such as diaminodiphenyl ether, 2.4-diaminodiphenylamine, 1.5-diaminonaphthalene, 1.8-diaminonaphthalene, and 2.4-diaminotoluene can be mentioned.
上記のように、分子中に複数のインシアネート基を有す
るプレポリマーを形成する活性水素化合物としてポリオ
ール化合物を用いた場合には、そのポリオール化合物の
分子量は好ましくは10.000以下、特に好ましくは
1,000〜7.000であり、この場合には得られる
組成物を硬化した際に強靭でかつ弾性のある硬化樹脂が
得られる。As mentioned above, when a polyol compound is used as an active hydrogen compound to form a prepolymer having a plurality of incyanate groups in the molecule, the molecular weight of the polyol compound is preferably 10.000 or less, particularly preferably 1. ,000 to 7.000, and in this case, when the resulting composition is cured, a tough and elastic cured resin can be obtained.
本発明(1)および(2)において、ポリイソシアネー
ト化合物は単独でもしくは2種以上を組み合わせて用い
ることができる。In the present inventions (1) and (2), the polyisocyanate compounds can be used alone or in combination of two or more.
さらに、本発明(1)および(2)におけるポリイソシ
アネート化合物において、全イソシアネート基の全ポリ
イソシアネート化合物に対する割合が2〜20重量%、
特に3〜15重景%であることが好ましく、この場合に
は、得られる組成物が比較的低い温度で硬化可能なもの
となり、しかも貯蔵安定性をさらに高く保つことができ
る。Furthermore, in the polyisocyanate compounds in the present invention (1) and (2), the ratio of all isocyanate groups to the total polyisocyanate compound is 2 to 20% by weight,
In particular, it is preferably 3 to 15% by weight; in this case, the resulting composition can be cured at a relatively low temperature, and can maintain even higher storage stability.
なお、本発明(1)および(2)においては、ポリイソ
シアネート化合物のイソシアネート基の全部あるいは一
部がブロックされていてもよい。In addition, in the present inventions (1) and (2), all or part of the isocyanate groups of the polyisocyanate compound may be blocked.
このイソシアネート基のブロックのためのブロック剤の
例としては、エタノール、プロパツール、ブタノール、
イソブタノールなどのアルコール類;フェノール、クレ
ゾール、キシレノール、p−ニトロフェノールなどのフ
ェノール類;マロン酸エチル、アセト酢酸エチノペアセ
チルアセトンなどのカルボニル化合物類;アセトアミド
、アクリルアミドなどの酸アミド類;コハク酸イミド、
マレイン酸イミドなどの酸イミド類;2−エチルイミダ
ゾール、2−エチル−4−メチルイミダゾールなどのイ
ミダゾール類;2−ピロリドン、ε−カプロラクタムな
どのラクタム類;アセトキシム、メチルエチルケトキシ
ム、ジアセチルモノオキシム、シクロヘキサノンオキシ
ムなどのオキシム類;その他を挙げることができる。Examples of blocking agents for blocking this isocyanate group include ethanol, propatool, butanol,
Alcohols such as isobutanol; Phenols such as phenol, cresol, xylenol, and p-nitrophenol; Carbonyl compounds such as ethyl malonate and acetoacetate etynopearacetylacetone; Acid amides such as acetamide and acrylamide; Succinimide,
Acid imides such as maleic imide; imidazoles such as 2-ethylimidazole and 2-ethyl-4-methylimidazole; lactams such as 2-pyrrolidone and ε-caprolactam; acetoxime, methyl ethyl ketoxime, diacetyl monoxime, cyclohexanone oxime oximes such as; and others.
これらのブロック剤は、ポリイソシアネート化合物と、
通常の方法、例えばブロック剤を溶解する活性水素を含
有しない溶媒中または無溶媒下において、室温〜80℃
の温度で0.5〜5時間時間圧応させればよい。These blocking agents include polyisocyanate compounds and
A normal method, for example, in a solvent that does not contain active hydrogen that dissolves the blocking agent or in the absence of a solvent, from room temperature to 80°C.
Pressure reaction may be carried out at a temperature of 0.5 to 5 hours.
これらのブロックされたポリイソシアネート化合物は、
加熱時にインシアネート基を生成するものである。These blocked polyisocyanate compounds are
It produces incyanate groups upon heating.
本発明(1)において、(B)成分として使用すること
のできるものは、
■ヒドラジノ基、第一アミド基、第一チオアミド基およ
びスルファモイル基から選ばれる少なくとも一種の官能
基を有する固形の多官能化合物、■アミジノ基を有する
固形の化合物、
ならびに
■複素環および複数の活性水素を有する固形の化合物
から選ばれる少なくとも1種の化合物(以下、これを「
特定固形化合物」という)である。In the present invention (1), those that can be used as component (B) are: (1) solid polyfunctional having at least one functional group selected from a hydrazino group, a primary amide group, a primary thioamide group, and a sulfamoyl group; (hereinafter referred to as "
"Specified Solid Compounds").
上記ヒドラジノ基、第一アミド基、第一チオアミド基お
よびスルファモイル基から選ばれる少なくとも一種の官
能基を有する固形の多官能化合物は、これらの基以外に
インシアネート基と反応性を有する基、例えばアミノ基
、水酸基などを有していてもよい。また、上記アミジノ
基を有する固形の化合物もインシアネート基と反応性を
有する基を有していてもよい。The solid polyfunctional compound having at least one functional group selected from the above-mentioned hydrazino group, primary amide group, primary thioamide group, and sulfamoyl group contains, in addition to these groups, a group reactive with an incyanate group, such as an amino group. It may have a group, a hydroxyl group, etc. Further, the above-mentioned solid compound having an amidino group may also have a group reactive with an incyanate group.
