JPH026181U - - Google Patents

Info

Publication number
JPH026181U
JPH026181U JP1988084001U JP8400188U JPH026181U JP H026181 U JPH026181 U JP H026181U JP 1988084001 U JP1988084001 U JP 1988084001U JP 8400188 U JP8400188 U JP 8400188U JP H026181 U JPH026181 U JP H026181U
Authority
JP
Japan
Prior art keywords
coupling element
optical coupling
supporting
laser
joined
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988084001U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988084001U priority Critical patent/JPH026181U/ja
Publication of JPH026181U publication Critical patent/JPH026181U/ja
Pending legal-status Critical Current

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  • Lasers (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図a,bは、本考案の実施例を示す構成図
、第2図は結合素子の一例を示す図、第3図は従
来のレーザ溶接装置の構成図、第4図は接合部の
構成図である。 101……位置センサ、102……基準面、1
……リード、2……パツケージ、3……金属棒、
4……レンズ、5……ヒートシンク、6……半導
体レーザ、7……光フアイバ、9……スライドリ
ング、301……光結合素子、302……ホルダ
、303,304……ステージ、305,307
……アーム、306……YAGレーザ出射部、3
08……レーザビーム、300……ベース、41
,42……接合部、203……接合面。
Figures 1a and b are block diagrams showing an embodiment of the present invention, Figure 2 is a diagram showing an example of a coupling element, Figure 3 is a block diagram of a conventional laser welding device, and Figure 4 is a diagram showing a joint part. FIG. 101...Position sensor, 102...Reference plane, 1
...Reed, 2...Package, 3...Metal rod,
4... Lens, 5... Heat sink, 6... Semiconductor laser, 7... Optical fiber, 9... Slide ring, 301... Optical coupling element, 302... Holder, 303, 304... Stage, 305, 307
...Arm, 306...YAG laser emission section, 3
08... Laser beam, 300... Base, 41
, 42...joint part, 203...joint surface.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体発光素子あるいは半導体受光素子を具備
した光結合素子を支持する機構と、前記光結合素
子に接続する光フアイバを支持する機構と、被接
合部にレーザビームを照射するレーザ放射部を支
持する機構と、レーザ装置とで構成するレーザ溶
接装置において、前記支持機構の何れかに光結合
素子の接合面と当該光結合素子に接合する接続部
材の接合面の平行度を評価する装置を具備した事
を特徴とするレーザ溶接装置。
A mechanism for supporting an optical coupling element equipped with a semiconductor light emitting element or a semiconductor light receiving element, a mechanism for supporting an optical fiber connected to the optical coupling element, and a mechanism for supporting a laser emitting part that irradiates a laser beam to a part to be joined. and a laser device, wherein one of the support mechanisms is equipped with a device for evaluating the parallelism of the joint surface of the optical coupling element and the joint surface of the connecting member to be joined to the optical coupling element. Laser welding equipment featuring:
JP1988084001U 1988-06-24 1988-06-24 Pending JPH026181U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988084001U JPH026181U (en) 1988-06-24 1988-06-24

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988084001U JPH026181U (en) 1988-06-24 1988-06-24

Publications (1)

Publication Number Publication Date
JPH026181U true JPH026181U (en) 1990-01-16

Family

ID=31308701

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988084001U Pending JPH026181U (en) 1988-06-24 1988-06-24

Country Status (1)

Country Link
JP (1) JPH026181U (en)

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