JPH026162U - - Google Patents

Info

Publication number
JPH026162U
JPH026162U JP8212288U JP8212288U JPH026162U JP H026162 U JPH026162 U JP H026162U JP 8212288 U JP8212288 U JP 8212288U JP 8212288 U JP8212288 U JP 8212288U JP H026162 U JPH026162 U JP H026162U
Authority
JP
Japan
Prior art keywords
discs
gap
soldering device
ultrasonic
ultrasonic soldering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8212288U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8212288U priority Critical patent/JPH026162U/ja
Publication of JPH026162U publication Critical patent/JPH026162U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Apparatuses For Generation Of Mechanical Vibrations (AREA)
  • Molten Solder (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図ＡおよびＢはこの考案の実施例である超
音波半田付装置の要部を示すそれぞれ平面図およ
び正面図、第２図はこの考案の構成および作用を
示す図である。また、第３図は従来の半田付装置
を示す正面図である。 １……超音波半田付装置、２，１２……円板、
３，１３……共振棒、８，１８……電歪振動子、
９，１９……超音波発振器。 FIGS. 1A and 1B are a plan view and a front view, respectively, showing the main parts of an ultrasonic soldering apparatus that is an embodiment of this invention, and FIG. 2 is a diagram showing the structure and operation of this invention. Moreover, FIG. 3 is a front view showing a conventional soldering device. 1... Ultrasonic soldering device, 2, 12... Disc,
3, 13... Resonance bar, 8, 18... Electrostrictive vibrator,
9,19... Ultrasonic oscillator.

Claims (1)

【実用新案登録請求の範囲】 互いの周面を間隙を設けて対向させた２つの円
板に溶融した半田を付着し、これら円板を互いに
逆方向に回転させ、両者の間隙に半田被付着物を
通過させる半田付装置であつて、 両円板に半径方向の振動を与える超音波振動体
を設けたことを特徴とする超音波半田付装置。[Claim for Utility Model Registration] Molten solder is applied to two discs facing each other with a gap between their peripheral surfaces, and the discs are rotated in opposite directions to apply solder to the gap between the two discs. 1. An ultrasonic soldering device for passing through a kimono, characterized in that the ultrasonic soldering device is provided with an ultrasonic vibrator that applies radial vibration to both discs.
JP8212288U 1988-06-21 1988-06-21 Pending JPH026162U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8212288U JPH026162U (en) 1988-06-21 1988-06-21

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8212288U JPH026162U (en) 1988-06-21 1988-06-21

Publications (1)

Publication Number Publication Date
JPH026162U true JPH026162U (en) 1990-01-16

Family

ID=31306888

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8212288U Pending JPH026162U (en) 1988-06-21 1988-06-21

Country Status (1)

Country Link
JP (1) JPH026162U (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53134736A (en) * 1976-12-02 1978-11-24 Asahi Glass Co Ltd Method of plating melted using ultrasonic wave
JPS5435871A (en) * 1977-08-26 1979-03-16 Toyo Pulp Co Ltd Method and apparatus for dissolving oxygen
JPS5897479A (en) * 1981-12-03 1983-06-09 Hitachi Cable Ltd Ultrasonic soldering method for aluminum bar material
JPS63108971A (en) * 1986-10-24 1988-05-13 Fuji Seiki Seizosho:Kk Automatic solder coating device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53134736A (en) * 1976-12-02 1978-11-24 Asahi Glass Co Ltd Method of plating melted using ultrasonic wave
JPS5435871A (en) * 1977-08-26 1979-03-16 Toyo Pulp Co Ltd Method and apparatus for dissolving oxygen
JPS5897479A (en) * 1981-12-03 1983-06-09 Hitachi Cable Ltd Ultrasonic soldering method for aluminum bar material
JPS63108971A (en) * 1986-10-24 1988-05-13 Fuji Seiki Seizosho:Kk Automatic solder coating device

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