ヒドラジノ基を有する固形の多官能化合物の例としては
、コハク酸ジヒドラジド、アジピン酸ジヒドラジド、セ
バンン酸ジヒドラジド、ドデカン二酸ジヒドラジド、ヘ
キサデカンニ酸ジヒドラジド、エイコサンニ酸ジヒドラ
ジド、カルボン酸ジヒドラジド、アゼライン酸ジヒドラ
ジド、シュウ酸ジヒドラジド、イソフタル酸ジヒドラジ
ド、テレフタル酸ジヒドラジド、ヘキサヒドロイソフタ
ル酸ジヒドラジド、ヘキサヒドロテレフタル酸ジヒドラ
ジド、メチルアミノジプロピオン酸ジヒドラジド、フェ
ニルアミノプロピオン酸ジヒドラジド、メチルアミノジ
酪酸ジヒドラジド、エチルアミノジ吉草酸ジヒドラジド
、1.3−ビス(ヒドラジノカルボエチル)−5−イソ
プロピルヒダントインなどの分子内に2個のヒドラジノ
基を有する化合物:クエン酸トリヒドラジド、シクロヘ
キサントリカルボン酸トリヒドラジドなどの分子内に3
個以上のヒドラジノ基を有する化合物;セミカルバジド
などの分子内にヒドラジノ基とアミノ基とを有する化合
物;サリチル酸ヒドラジド、p−オキシ安息香酸ヒドラ
ジドなどの分子内にヒドラジノ基と水酸基を有する化合
物を挙げることができ第一アミド基を有する固形の多官
能化合物の例としては、コハク酸ジアミド、アジピン酸
ジアミド、マレイン酸ジアミド、マロン酸ジアミド、セ
バンン酸ジアミド、ドデカンニ酸ジアミド、ヘキサデカ
ンニ酸ジアミド、エイコサンニ酸ジアミド、ビウレット
、イソフタル酸ジアミドなどの分子内に2個以上の第一
アミド基を有する化合物;クエン酸トリアミド、シクロ
ヘキサントリカルボン酸トリアミドなどの分子内に3個
以上の第一アミド基を有する化合物;尿素などの分子内
に第一アミド基とアミノ基とを有する化合物;オキサミ
ックヒドラジドなどの分子内にヒドラジノ基と第一アミ
ド基とを有する化合物を挙げることができる。Examples of solid polyfunctional compounds having a hydrazino group include succinic acid dihydrazide, adipic acid dihydrazide, sebanic acid dihydrazide, dodecanedioic acid dihydrazide, hexadecanedioic acid dihydrazide, eicosaniic acid dihydrazide, carboxylic acid dihydrazide, azelaic acid dihydrazide, and oxalic acid dihydrazide. Dihydrazide, isophthalic acid dihydrazide, terephthalic acid dihydrazide, hexahydroisophthalic acid dihydrazide, hexahydroterephthalic acid dihydrazide, methylamino dipropionic acid dihydrazide, phenylaminopropionic acid dihydrazide, methylamino dibutyric acid dihydrazide, ethylamino divaleric acid dihydrazide, 1,3-bis( Compounds with two hydrazino groups in the molecule such as hydrazinocarboethyl-5-isopropylhydantoin; compounds with 3 hydrazino groups in the molecule such as citric acid trihydrazide and cyclohexanetricarboxylic acid trihydrazide
Compounds having more than 3 hydrazino groups; Compounds having a hydrazino group and an amino group in the molecule such as semicarbazide; Compounds having a hydrazino group and a hydroxyl group in the molecule such as salicylic acid hydrazide and p-oxybenzoic acid hydrazide. Examples of solid polyfunctional compounds having primary amide groups include succinic acid diamide, adipic acid diamide, maleic acid diamide, malonic acid diamide, sebanic acid diamide, dodecanoic acid diamide, hexadecanoic acid diamide, eicosanniic acid diamide, Compounds having two or more primary amide groups in the molecule such as biuret and isophthalic acid diamide; Compounds having three or more primary amide groups in the molecule such as citric acid triamide and cyclohexanetricarboxylic acid triamide; Compounds having a primary amide group and an amino group in the molecule; Compounds having a hydrazino group and a primary amide group in the molecule, such as oxamic hydrazide.
第一チオアミド基を有する固形の多官能化合物の例とし
ては、コハク酸ジチオアミド、アジピン酸ジチオアミド
、マレイン酸ジチオアミド、マロン酸ジチオアミド、セ
バシン酸ジチオアミド、ドデカンニ酸ジチオアミド、ヘ
キサデカンニ酸ジチオアミド、エイコサンニ酸ジチオア
ミド、イソフタル酸ジチオアミドなどの分子内に2個以
上の第一チオアミド基を有する化合物;クエン酸トリチ
オアミド、シクロヘキサントリカルボン酸トリチオアミ
ドなどの分子内に3個以上の第一チオアミド基を有する
化合物、チオ尿素などの分子内に第一チオアミド基とア
ミン基とを有する化合物を挙げることができる。Examples of solid polyfunctional compounds having primary thioamide groups include succinic acid dithioamide, adipic acid dithioamide, maleic acid dithioamide, malonic acid dithioamide, sebacic acid dithioamide, dodecanoic acid dithioamide, hexadecaniic acid dithioamide, eicosanniic acid dithioamide, and isophthalic acid dithioamide. Compounds having two or more primary thioamide groups in the molecule such as acid dithioamide; compounds having three or more primary thioamide groups in the molecule such as citric acid trithioamide and cyclohexanetricarboxylic acid trithioamide; thiourea, etc. Examples include compounds having a primary thioamide group and an amine group in the molecule.
スルファモイル基を有する固形の多官能化合物の例とし
ては、ブタンジスルファミド、ヘキサンジスルファミド
、ベンゼンジスルファミドなどの分子内に2個以上のス
ルファモイル基を有する化合物を挙げることができる。Examples of solid polyfunctional compounds having sulfamoyl groups include compounds having two or more sulfamoyl groups in the molecule, such as butane disulfamide, hexane disulfamide, benzenedisulfamide, and the like.
アミジノ基を有する固形の化合物の例としては、ジシア
ンジアミド、シクロヘキサンカルボキサミジンなどの分
子内に1個のアミジノ基を有する化合物:ペンタンジア
ミジン、オキサルシアミジン、イソフタルシアミジン、
ビグアニドなどの分子内に2個のアミジノ基ををする化
合物;1133−プロパンテトラカルボキサミジンなど
の分子内に3個以上のアミジノ基を有する化合物;グア
ニジンなどの分子内にアミジノ基とアミン基を有する化
合物;3−グアニジノプロピオナミドなどの分子内にア
ミジノ基と第一アミド基を有する化合物を挙げることが
できる。Examples of solid compounds having an amidino group include compounds having one amidino group in the molecule such as dicyandiamide and cyclohexanecarboxamidine; pentanediamidine, oxalcyamidine, isophthalcyamidine;
Compounds with two amidino groups in the molecule such as biguanide; Compounds with three or more amidino groups in the molecule such as 1133-propanetetracarboxamidine; Compounds with an amidino group and an amine group in the molecule such as guanidine. Compounds having an amidino group and a primary amide group in the molecule, such as 3-guanidinopropionamide.
