JPH026155A - Manufacture of substrate for thermal head - Google Patents
Manufacture of substrate for thermal headInfo
- Publication number
- JPH026155A JPH026155A JP15743188A JP15743188A JPH026155A JP H026155 A JPH026155 A JP H026155A JP 15743188 A JP15743188 A JP 15743188A JP 15743188 A JP15743188 A JP 15743188A JP H026155 A JPH026155 A JP H026155A
- Authority
- JP
- Japan
- Prior art keywords
- storage layer
- heat storage
- heat
- sintered body
- properties
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 24
- 238000004519 manufacturing process Methods 0.000 title claims description 13
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims abstract description 24
- IEQIEDJGQAUEQZ-UHFFFAOYSA-N phthalocyanine Chemical compound N1C(N=C2C3=CC=CC=C3C(N=C3C4=CC=CC=C4C(=N4)N3)=N2)=C(C=CC=C2)C2=C1N=C1C2=CC=CC=C2C4=N1 IEQIEDJGQAUEQZ-UHFFFAOYSA-N 0.000 claims abstract description 9
- 239000000049 pigment Substances 0.000 claims abstract description 9
- 238000001035 drying Methods 0.000 claims abstract description 7
- 238000010304 firing Methods 0.000 claims description 7
- 239000000084 colloidal system Substances 0.000 claims description 5
- 238000005338 heat storage Methods 0.000 abstract description 32
- 238000007639 printing Methods 0.000 abstract description 8
- 238000010438 heat treatment Methods 0.000 abstract description 6
- 230000017525 heat dissipation Effects 0.000 abstract description 5
- 238000007493 shaping process Methods 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 31
- 238000000034 method Methods 0.000 description 7
- 239000011521 glass Substances 0.000 description 6
- 239000005373 porous glass Substances 0.000 description 6
- 239000011148 porous material Substances 0.000 description 6
- 239000011241 protective layer Substances 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 239000000843 powder Substances 0.000 description 5
- 239000004020 conductor Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- 238000003980 solgel method Methods 0.000 description 2
- 241000257465 Echinoidea Species 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002496 gastric effect Effects 0.000 description 1
- RBTKNAXYKSUFRK-UHFFFAOYSA-N heliogen blue Chemical compound [Cu].[N-]1C2=C(C=CC=C3)C3=C1N=C([N-]1)C3=CC=CC=C3C1=NC([N-]1)=C(C=CC=C3)C3=C1N=C([N-]1)C3=CC=CC=C3C1=N2 RBTKNAXYKSUFRK-UHFFFAOYSA-N 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000000859 sublimation Methods 0.000 description 1
- 230000008022 sublimation Effects 0.000 description 1
- 238000007651 thermal printing Methods 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- JMXKSZRRTHPKDL-UHFFFAOYSA-N titanium ethoxide Chemical compound [Ti+4].CC[O-].CC[O-].CC[O-].CC[O-] JMXKSZRRTHPKDL-UHFFFAOYSA-N 0.000 description 1
- 238000001132 ultrasonic dispersion Methods 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Electronic Switches (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、感熱式印字装置等に使用されるサーマルヘッ
ドに好適なサーマルヘッド用基板の製造方法に関するも
のである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for manufacturing a thermal head substrate suitable for a thermal head used in a thermal printing device or the like.
第２図は従来のサーマルヘッドの要部を示す断面図であ
る。同図において、１１は絶縁性の基板、１２は基板１
１上に形成された蓄熱層であり、以上でサーマルヘッド
用基板を構成している。そして、この蓄熱層１２上に発
熱抵抗体１３、導電体１４ａ及び１４ｂ、保護層１５が
順に形成されており、発熱抵抗体１３の導電体１４ａと
１４ｂの間の部分Ａが発熱部となる。FIG. 2 is a sectional view showing the main parts of a conventional thermal head. In the figure, 11 is an insulating substrate, 12 is a substrate 1
1, and the above constitutes a thermal head substrate. A heat generating resistor 13, conductors 14a and 14b, and a protective layer 15 are formed in this order on this heat storage layer 12, and a portion A between the conductors 14a and 14b of the heat generating resistor 13 becomes a heat generating portion.
上記蓄熱層１２は断熱材としての機能を有し、発熱抵抗
体１３で発生した熱が熱伝導率の高い基板１１から必要
以上に放熱されないよう作用する。The heat storage layer 12 has a function as a heat insulating material, and acts to prevent the heat generated by the heating resistor 13 from being radiated more than necessary from the substrate 11 having high thermal conductivity.
