JPH0261617U - - Google Patents
Info
- Publication number
- JPH0261617U JPH0261617U JP14168088U JP14168088U JPH0261617U JP H0261617 U JPH0261617 U JP H0261617U JP 14168088 U JP14168088 U JP 14168088U JP 14168088 U JP14168088 U JP 14168088U JP H0261617 U JPH0261617 U JP H0261617U
- Authority
- JP
- Japan
- Prior art keywords
- mold
- supply hole
- upper mold
- molded product
- resin molded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011248 coating agent Substances 0.000 claims description 8
- 238000000576 coating method Methods 0.000 claims description 8
- 239000011347 resin Substances 0.000 claims description 8
- 229920005989 resin Polymers 0.000 claims description 8
- 238000000465 moulding Methods 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 5
- 239000012778 molding material Substances 0.000 claims description 3
- 230000002093 peripheral effect Effects 0.000 claims 1
- 239000011247 coating layer Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Description
第１〜６図は本考案の一実施例を示すもので、
第１図は本実施例に係るインモールドコーテイン
グ用金型構造が適用された成型用金型の概略構成
を示す縦断面図、第２図は第１図における―
切断線に沿つてみた要部断面図、第３〜５図はイ
ンモールドコート材がコーテイングされた樹脂成
形品の成形工程を示す成形用金型の要部断面図、
第６図は本実施例の成形用金型を用いて成形され
た完成品の一部を拡大して示す斜視図である。ま
た、第７図は従来技術およびその問題点を説明す
る樹脂成形品の平面図である。
２…上型、２ａ…下面、３…下型、３ａ…上面
、５ａ…供給孔、９…受圧部（スライドコア）、
ａ…樹脂成形素材（ＳＭＣ成形素材）、ｂ…イン
モールドコート材、Ａ…樹脂成形品、Ｂ…コーテ
イング層。
Figures 1 to 6 show an embodiment of the present invention.
FIG. 1 is a vertical cross-sectional view showing a schematic configuration of a molding die to which the in-mold coating mold structure according to the present embodiment is applied, and FIG.
A cross-sectional view of the main part taken along the cutting line, FIGS. 3 to 5 are cross-sectional views of the main part of a molding die showing the molding process of a resin molded product coated with an in-mold coating material,
FIG. 6 is an enlarged perspective view of a part of the finished product molded using the molding die of this example. Further, FIG. 7 is a plan view of a resin molded product for explaining the prior art and its problems. 2... Upper die, 2a... Lower surface, 3... Lower die, 3a... Upper surface, 5a... Supply hole, 9... Pressure receiving part (slide core),
a... Resin molding material (SMC molding material), b... In-mold coating material, A... Resin molded product, B... Coating layer.
Claims (1)
ることにより樹脂成形品を成形したのち、上記上
型あるいは下型の少なくとも一方を型開き方向に
移動させて樹脂成形品の表面と該表面に対向する
型面との間に間隙を形成すると共に、該間隙内に
上記上型下面の周縁部における所定位置に開口さ
れた供給孔よりインモールドコート材を充填する
ことにより樹脂成形品の表面をコーテイングする
ようにしたインモールドコーテイング用金型構造
であつて、上記下型における上記供給孔の対向位
置が、樹脂成形品の成形時に上記上型の下面に密
接すると共に、インモールドコート材の充填時に
は上記間隙と供給孔とを連通させ、且つ該供給孔
より供給されるインモールドコート材を受け止め
る受圧部とされていることを特徴とするインモー
ルドコーテイング用金型構造。 After molding a resin molded product by heat pressing the resin molding material between an upper mold and a lower mold, at least one of the upper mold or the lower mold is moved in the mold opening direction to contact the surface of the resin molded product. A gap is formed between the upper mold surface and the mold surface facing the upper mold surface, and the in-mold coating material is filled into the gap through a supply hole opened at a predetermined position on the peripheral edge of the lower surface of the upper mold. The mold structure for in-mold coating is such that the surface is coated, and the opposing position of the supply hole in the lower mold is in close contact with the lower surface of the upper mold during molding of a resin molded product, and the in-mold coating material is A mold structure for in-mold coating, characterized in that the gap and the supply hole are communicated with each other during filling, and the mold structure is a pressure-receiving part that receives the in-mold coating material supplied from the supply hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14168088U JPH0261617U (en) | 1988-10-29 | 1988-10-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14168088U JPH0261617U (en) | 1988-10-29 | 1988-10-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0261617U true JPH0261617U (en) | 1990-05-08 |
Family
ID=31406963
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14168088U Pending JPH0261617U (en) | 1988-10-29 | 1988-10-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0261617U (en) |
-
1988
- 1988-10-29 JP JP14168088U patent/JPH0261617U/ja active Pending
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