複s1!および複数の活性水素を有する固形の化合物は
、活性水素を有する基としてアミノ基を有することが好
ましく、例えばメラミン、モノメチロールメラミン、ジ
アリルメラミン、アミノイミダゾイルメラミン、2.4
−ジアミノ−6−[2メチルイミダゾリル−(1)コー
エチルトリアジン、2.4−ジアミノ−6−[2−エチ
ル−4−メチルイミダゾリル−(1)]−二エチルリア
ジン、2.4ジアミノ−6−[2−ウンデシルイミダゾ
リル−(1) ]−二エチルリアジン、ベンゾグアナミ
ン、トリチオシアヌル酸およびこれらの誘導体などを挙
げることができる。Multiple s1! The solid compound having a plurality of active hydrogens preferably has an amino group as a group having active hydrogen, such as melamine, monomethylolmelamine, diallylmelamine, aminoimidazoylmelamine, 2.4
-Diamino-6-[2methylimidazolyl-(1) coethyltriazine, 2,4-diamino-6-[2-ethyl-4-methylimidazolyl-(1)]-diethylriazine, 2.4diamino-6- Examples include [2-undecylimidazolyl-(1)]-diethylriazine, benzoguanamine, trithiocyanuric acid, and derivatives thereof.
上記(B)成分のうち、好ましい特定固形化合物として
は、アジピン酸ジヒドラジド、エイコサンニ酸ジヒドラ
ジド、メラミン、アミノイミダゾイルメラミンなどを挙
げることができる。Among the above components (B), preferred specific solid compounds include adipic dihydrazide, eicosanniic acid dihydrazide, melamine, aminoimidazoyl melamine, and the like.
本発明(1)において、特定固形化合物は単独でもしく
は2種以上を組み合わせて用いることができる。In the present invention (1), the specific solid compounds can be used alone or in combination of two or more.
特定固形化合物は、(A)成分の有するインシアネート
基と、当該特定固形化合物の有するインシアネート基と
反応性を有する基の総看が、当量比で、通常0.3〜5
、好ましくは0.5〜3(インシアネート基/イソシア
ネートと反応性を有する基)となるように使用する。The specific solid compound has an equivalent ratio of the incyanate group of component (A) and the groups reactive with the incyanate group of the specific solid compound, usually 0.3 to 5.
, preferably 0.5 to 3 (incyanate group/group reactive with isocyanate).
また、本発明(1)においては、上記の化合物と共に、
ヒドラジノ基、第一アミド基、第一チオアミド基、スル
ファモイル基、アミジノ基および複素環を有さない固形
のポリヒドロキシ化合物を併用してもよい。この固形の
ポリヒドロキシ化合物を併用する場合において、インシ
アネート基と水酸基との当量比(インシアネート基/水
酸基)は2.5以上であることが好ましい。この当量比
が2.5未満では水酸基の割合が増大することとなり、
得られる組成物の貯蔵安定性が低下することとなる。こ
こで、固形のポリヒドロキシ化合物とじては、ペンタエ
リスリトール、ジペンタエリスリトール、トリペンタエ
リストール、コーンでんぷんのメチルアルファグルコシ
ド、コーンでんぷん、ショ糖、ラクトース、d−マンニ
トール、無水ソルビトール、ドゥルシトール、エリスリ
トール、イソプロピリデン−ビス(β−ヒドロキシエト
キシフェノール)、1.4−ジ(β−ヒドロキシエトキ
ン)フェノール、5−メチロール−5−エチル−2−(
1,1−ジメチル−2−ヒドロキシエチル)−1゜3−
ジオキサン、5,5−ジメチロール−2−(11ジメチ
ル−2−ヒドロキシエチル)−1,3−ジオキサンなど
を挙げることができる。In addition, in the present invention (1), together with the above compound,
A solid polyhydroxy compound having no hydrazino group, primary amide group, primary thioamide group, sulfamoyl group, amidino group, or heterocycle may be used in combination. When this solid polyhydroxy compound is used in combination, the equivalent ratio of incyanate groups to hydroxyl groups (incyanate groups/hydroxyl groups) is preferably 2.5 or more. If this equivalent ratio is less than 2.5, the proportion of hydroxyl groups will increase,
The storage stability of the resulting composition will be reduced. Here, solid polyhydroxy compounds include pentaerythritol, dipentaerythritol, tripentaerythritol, corn starch methyl alpha glucoside, corn starch, sucrose, lactose, d-mannitol, anhydrous sorbitol, dulcitol, erythritol, Isopropylidene-bis(β-hydroxyethoxyphenol), 1,4-di(β-hydroxyethoxyphenol)phenol, 5-methylol-5-ethyl-2-(
1,1-dimethyl-2-hydroxyethyl)-1゜3-
Examples include dioxane, 5,5-dimethylol-2-(11 dimethyl-2-hydroxyethyl)-1,3-dioxane, and the like.
本発明(1)における特定固形化合物は、得られる組成
物の硬化温度以上の融点、例えば60℃以上の融点を持
つことが好ましいが、硬化が通常、80〜200℃で行
われることから、85〜200℃程度の融点を有する化
合物が特に好ましい。The specific solid compound in the present invention (1) preferably has a melting point higher than the curing temperature of the resulting composition, for example, 60°C or higher, but since curing is usually performed at 80 to 200°C, Particularly preferred are compounds having a melting point of about ~200°C.
また、本発明(1)において、特定固形化合物はポリイ
ソシアネート化合物中に分散されるものであるため、微
細に粉砕されていることが好ましく、特に50μ程度以
下の粒度を有する場合には、硬化樹脂が強靭性および弾
性の優れたものとなる。In addition, in the present invention (1), since the specific solid compound is dispersed in the polyisocyanate compound, it is preferable that it is finely pulverized, and in particular, when it has a particle size of about 50μ or less, it can be used in the cured resin. has excellent toughness and elasticity.
本発明(1)の組成物には、必要に応じて硬化促進剤を
加えてもよい。ただし、室温においてポリイソンアネー
ト化合物の硬化や二量体化および三量体化を促進する作
用のある触媒は、組成物の貯蔵安定性を低下させるので
好ましくない。ここで、硬化促進剤の例としては、■、
8−ジアザ−ジシクロ(5,4,0) ウンデセン−
7(以下rDBUJと記す)の塩類、例えばオルソフタ
ル酸モノDBU塩、アジピン酸モノDBU塩、フェノー
ルノボラック樹脂の部分DBU塩などのDBU塩類;鉄
(I)アセチルアセトナート、マンガン(II[)アセ
チルアセトナート、亜鉛(II)アセチルアセトナート
などのアセチルアセトナート類;2−メチルイミダゾー
ノペ2−ヘプタデシルイミダゾールなどのイミダゾール
類;エポキシ樹脂の硬化促進剤を挙げることができる。A curing accelerator may be added to the composition of the present invention (1), if necessary. However, catalysts that promote curing, dimerization, and trimerization of the polyisonanate compound at room temperature are not preferred because they reduce the storage stability of the composition. Here, examples of curing accelerators include ■,
8-Diaza-dicyclo(5,4,0) undecene-
7 (hereinafter referred to as rDBUJ), DBU salts such as orthophthalic acid mono DBU salt, adipic acid mono DBU salt, partial DBU salt of phenol novolac resin; iron (I) acetylacetonate, manganese (II [) acetylacetonate] Examples include acetylacetonates such as acetylacetonate and zinc (II) acetylacetonate; imidazoles such as 2-methylimidazonope-2-heptadecyl imidazole; and curing accelerators for epoxy resins.