このため、蓄熱層１２の熱伝導率は発熱抵抗体１３を挾
んで反対に配置される保護層１５の熱伝導率より小さい
材質とすることが望ましい。従来は、一般に保護層１５
の材質としてＳ ｉ ０２やＴ ａ ２０５等が使用さ
れており、一方、上記したように蓄熱層はガラスで構成
されており、これらの熱伝導率はほぼ等しくいずれら１
０ ’ｃａｌ／ｃｎ −ｓ −”Ｃ程度であった。そこ
で、従来のサーマルヘッド用基板にあっては、蓄熱層１
２を厚く形成することによって、保護層１５より大きな
断熱性を持たせて、必要以上の放熱がなされないように
構成していた。Therefore, it is desirable that the heat storage layer 12 is made of a material whose thermal conductivity is lower than that of the protective layer 15 disposed on the opposite side with the heating resistor 13 sandwiched therebetween. Conventionally, the protective layer 15
S i 02, T a 205, etc. are used as the material of
0 'cal/cn -s -''C. Therefore, in the conventional thermal head substrate, the heat storage layer 1
By forming the protective layer 2 thickly, the protective layer 15 has a greater heat insulating property than the protective layer 15, and is configured to prevent excessive heat dissipation.
ところが、蓄熱層１２を厚く形成した場合には、発熱抵
抗体１３の通電をオフにした後の発熱部Ａの放熱が速や
かになされなくなる。このため、印字繰返し周期が速い
場合には、発熱部Ａの温度が十分低下しないうちに次の
印字が開始され、発熱部Ａの温度が上昇し過ぎて、印字
品質が低下する問題が生じる。However, when the heat storage layer 12 is formed to be thick, the heat dissipation from the heat generating portion A cannot be performed quickly after the power supply to the heat generating resistor 13 is turned off. For this reason, when the printing repetition cycle is fast, the next printing is started before the temperature of the heat generating part A has sufficiently decreased, causing the problem that the temperature of the heat generating part A rises too much and the print quality deteriorates.
この問題を解消するため、サーマルヘッドの基板の蓄熱
層を熱伝導率が小さく、電気的特性、機械的特性等に優
れたポリイミド樹脂（耐熱温度４００℃程度）で構成し
、蓄熱層を薄型化することが考えられる。しかし、印字
速度の高速化の要求により、蓄熱層には１０−４〜１０
−５ｃ ａ ｌ ／Ｑｌｌ −５・℃程度の低い熱伝導
率と、６００℃以上の高い耐熱性とが要求されており、
ポリイミド樹脂は耐熱性の要件を満たさない。In order to solve this problem, the heat storage layer of the thermal head substrate is made of polyimide resin (heat resistant temperature of about 400℃), which has low thermal conductivity and excellent electrical and mechanical properties, and the heat storage layer is made thinner. It is possible to do so. However, due to the demand for higher printing speeds, the heat storage layer has a density of 10-4 to 10
-5c a l /Qll Low thermal conductivity of about -5・℃ and high heat resistance of 600℃ or higher are required.
Polyimide resins do not meet heat resistance requirements.
そこで、このような要件を満たす材料として、多孔質ガ
ラスが知られている。そして、この多孔質ガラスよりな
る蓄熱層の形成は、絶縁基板上に塗布された平均粒径１
０〜５０μｍ程度のガラス粉のペースト状物を一定条件
のもとて焼成し、ガラス粉内部より気泡を発生させて行
なわれる。Therefore, porous glass is known as a material that satisfies these requirements. The formation of the heat storage layer made of this porous glass involves the formation of a heat storage layer with an average particle size of 1
A paste of glass powder with a diameter of about 0 to 50 μm is fired under certain conditions to generate air bubbles from inside the glass powder.
しかしながら、多孔質ガラス層を製造するためには、焼
成の温度を、例えば設定温度の±２〜３℃の範囲内に維
持しなければならず、このような温度制御は技術的に高
度で、且つ困難であるという問題があった。However, in order to manufacture a porous glass layer, the firing temperature must be maintained, for example, within a range of ±2 to 3°C of the set temperature, and such temperature control is technically sophisticated. There was also the problem that it was difficult.