これらの硬化促進剤は市販品としてもで入手することが
でき、例えばr U −CATSA−821J、rU−
CAT 5A−831J、rU−CAT5A−841J
、rU−CATS^−851J(以上、すべてサンアプ
ロ■製)などを挙げることもできる。These curing accelerators are also available as commercial products, such as rU-CATSA-821J, rU-
CAT5A-831J, rU-CAT5A-841J
, rU-CATS^-851J (all of the above are manufactured by San-Apro ■), and the like.
また本発明(1)の組成物には、必要に応じて充填剤を
加えることができる。充填剤の例としては、タルク、炭
酸カルシウム、クレイ、合成シリカ、合成ゼオライト、
ベントナイト、亜鉛華、二酸化チタン、乾燥カーボンブ
ラック、ガラス粒子、およびこれらを表面処理したもの
を挙げることができる。Further, a filler can be added to the composition of the present invention (1) if necessary. Examples of fillers include talc, calcium carbonate, clay, synthetic silica, synthetic zeolite,
Examples include bentonite, zinc white, titanium dioxide, dry carbon black, glass particles, and surface-treated products of these.
これらの充填剤の中で、本発明(1)の組成物の加熱硬
化時のブレを防止するものとしては、合成シリカが好ま
しく、中でも表面が有機シリコン化合物で処理された疎
水性シリカが、本発明(1)の組成物の性質を変化させ
ることなく、特に好ましい。Among these fillers, synthetic silica is preferred as a filler that prevents blurring during heat curing of the composition of the present invention (1), and among these, hydrophobic silica whose surface has been treated with an organic silicon compound is preferred. It is particularly preferred without changing the properties of the composition of invention (1).
以上の他に、本発明(1)の組成物には、必要に応じて
着色剤、安定剤、可塑剤、増粘剤などを添加することが
できる。In addition to the above, colorants, stabilizers, plasticizers, thickeners, etc. can be added to the composition of the present invention (1), if necessary.
本発明(2)の組成物において(A)成分を組成する高
沸点極性化合物は、得られる組成物を硬化させるための
温度以下の融点を有するものであり、かつ硬化温度以下
あるいは当該組成物の使用温度以下の温度で蒸発しない
沸点、例えば140℃以上の沸点を有するものであるこ
とが望ましい。The high-boiling polar compound constituting component (A) in the composition of the present invention (2) has a melting point below the temperature for curing the resulting composition, and has a melting point below the curing temperature or the temperature of the composition. It is desirable to have a boiling point that does not evaporate at a temperature below the use temperature, for example, a boiling point of 140° C. or higher.
この高沸点極性化合物を選択することにより、本発明(
2)の組成物の硬化温度および速度を制御することがで
きる。ただし、40℃以下で(B)成分の活性水素を固
形の多官能化合物を容易に溶解する化合物は、貯蔵安定
性の面から高沸点極性化合物として使用することを避け
るべきである。By selecting this high boiling point polar compound, the present invention (
2) The curing temperature and speed of the composition can be controlled. However, from the viewpoint of storage stability, compounds that easily dissolve the active hydrogen component (B) in the solid polyfunctional compound at 40° C. or lower should be avoided as high-boiling polar compounds.
斯かる高沸点極性化合物としては、例えばプロピレンカ
ーボネート、T−ブチロラクトン、T−バレロラクトン
、δ−バレロラクトン、N−メチル−ε−カプロラクタ
ム、N−メチルピロリドン、シクロヘキサノン、フルフ
ラール、N−メチルホルムアミド、N、N−ジメチルア
セトアミド、ジエチレングリコールモノエチルエーテル
アセテート、ジエチレングリコールジアセテート、アセ
トニルアセトン、メチルシアノアセテート、テトラメチ
ルウレア、ジエチレングリコールジメチルエーテル、ト
リエチレングリコールジメチルエーテルなとの融点が2
0℃未満の化合物、エチレンカーボネート、α−ピペリ
ドン、スルホレン、サクシノニトリル、ジアミノマレオ
ニトリル、p−二トロアニソーノペ力ルバミン酸メチル
、カルバミン酸インプロピノペアセトアミド、N−メチ
ルアセトアミド、無水コハク酸、ジフェニルカーボネー
トなどの融点が20℃以上の化合物などを挙げることが
できる。これらのうちでは、プロピレンカーボネート、
エチレンカーボネートなどの炭酸エステル類、T−ブチ
ロラクトン、γ−バレロラクトン、δ−バレロラクトン
などのラクトン類が好ましい。Such high-boiling polar compounds include, for example, propylene carbonate, T-butyrolactone, T-valerolactone, δ-valerolactone, N-methyl-ε-caprolactam, N-methylpyrrolidone, cyclohexanone, furfural, N-methylformamide, and N-methylpyrrolidone. , N-dimethylacetamide, diethylene glycol monoethyl ether acetate, diethylene glycol diacetate, acetonyl acetone, methylcyanoacetate, tetramethylurea, diethylene glycol dimethyl ether, triethylene glycol dimethyl ether, etc., with a melting point of 2.
Compounds below 0°C, ethylene carbonate, α-piperidone, sulfolene, succinonitrile, diaminomaleonitrile, methyl p-nitroanisonopelbamate, impropinopeacetamide carbamate, N-methylacetamide, succinic anhydride, diphenyl carbonate Compounds having a melting point of 20°C or higher can be mentioned. Among these, propylene carbonate,
Carbonate esters such as ethylene carbonate, lactones such as T-butyrolactone, γ-valerolactone, and δ-valerolactone are preferred.
本発明(2)において、高沸点極性化合物は単独でもし
くは2種以上組み合わせて用いることができる。高沸点
極性化合物は、ポリイソシアネート化合物の100重量
部に対して0.1〜20重滑部、特に1〜10重量部で
あることが好ましく、この場合に低温硬化が可能で特に
貯蔵安定性のよい組成物を得ることができる。In the present invention (2), the high-boiling polar compounds can be used alone or in combination of two or more. The high boiling point polar compound is preferably used in an amount of 0.1 to 20 parts by weight, particularly 1 to 10 parts by weight, per 100 parts by weight of the polyisocyanate compound. A good composition can be obtained.