また、ガラス粉内部より発生する気泡によりガラス層に
空孔を形成した場合には、気泡が多孔質ガラス層の表面
に露出して、表面が凹凸状になる。Further, when pores are formed in the glass layer by air bubbles generated from inside the glass powder, the air bubbles are exposed on the surface of the porous glass layer, and the surface becomes uneven.
このため、多孔質ガラス層上に形成される発熱抵抗体や
導電体の製造が困難になり、また印字品質に悪影響を与
える等の問題があった。This makes it difficult to manufacture the heating resistor and conductor formed on the porous glass layer, and there are other problems such as an adverse effect on printing quality.
さらに、多孔質ガラス層を、実用上要求される数μｍ〜
数十μｍの厚さに製作することは、困難であるという問
題があった。Furthermore, the porous glass layer has a thickness of several micrometers or more, which is practically required.
There was a problem in that it was difficult to manufacture the film to a thickness of several tens of μm.
そこで、本発明は上記したような従来技術の課題を解決
するためになされたもので、その目的とするところは、
保温性及び耐熱性に優れた蓄熱層を平滑で適切な厚さに
形成できるサーマルヘッド用基板の製造方法を提供する
ことにある。Therefore, the present invention has been made to solve the problems of the prior art as described above, and its purpose is to:
It is an object of the present invention to provide a method for manufacturing a substrate for a thermal head, in which a heat storage layer having excellent heat retention and heat resistance can be formed to be smooth and have an appropriate thickness.
本発明のサーマルヘッド用基板の製造方法は、絶縁基板
上にフタロシアニン顔料を分散させたチタニアコロイド
溶液を塗布する工程と、これを乾燥する工程と、これを
焼成する工程とを有することを特徴としている。The method for manufacturing a thermal head substrate of the present invention is characterized by comprising the steps of applying a titania colloid solution in which a phthalocyanine pigment is dispersed on an insulating substrate, drying the same, and firing the same. There is.
本発明の製造方法においては、チタニアコロイド溶液中
にフタロシアニン顔料を分散させた溶液（ゾル）を絶縁
基板上に塗布し、これを乾燥してゲルとし、これを焼成
して焼結体を形成する。この、焼成によりフタロシアニ
ン顔料は昇華して除去されるので焼結体には空孔が形成
される。In the manufacturing method of the present invention, a solution (sol) in which a phthalocyanine pigment is dispersed in a titania colloid solution is applied onto an insulating substrate, this is dried to form a gel, and this is fired to form a sintered body. . By this firing, the phthalocyanine pigment is sublimated and removed, so that pores are formed in the sintered body.
また、ゾルを塗布、乾燥してゲルとし、これを焼成する
方法（ゾル−ゲル法と呼ばれる）は、ゾルの持つ組成の
均一性を利用するもので、フタロシアニン顔料を均一に
分散させることにより空孔分布の均一な焼結体が形成さ
れ、また焼結体の厚さも均一にできる。In addition, the method of applying a sol, drying it to form a gel, and then firing it (called the sol-gel method) takes advantage of the uniformity of the composition of the sol, and creates a void by uniformly dispersing the phthalocyanine pigment. A sintered body with a uniform pore distribution is formed, and the thickness of the sintered body can also be made uniform.
以下に本発明を図示の実施例に基づいて説明する。 The present invention will be explained below based on illustrated embodiments.
第１図は本発明に係るサーマルヘッド用基板の一実施例
の要部を示す断面図である。同図において、１は絶縁基
板、２は基板１上に形成された蓄熱層であり、この蓄熱
層２は多孔質チタニア焼結体により形成されている。FIG. 1 is a sectional view showing a main part of an embodiment of a thermal head substrate according to the present invention. In the figure, 1 is an insulating substrate, 2 is a heat storage layer formed on the substrate 1, and this heat storage layer 2 is formed of a porous titania sintered body.
そして、このサーマルヘッド用基板の製造は次のように
行われる。The manufacturing of this thermal head substrate is performed as follows.
先ず、出発原料としてチタンテトラエトキシド［Ｔｉ
（ＯＣ２Ｈ５） ４ ］を使用し、この原料０゜１モ
ルに対してエタノール４００ｇを加え、加熱還流下で、
０．２モル／ｆＪの水を加え、かく拌しながら１時間加
水分解を行う、この溶液を密封し、６０℃で７２時間放
置してチタニアコロイド溶液を得る。得られたチタニア
コロイド溶液に１．６ｇの銅フタロシアニン顔料を加え
、１時間超音波分散を行い、塗布液とする。First, titanium tetraethoxide [Ti
(OC2H5) 4 ], 400 g of ethanol was added to 0.1 mole of this raw material, and the mixture was heated under reflux.
Add 0.2 mol/fJ of water and perform hydrolysis for 1 hour while stirring. This solution is sealed and left at 60° C. for 72 hours to obtain a titania colloid solution. 1.6 g of copper phthalocyanine pigment is added to the obtained titania colloid solution and subjected to ultrasonic dispersion for 1 hour to obtain a coating solution.
この塗布液をＳｉウニ八へ板上に１１０００ｒｐの回転
数でスピンコードする。This coating solution was spin-coded onto a Si urchin plate at a rotation speed of 11,000 rpm.
次に、３００°Ｃで３０分間乾燥後、１０’Ｔｏｒｒの
減圧下で４００℃で１時間焼成を行う、得られた試料の
膜厚は、０．０５μｍであり、表面は非常に平滑である
。Next, after drying at 300°C for 30 minutes, baking was performed at 400°C for 1 hour under a reduced pressure of 10' Torr. The film thickness of the obtained sample was 0.05 μm, and the surface was very smooth. .
上記した塗布液の塗布、乾燥、焼成の工程を５０回繰返
して、膜厚２．５μｍの非常に平滑な蓄熱層が得られた
。The above steps of applying the coating liquid, drying, and baking were repeated 50 times to obtain a very smooth heat storage layer with a thickness of 2.5 μm.
尚、上記実施例においては、１１０００ｒｐの回転数で
スピンコードし、塗布液の塗布、乾燥、焼成の工程を５
０回繰返しな場合について説明したが、スピンコードの
回転数を変えることによって、膜厚を変えることができ
る。第３図はスピンコードの回転数と膜厚の関係を示す
グラフである。In the above example, spin coding was performed at a rotation speed of 11,000 rpm, and the steps of applying the coating liquid, drying, and baking were performed for 5 times.
Although the case of 0 repetitions has been described, the film thickness can be changed by changing the rotational speed of the spin cord. FIG. 3 is a graph showing the relationship between the rotation speed of the spin cord and the film thickness.
また、上記実施例と同じに調整した塗布液を、白金るつ
ぼに流し込み、乾燥、焼成を繰返し行った塊状物を粉砕
し熱伝導率を測定したところ、６ｘｌＯ，−’ｃａｌ／
ｃｍ−３・’ｃ（２５°Ｃ）の低い熱伝導率であった。In addition, the coating liquid prepared in the same manner as in the above example was poured into a platinum crucible, and the lumps that were repeatedly dried and fired were pulverized and the thermal conductivity was measured.
It had a low thermal conductivity of cm-3·'c (25°C).
上記製造方法により得られた蓄熱層は多孔質チタニア焼
結体よりなり、耐熱性に潰れており、微細な空孔を有し
ているので熱伝導率が小さく保温性に優れた性質を有す
る。このため、蓄熱層を薄型化しても十分な保温性を持
たせることかできる。The heat storage layer obtained by the above manufacturing method is made of a porous titania sintered body, is crushed in heat resistance, and has fine pores, so it has low thermal conductivity and excellent heat retention properties. Therefore, even if the heat storage layer is made thinner, sufficient heat retention can be provided.
また、蓄熱層を薄型化できることによって、蓄熱層上に
形成された発熱体の放熱速度は遠くなる（熱応答性が速
くなる）ので、印字速度の高速化が可能になる。Furthermore, by making the heat storage layer thinner, the heat dissipation speed of the heat generating element formed on the heat storage layer becomes longer (the thermal response becomes faster), so it becomes possible to increase the printing speed.
さらに、本実施例においては、ゾル−ゲル法を使用して
いるので、ゾルの持つ組成の均一性により空孔分布の均
一な焼結体が形成され、また焼結体の厚さを均一にでき
る。そして、従来のように、ガラス粉内部より気泡を発
生させた場合と異なり、蓄熱層表面に凹凸が形成される
ことはない。Furthermore, since the sol-gel method is used in this example, a sintered body with a uniform pore distribution is formed due to the uniform composition of the sol, and the thickness of the sintered body can be made uniform. can. Unlike the conventional case where bubbles are generated from inside the glass powder, unevenness is not formed on the surface of the heat storage layer.