本発明(2)における(B)成分としては、活性水素を
有する固形の多官能化合物(以下「活性水素固形化合物
」という。)が用いられる。この活性水素固形化合物と
して使用することができるものは、インシアネート基と
反応性を有する活性水素を有する固形の多官能化合物で
あり、例えば本発明(1)における(B)成分として使
用されるヒドラジノ基、第一アミド基、第一チオアミド
基およびスルファモイル基から選ばれる少なくとも1種
の官能基を有する固形の多官能化合物、アミジノ基を有
する固形の化合物、複素環および複数の活性水素を有す
る固形の化合物、並びに本発明(1)において必要に応
じて使用できる固形のポリヒドロキシ化合物と同様のも
のを挙げることができる。As the component (B) in the present invention (2), a solid polyfunctional compound having active hydrogen (hereinafter referred to as "active hydrogen solid compound") is used. What can be used as this active hydrogen solid compound is a solid polyfunctional compound having active hydrogen that is reactive with incyanate groups, such as hydrazide used as component (B) in the present invention (1). a solid polyfunctional compound having at least one functional group selected from a group consisting of a primary amide group, a primary thioamide group, and a sulfamoyl group; a solid compound having an amidino group; a solid compound having a heterocycle and a plurality of active hydrogen atoms; Compounds and the same solid polyhydroxy compounds that can be used as needed in the present invention (1) can be mentioned.
上記のうち、好ましい活性水素固形化合物としては、ア
ジピン酸ジヒドラジド、エイコサンニ酸ジヒドラジド、
メラミン、アミノイミダゾイルメラミンなどを挙げるこ
とができる。Among the above, preferred active hydrogen solid compounds include adipic acid dihydrazide, eicosanniic acid dihydrazide,
Examples include melamine and aminoimidazoyl melamine.
本発明(2)において活性水素固形化合物は、単独でも
くしは2種以上を組み合わせて用いることができる。In the present invention (2), the active hydrogen solid compounds can be used alone or in combination of two or more.
本発明(2)における活性水素固形化合物は、(A)成
分の有するインシアネート基と、当該活性水素固形化合
物の有するインシアネート基と反応性を有する基の総量
が、当量比で、通常0.3〜5、好ましくは0.5〜3
(イソシアネート基/イソシアネートと反応性を有す
る基)となるように使用する。The active hydrogen solid compound in the present invention (2) has an equivalent ratio of the total amount of the incyanate groups of the component (A) and the groups that are reactive with the incyanate groups of the active hydrogen solid compound, usually 0. 3-5, preferably 0.5-3
(isocyanate group/group reactive with isocyanate).
また、本発明(2)における活性水素固形化合物の融点
および粒度は、本発明(1)における特定固形化合物の
場合と同様である。Further, the melting point and particle size of the active hydrogen solid compound in the present invention (2) are the same as those of the specific solid compound in the present invention (1).
本発明(2)の組成物には、必要に応じて本発明(1)
の組成物と同様の硬化促進剤、充填剤、着色剤、安定剤
、可塑剤、増粘剤などを添加することができる。The composition of the present invention (2) may optionally include the composition of the present invention (1).
Curing accelerators, fillers, colorants, stabilizers, plasticizers, thickeners, etc. similar to those in the composition can be added.
実施例
以下、本発明(1)および(2)の実施例について説明
するが、本発明はこれらによって限定されるものではな
い。なお「部」は重量部を、「%」は重1%を示す。Examples Examples of the present invention (1) and (2) will be described below, but the present invention is not limited thereto. Note that "part" indicates part by weight, and "%" indicates 1% by weight.
実施例1
平均分子量が2.000のポリエーテルポリオール「エ
フセノール2020 J (旭硝子■製)46部と、
ポリメリック4.4°−ジフェニルメタンジイソシアネ
ート[スミジュール44V−20J (住友バイエルウ
レタン■製)25部と、水添キシリレンジイソシアネー
ト[タケネート600J (武田薬品工業■製)8部と
を温度80℃で2時間反応させて複数のインシアネート
基を有するプレポリマーとし、これに合成ゼオライト’
5AJ15部およびタルク「クニミネタルクTFJ(ク
ニミネ工業@製)6部を加えて、複数のインシアネート
基を有するプレポリマ、合成ゼオライトおよびタルクの
合計に対してインシアネート基を9.4%含むポリイソ
シアネート成分を得た。Example 1 46 parts of polyether polyol "Efcenol 2020 J (manufactured by Asahi Glass ■) having an average molecular weight of 2.000,
25 parts of polymeric 4.4°-diphenylmethane diisocyanate [Sumidur 44V-20J (manufactured by Sumitomo Bayer Urethane) and 8 parts of hydrogenated xylylene diisocyanate [Takenate 600J (manufactured by Takeda Pharmaceutical Company)] were heated at 80°C for 2 hours. The reaction produces a prepolymer having multiple incyanate groups, which is then coated with synthetic zeolite'
Add 15 parts of 5AJ and 6 parts of Kunimine Talc TFJ (manufactured by Kunimine Kogyo@) to create a polyisocyanate component containing 9.4% incyanate groups based on the total of the prepolymer having multiple incyanate groups, synthetic zeolite, and talc. I got it.
このポリイソシアネート成分100部に対し、セバシン
酸ジヒドラジド25.7部(NCO:NH,の当量比は
l:1である)、フェノールノボラック樹脂の部分DB
U塩rU−CAT SA 841J (サンアプロ■
製)5部右よび有機シリコン化合物で表面処理した疎水
性シリカ「^εROSIL RY200J (日本アエ
ロジル■製)3部を加え、−波型熱硬化性組成物を得た
。To 100 parts of this polyisocyanate component, 25.7 parts of sebacic acid dihydrazide (the equivalent ratio of NCO:NH is 1:1), a portion of phenol novolac resin DB
U Salt rU-CAT SA 841J (Sun Appro ■
5 parts (manufactured by Nippon Aerosil Ltd.) and 3 parts of hydrophobic silica "^εROSIL RY200J" (manufactured by Nippon Aerosil ■) surface-treated with an organic silicon compound were added to obtain a -wave type thermosetting composition.
実施例2
平均分子量が7.000のポリエーテルポリオール「エ
フセノール850J (旭硝子側製)57部と、ポリ
メリック4,4°−ジフェニルメタンジイソシアネート
「スミジュール44V−20J 23部とを80℃で6
時間反応させて複数のインシアネート基を有するプレポ
リマーとし、これに合成ゼオライト「4A」20部を加
えて、複数のインシアネート基を有するプレポリマーお
よび合成ゼオライトの合計に対してイソシアネート基を
6.0%含むポリイソシアネート成分を得た。Example 2 57 parts of a polyether polyol "Efsenol 850J (manufactured by Asahi Glass Co., Ltd.) having an average molecular weight of 7.000 and 23 parts of a polymeric 4,4°-diphenylmethane diisocyanate "Sumidur 44V-20J" were mixed at 80°C for 6 hours.
A prepolymer having a plurality of incyanate groups is obtained by reacting for a period of time, and 20 parts of synthetic zeolite "4A" is added to this to obtain a prepolymer having 6.0 parts of isocyanate groups based on the total of the prepolymer having a plurality of incyanate groups and the synthetic zeolite. A polyisocyanate component containing 0% was obtained.
このポリイソシアネート成分100部に対し、アジピン
酸アミド5.2部(NCO:NH,の当量比は2:1で
ある)およびフェノールノボラック樹脂の部分DBU塩
rU−CAT SA 831J (サンアブロ@製)
3部を加え、−波型熱硬化性組成物を得た。To 100 parts of this polyisocyanate component, 5.2 parts of adipic acid amide (the equivalent ratio of NCO:NH is 2:1) and a partial DBU salt of phenol novolac resin rU-CAT SA 831J (manufactured by San Avro@)
3 parts were added to obtain a -wave type thermosetting composition.
実施例3
平均分子量が3.000のポリエステルポリオール「ク
ラポールP−3D101J(クラレ■製)43.8部と
、ポリメリック4,4°−ジフェニルメタンジイソシア
ネート[スミジュール 44 V −20436,2部
とを80℃で2時間反応させて複数のインシアネート基
を有するプレポリマーとし、これに合成ゼオライト「5
A」10部と、タルク「クニミネタルクTF Js部と
、ベントナイト「口0RBENJ (白石工業@製)2
部とを加えて、複数のイソシアネート基を有するプレポ
リマー、合成ゼオライト、タルクおよびベントナイトの
合計に対してインシアネート基を10%含むポリイソシ
アネート成分を得た。Example 3 43.8 parts of a polyester polyol "Kurapol P-3D101J (manufactured by Kuraray ■) having an average molecular weight of 3.000 and 2 parts of polymeric 4,4°-diphenylmethane diisocyanate [SumiDur 44 V-20436] were heated at 80°C. The reaction was carried out for 2 hours to obtain a prepolymer having multiple incyanate groups, and this was mixed with synthetic zeolite "5".
A" 10 parts, talc "Kunimine Talc TF Js part, and bentonite "Kuch0RBENJ (manufactured by Shiraishi Kogyo@) 2 parts"
A polyisocyanate component containing 10% of incyanate groups based on the total of the prepolymer having a plurality of isocyanate groups, synthetic zeolite, talc and bentonite was obtained.
このポリイソシアネート成分100部に対し、ペンタエ
リスリトール3.1部(NCO:OHの当量比は2.6
:1である)、ジシアンジアミド6.2部(N CO:
N H2の当量比は3.2:1である)、フェノール
ノボラック樹脂の部分DBU塩rU−CAT SA 8
31J 2部および亜鉛(II)アセチルアセテ−)0
.1部を加え、−波型熱硬化性組成物を得た。For 100 parts of this polyisocyanate component, 3.1 parts of pentaerythritol (NCO:OH equivalent ratio is 2.6
:1), 6.2 parts of dicyandiamide (NCO:
The equivalent ratio of N H2 is 3.2:1), partial DBU salt of phenolic novolak resin rU-CAT SA 8
31J 2 parts and zinc (II) acetylacetate) 0
.. 1 part was added to obtain a wave-shaped thermosetting composition.
実施例4
実施例2におけるアジピン酸アミド5.2部の代わりに
メラミン6部(NCO:NH2の当量比は1:1である
)を用いた他は実施例2と同様にして、−波型熱硬化性
組成物を得た。Example 4 A - wave type was prepared in the same manner as in Example 2 except that 6 parts of melamine (the equivalent ratio of NCO:NH2 was 1:1) was used instead of 5.2 parts of adipic acid amide in Example 2. A thermosetting composition was obtained.
実施例5
実施例1において、ポリイソシアネート化合物100邪
に対し、さらにプロピレンカーボネート2部を加え、そ
の他は実施例1と同様にして一液型熱硬化性組成物を得
た。Example 5 A one-component thermosetting composition was obtained in the same manner as in Example 1 except that 2 parts of propylene carbonate was further added to 100 parts of the polyisocyanate compound.
実施例6
実施例2において、ポリイソシアネート化合物100部
に対し、さらにT−バレロラクトン4部を加え、その他
は実施例2と同様にして、−波型熱硬化型組成物を得た
。Example 6 In Example 2, 4 parts of T-valerolactone was further added to 100 parts of the polyisocyanate compound, and the other conditions were the same as in Example 2 to obtain a -wave type thermosetting composition.
実施例7
実施例4において、ポリイソシアネート化合物100部
に対し、さらにr−ブチロラクトン2部を加え、その他
は実施例4と同様にして、−波型熱硬化性組成物を得た
。Example 7 In Example 4, 2 parts of r-butyrolactone was further added to 100 parts of the polyisocyanate compound, and the other conditions were the same as in Example 4 to obtain a -wave type thermosetting composition.
実施例8
実施例1におけるフェノールノボラック樹脂の部分DB
U塩rU −CAT SA 841J 5部の代わりに
エチレンカーボネート8部を用いた他は実施例1と同様
にして、−波型熱硬化性組成物を得た。Example 8 Partial DB of phenol novolac resin in Example 1
A -wave type thermosetting composition was obtained in the same manner as in Example 1 except that 8 parts of ethylene carbonate was used instead of 5 parts of U salt rU -CAT SA 841J.
比較例1
実施例1におけるセバシン酸ジヒドラジド25.7部の
代わりにペンタエリスリトール7.6部(NGO二〇H
の当量比はl:1である)を用い、フェノールノボラッ
ク樹脂の部分DBU塩を除いた他は実施例1と同様にし
て、−波型熱硬化性組成物を得た。Comparative Example 1 7.6 parts of pentaerythritol (NGO 20H) was used instead of 25.7 parts of sebacic acid dihydrazide in Example 1.
A wave-shaped thermosetting composition was obtained in the same manner as in Example 1 except that the partial DBU salt of the phenol novolac resin was removed.