また、チタニアの焼結温度とフタロシアニンの昇華温度
とが同程度であり、また焼成工程における温度の許容範
囲は従来のように厳しくなく、設定か容易である。Furthermore, the sintering temperature of titania and the sublimation temperature of phthalocyanine are approximately the same, and the allowable range of temperature in the firing process is not as strict as in the past and is easy to set.
さらに、この多孔質チタニア焼結体は耐熱性に優れてお
り、微細な空孔を有しているので閑温性に潰れた性質を
有する。保温性に優れているので、蓄熱層の薄型化が可
能となり、蓄熱層の薄型化により蓄熱層上に形成された
発熱体の放熱効果がよくなるので、印字速度の高速化が
可能になる。Furthermore, this porous titania sintered body has excellent heat resistance and has fine pores, so it has a flat nature at a low temperature. Since it has excellent heat retention, it is possible to make the heat storage layer thinner, and the thinner heat storage layer improves the heat dissipation effect of the heating element formed on the heat storage layer, making it possible to increase the printing speed.
以上説明したように、本発明の製造方法により！ＩＩ！
！遺されたサーマルヘッド用基板は、蓄熱層の保温性が
優れているので、蓄熱層を薄型にでき、これを用いてサ
ーマルヘッドを構成すれば、熱応答性がよく高速印字に
適応できるサーマルヘッドを提供できる。As explained above, by the manufacturing method of the present invention! II!
! The remaining thermal head substrate has a heat storage layer with excellent heat retention properties, so the heat storage layer can be made thin, and if a thermal head is constructed using this, a thermal head with good thermal response and adaptable to high-speed printing can be created. can be provided.
また、本発明の′Ｍ遣方法によれば、従来例のようにガ
ラス粉内部より発生する気泡を利用していないので、蓄
熱層表面に凹凸が形成されることはなく、発熱抵抗体や
導電体の形成に適しており、また、印字品質に悪影皆を
与えることもない。In addition, according to the 'M method of the present invention, unlike the conventional example, bubbles generated from inside the glass powder are not used, so unevenness is not formed on the surface of the heat storage layer, and heating resistors and conductive It is suitable for forming bodies, and does not adversely affect print quality.
さらに、焼成工程における温度の設定、膜厚の制御が容
易である。Furthermore, it is easy to set the temperature and control the film thickness in the firing process.
第１図は本発明に係るサーマルヘッド用基板の一実施例
を示す断面図、
第２図は従来のサーマルヘッド用基板を用いて形成され
たサーマルヘッドの構成を示す要部断面図、
第３図はスピンコード回転数と膜厚の関係を示すグラフ
である。
１・・・基板、 ２・・・蓄熱層。
特許出願人 沖電気工業株式会社
代理人 弁理士 前 １） 実
ａ Ｑ＝ 敷（１００Ｏｒｐｍ）
スピンコー）旧ト尊辷と頒４−Ｎ胃糸
第３因FIG. 1 is a cross-sectional view showing an embodiment of a thermal head substrate according to the present invention; FIG. 2 is a cross-sectional view of essential parts showing the configuration of a thermal head formed using a conventional thermal head substrate; The figure is a graph showing the relationship between spin code rotation speed and film thickness. 1... Substrate, 2... Heat storage layer. Patent Applicant Oki Electric Industry Co., Ltd. Agent Patent Attorney Former 1) Actual A Q = Layout (100Orpm) Spinco) Old Tongue and 4-N Gastric Thread 3rd Cause
Claims (1)
コロイド溶液を塗布する工程と、これを乾燥する工程と
、 これを焼成する工程と を有することを特徴とするサーマルヘッド用基板の製造
方法。[Claims] A thermal head substrate comprising the steps of applying a titania colloid solution in which a phthalocyanine pigment is dispersed on an insulating substrate, drying the same, and firing the same. Production method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15743188A JPH026155A (en) | 1988-06-24 | 1988-06-24 | Manufacture of substrate for thermal head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15743188A JPH026155A (en) | 1988-06-24 | 1988-06-24 | Manufacture of substrate for thermal head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH026155A true JPH026155A (en) | 1990-01-10 |
Family
ID=15649493
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15743188A Pending JPH026155A (en) | 1988-06-24 | 1988-06-24 | Manufacture of substrate for thermal head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH026155A (en) |
-
1988
- 1988-06-24 JP JP15743188A patent/JPH026155A/en active Pending
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