比較例2
実施例2におけるアジピン酸アミド5.2部の代わりに
3,4′−ジアミノジフェニルエーテル14.3部(N
CO:NH,の当量比は1:1である)を用い、フェノ
ールノボラック樹脂の部分DBU塩を除いた他は実施例
2と同様にして、−波型熱硬化性組成物を得ようとした
が、混合中にゲル化した。Comparative Example 2 14.3 parts of 3,4'-diaminodiphenyl ether (N
An attempt was made to obtain a wave-shaped thermosetting composition in the same manner as in Example 2, except that the equivalent ratio of CO:NH was 1:1 and the partial DBU salt of the phenol novolac resin was removed. However, it gelled during mixing.
比較例3
実施例2におけるアジピン酸アミド5.2部の代わりに
ペンタエリスリトール2.4部(NCO:OHの当量比
は1:2である)を用いた他は実施例2と同様にして、
−波型熱硬化性組成物を得た。Comparative Example 3 The same procedure as in Example 2 was carried out except that 2.4 parts of pentaerythritol (the equivalent ratio of NCO:OH was 1:2) was used instead of 5.2 parts of adipic acid amide in Example 2.
- A corrugated thermosetting composition was obtained.
試験例1 〔貯蔵安定性の測定〕
実施例1〜8並びに比較例1および3で得られた組成物
を容150 +nlのフタ付ガラス製サンプルビンに入
れ、40℃の恒温槽中で保存し、貯蔵中に硬化するまで
の日数を調べた。その結果を第1表に示す。Test Example 1 [Measurement of storage stability] The compositions obtained in Examples 1 to 8 and Comparative Examples 1 and 3 were placed in a glass sample bottle with a lid of 150 + nl and stored in a constant temperature bath at 40°C. The number of days required for hardening during storage was investigated. The results are shown in Table 1.
試験例2〔加熱硬化時間の測定〕
実施例1〜8および比較例1および3で得られた組成物
の各々についての種々の温度に右ける硬化速度を求める
ために、種々の温度における組成物の硬化度を測定機r
JsRキュラストメーター■型」 (日令商事@nfs
)を用いて下記の測定条件に従って測定し、組成物が硬
化してその測定トルク値がl、Qkg−cmに達するま
での加熱硬化時間を測定した。なおこのトルク値が1.
0 kg−cmm来示組成物の状態は、例えば組成物が
接着剤として使用された場合において、接着部に外力が
加えられたときにも充分に耐えるだけの強度に達した状
態、すなわちクランプオフが可能な強度に達したとみな
すことのできる状態である。Test Example 2 [Measurement of heat curing time] In order to determine the curing rate depending on various temperatures for each of the compositions obtained in Examples 1 to 8 and Comparative Examples 1 and 3, the compositions at various temperatures were measured. A device to measure the degree of hardening of
JsR Curastometer ■type” (Nichirei Shoji @nfs
), and measured the heat curing time until the composition was cured and the measured torque value reached 1, Q kg-cm. Note that this torque value is 1.
0 kg-cm The state of the proposed composition is, for example, when the composition is used as an adhesive, a state in which it has reached a strength sufficient to withstand even when an external force is applied to the adhesive part, that is, clamp-off. This is a state where it can be considered that the strength has reached the level where it is possible.
測定条件; 振幅角 1部4度 振動数 100サイクル/1分間 結果を第1表に示す。Measurement condition; Amplitude angle 1 part 4 degrees Vibration frequency: 100 cycles/1 minute The results are shown in Table 1.
第1表
試験例3〔硬化樹脂シート物性の測定〕実施例1〜8並
びに比較例1および3で得られた組成物の各々をテフロ
ンシートにはさみ、実施例1〜4並びに比較例1および
3の組成物については120℃で2時間、実施例5〜8
の組成物については100℃で1時間プレス成形するこ
とにより、厚さが2胴の硬化樹脂のシートを作製し、J
IS2号ダンベル形試験片を打ち抜いた。このダンベル
形試験片からテフロンシートを剥離し、2QQmm/分
の引張り速度で引張り試験を行い、破断時の強度と伸び
とを「オートグラフA G −5000B J(島津製
作所@製)により測定した。結果を第2表に示す。Table 1 Test Example 3 [Measurement of physical properties of cured resin sheet] Each of the compositions obtained in Examples 1 to 8 and Comparative Examples 1 and 3 was sandwiched between Teflon sheets. for 2 hours at 120°C for the compositions of Examples 5-8.
For the composition of J
An IS No. 2 dumbbell-shaped test piece was punched out. The Teflon sheet was peeled off from this dumbbell-shaped test piece, a tensile test was conducted at a tensile speed of 2 QQ mm/min, and the strength and elongation at break were measured using an Autograph A G-5000B J (manufactured by Shimadzu Corporation). The results are shown in Table 2.
第2表
試験例d CT型剥離強度の測定〕
接着部が150市×25正である0、 8mm厚の鋼板
を、ブライマーrMIGHTYGRIP 9025J
(日本合成ゴム側製)で予め処理し、実施例1〜8並び
に比較例1および3で得られた組成物の各々を用い、実
施例1〜4並びに比較例1および3の組成物については
120℃で2時間、実施例5〜8の組成物については1
00℃で1時間、恒温槽中で加熱硬化してT型剥離試験
片を作製した。この試験片を用い、弓張り速度100順
/分で「オートグラフA [:、 −5000B」によ
りT型剥離強度を測定した。T型剥離強度は、試験時の
破壊平衡値をその値とした。結果を第3表に示す。Table 2 Test Example d CT Peel Strength Measurement] A 0.8 mm thick steel plate with a bonded area of 150 x 25 positive was coated with Braimer rMIGHTYGRIP 9025J.
(manufactured by Japan Synthetic Rubber) and using each of the compositions obtained in Examples 1 to 8 and Comparative Examples 1 and 3, the compositions of Examples 1 to 4 and Comparative Examples 1 and 3 were 2 hours at 120°C, 1 for the compositions of Examples 5-8.
A T-shaped peel test piece was prepared by heating and curing at 00° C. for 1 hour in a constant temperature bath. Using this test piece, the T-peel strength was measured using "Autograph A [:, -5000B"] at a bowing speed of 100 sequences/min. For the T-peel strength, the fracture equilibrium value during the test was taken as the value. The results are shown in Table 3.
試験例5〔剪断強度の測定〕
100 +n+n X 25 mmの寸法の1.6m+
n厚の鋼板を用い、12、5 mm X 25 mmの
接着部をプライ? −rMIGHTYGRIP9G25
」で予め処理し、実施例1〜8aびに比較例1および
3で得られた組成物の各々を用い、実施例1〜4並びに
比較例1および3の組成物については120℃で2時間
、実施例5〜8の組成物については100℃で1時間、
恒温槽中で加熱硬化して剪断試験片を作製した。この試
験片を用い、引張り速度5正/分で「オートグラフA
C−5000B Jにより剪断強度を測定した。結果を
第3表に示す。Test Example 5 [Measurement of shear strength] 1.6 m+ with dimensions of 100 + n + n x 25 mm
Using n-thick steel plate, ply the adhesive part of 12.5 mm x 25 mm. -rMIGHTYGRIP9G25
using each of the compositions obtained in Examples 1 to 8a and Comparative Examples 1 and 3; For the compositions of Examples 5 to 8, at 100°C for 1 hour,
A shear test piece was prepared by heating and curing in a constant temperature bath. Using this test piece, “Autograph A
Shear strength was measured using C-5000B J. The results are shown in Table 3.
第 表 〔発明の効果〕No. table 〔Effect of the invention〕
Claims (2)
ミド基およびスルファモイル基から選ばれる少なくとも
一種の官能基を有する固形の多官能化合物、 [2]アミジノ基を有する固形の化合物、 ならびに [3]複素環および複数の活性水素を有する固形の化合
物 から選ばれる少なくとも1種の化合物 が分散されてなることを特徴とする一液型熱硬化性組成
物。(1) (A) A polyisocyanate compound, (B) [1] A solid polyfunctional compound having at least one functional group selected from a hydrazino group, a primary amide group, a primary thioamide group, and a sulfamoyl group, [2] ] A one-component thermosetting composition characterized by dispersing at least one compound selected from a solid compound having an amidino group, and [3] a solid compound having a heterocycle and a plurality of active hydrogens. thing.
合物からなる混合物に、 (B)活性水素を有する固形の多官能化合物が分散され
てなることを特徴とする一液型熱硬化性組成物。(2) A one-component thermosetting composition comprising (A) a mixture of a polyisocyanate compound and a high-boiling polar compound, and (B) a solid polyfunctional compound having active hydrogen dispersed therein.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63175121A JP2632939B2 (en) | 1987-11-30 | 1988-07-15 | One-part type thermosetting composition |
| US07/264,388 US4912152A (en) | 1987-11-30 | 1988-10-31 | One-pack type thermosetting composition |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62-299715 | 1987-11-30 | ||
| JP29971587 | 1987-11-30 | ||
| JP63175121A JP2632939B2 (en) | 1987-11-30 | 1988-07-15 | One-part type thermosetting composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02614A true JPH02614A (en) | 1990-01-05 |
| JP2632939B2 JP2632939B2 (en) | 1997-07-23 |
Family
ID=17876093
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63175121A Expired - Lifetime JP2632939B2 (en) | 1987-11-30 | 1988-07-15 | One-part type thermosetting composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2632939B2 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008169342A (en) * | 2007-01-15 | 2008-07-24 | Aisin Chem Co Ltd | Interlayer anti-chipping paint |
| JP2008222914A (en) * | 2007-03-14 | 2008-09-25 | Dai Ichi Kogyo Seiyaku Co Ltd | Primer composition |
| JP2012529538A (en) * | 2009-06-06 | 2012-11-22 | ビーエーエスエフ コーティングス ゲゼルシャフト ミット ベシュレンクテル ハフツング | Coating agent and coating formed therefrom with high scratch resistance and high blistering resistance |
| JP2014115639A (en) * | 2012-11-13 | 2014-06-26 | Sekisui Chem Co Ltd | Sealing compound for liquid crystal display elements, vertical conduction material, liquid crystal display element, and hydrazide based thermosetting agent |
| CN116648469A (en) * | 2020-12-04 | 2023-08-25 | Sika技术股份公司 | Heat Curing Polyurethane Compositions |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58120627A (en) * | 1982-01-07 | 1983-07-18 | エイチ・ビ−・フラ−・カンパニ− | One liquid type thermosettable polyurethane composition and use |
| JPS5941320A (en) * | 1982-09-01 | 1984-03-07 | Nisshinbo Ind Inc | Heat-resistant thermosetting resin |
| JPS61235414A (en) * | 1985-03-29 | 1986-10-20 | Nisshinbo Ind Inc | Thermosetting resin and its production |
| JPS62116635A (en) * | 1985-11-15 | 1987-05-28 | Nisshinbo Ind Inc | Production of fire-proof board |
-
1988
- 1988-07-15 JP JP63175121A patent/JP2632939B2/en not_active Expired - Lifetime
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58120627A (en) * | 1982-01-07 | 1983-07-18 | エイチ・ビ−・フラ−・カンパニ− | One liquid type thermosettable polyurethane composition and use |
| JPS5941320A (en) * | 1982-09-01 | 1984-03-07 | Nisshinbo Ind Inc | Heat-resistant thermosetting resin |
| JPS61235414A (en) * | 1985-03-29 | 1986-10-20 | Nisshinbo Ind Inc | Thermosetting resin and its production |
| JPS62116635A (en) * | 1985-11-15 | 1987-05-28 | Nisshinbo Ind Inc | Production of fire-proof board |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008169342A (en) * | 2007-01-15 | 2008-07-24 | Aisin Chem Co Ltd | Interlayer anti-chipping paint |
| JP2008222914A (en) * | 2007-03-14 | 2008-09-25 | Dai Ichi Kogyo Seiyaku Co Ltd | Primer composition |
| JP2012529538A (en) * | 2009-06-06 | 2012-11-22 | ビーエーエスエフ コーティングス ゲゼルシャフト ミット ベシュレンクテル ハフツング | Coating agent and coating formed therefrom with high scratch resistance and high blistering resistance |
| JP2014115639A (en) * | 2012-11-13 | 2014-06-26 | Sekisui Chem Co Ltd | Sealing compound for liquid crystal display elements, vertical conduction material, liquid crystal display element, and hydrazide based thermosetting agent |
| JP2018077544A (en) * | 2012-11-13 | 2018-05-17 | 積水化学工業株式会社 | Sealant for liquid crystal display element, vertical conduction material, liquid crystal display element, and hydrazide thermosetting agent |
| CN116648469A (en) * | 2020-12-04 | 2023-08-25 | Sika技术股份公司 | Heat Curing Polyurethane Compositions |
| JP2023551399A (en) * | 2020-12-04 | 2023-12-08 | シーカ テクノロジー アクチェンゲゼルシャフト | Heat-curable polyurethane composition |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2632939B2 (en) | 1997-07-23 |
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