JPH0263166A - Image sensor - Google Patents
Image sensorInfo
- Publication number
- JPH0263166A JPH0263166A JP63214443A JP21444388A JPH0263166A JP H0263166 A JPH0263166 A JP H0263166A JP 63214443 A JP63214443 A JP 63214443A JP 21444388 A JP21444388 A JP 21444388A JP H0263166 A JPH0263166 A JP H0263166A
- Authority
- JP
- Japan
- Prior art keywords
- sensor element
- image sensor
- line sensor
- substrate
- hardness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims abstract description 31
- 229920000620 organic polymer Polymers 0.000 claims abstract description 15
- 239000002861 polymer material Substances 0.000 claims abstract description 15
- 239000000853 adhesive Substances 0.000 claims abstract description 14
- 230000001070 adhesive effect Effects 0.000 claims abstract description 14
- 239000012212 insulator Substances 0.000 claims abstract description 11
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 6
- 150000001875 compounds Chemical class 0.000 claims abstract description 3
- 239000012790 adhesive layer Substances 0.000 claims description 6
- 239000002985 plastic film Substances 0.000 claims description 4
- 229920006255 plastic film Polymers 0.000 claims description 4
- 239000000463 material Substances 0.000 abstract description 14
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 5
- 229910052782 aluminium Inorganic materials 0.000 abstract description 5
- 239000011521 glass Substances 0.000 abstract description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 abstract description 4
- 239000005020 polyethylene terephthalate Substances 0.000 abstract description 4
- 239000004593 Epoxy Substances 0.000 abstract description 3
- 239000004020 conductor Substances 0.000 abstract description 3
- 229920000728 polyester Polymers 0.000 abstract description 2
- -1 polyethylene terephthalate Polymers 0.000 abstract description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 1
- 229910052710 silicon Inorganic materials 0.000 abstract 1
- 239000010703 silicon Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 description 4
- 230000035939 shock Effects 0.000 description 4
- 230000007797 corrosion Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 230000008646 thermal stress Effects 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 2
- 230000035882 stress Effects 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- 229920012266 Poly(ether sulfone) PES Polymers 0.000 description 1
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000003522 acrylic cement Substances 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 229920006351 engineering plastic Polymers 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 239000013464 silicone adhesive Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Solid State Image Pick-Up Elements (AREA)
Abstract
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明はイメージセンサの構成と材料に関する。[Detailed description of the invention] [Industrial application field] The present invention relates to the structure and materials of an image sensor.
なお本明細書では、発明の効果が最も大きく期待できる
ラインセンサを例に取り上げて記述する。Note that in this specification, description will be made taking as an example a line sensor in which the effects of the invention can be expected to be the greatest.
イメージセンサ素子の構成は第３図に示したように、−
船釣にはガラス質（石英ガラス、ホウケイ酸ガラスなど
）の基板（１０）のいずれか一方の表面に受光素子（１
１）が形成されている。この受光素子への光の入り方に
よって２種類の方式が考えられている。すなわち、第４
図に示したように直接受光素子（１１）に光が入る方式
（以下、トップタイプと記す）及び、第５図のように光
が基板材質（１０）を通過して受光素子（１］）に入る
方式（以下、ボトムタイプと記す）である。The configuration of the image sensor element is as shown in FIG.
For boat fishing, a light-receiving element (1
1) is formed. Two types of methods have been considered depending on how light enters the light receiving element. That is, the fourth
As shown in the figure, there is a method in which light enters the light-receiving element (11) directly (hereinafter referred to as top type), and a method in which light passes through the substrate material (10) and enters the light-receiving element (1]) as shown in Figure 5. This is the bottom type (hereinafter referred to as the bottom type).
しかし、トップタイプにおいては素子及び接続部の保護
のために、平面性の良いガラス性のフタを封着する必要
があり、耐湿信頼性、コスト、作業性の面などで不利で
ある。したがって、本明細書においては、このボトムタ
イプに発明を適用する。However, in the top type, it is necessary to seal a glass lid with good flatness to protect the elements and connection parts, which is disadvantageous in terms of moisture resistance, cost, workability, etc. Therefore, in this specification, the invention is applied to this bottom type.
従来のイメージセンサの主な構造は、第６図に示したよ
うに、導体パターン（１２）が設けられた入射光を透過
する絶縁物基板（１３）の表面にイメージセンサ素子（
２）が接着剤（１４）等によって固定され、アルミニウ
ムまたは金のワイヤー（７）でイメージセンサと基板が
接続されている。As shown in FIG. 6, the main structure of a conventional image sensor is that an image sensor element (
2) is fixed with an adhesive (14) or the like, and the image sensor and the substrate are connected with an aluminum or gold wire (7).
さらに、このイメージセンサ素子及びワイヤーの保護の
ために有機高分子材料（１８、以下モールドと記す。）
が素子表面及びワイヤーにボッティングされている。（
この際、有機高分子材料は初期的に液状であることがほ
とんどであるため、ポツティング時の流れ出し防止のた
めにダムとなる構造物（１５）を基板上に設けておく必
要がある。）さらに、イメージ七ン±駆動回路、プリア
ンプ回路などの形成されたプリント基板（１６）をコネ
クタ（１７）で接続している。（以上を従来例−１とす
る）
しかし、従来例−１においては、以下に記すような問題
点が認められる。Furthermore, an organic polymer material (18, hereinafter referred to as mold) is used to protect the image sensor element and wire.
is botted on the element surface and wire. (
At this time, since the organic polymer material is initially in a liquid state in most cases, it is necessary to provide a structure (15) serving as a dam on the substrate to prevent it from flowing out during potting. ) Furthermore, a printed circuit board (16) on which an image drive circuit, a preamplifier circuit, etc. are formed is connected by a connector (17). (The above is referred to as Conventional Example-1) However, in Conventional Example-1, the following problems are recognized.
（１）絶縁物基板の材質が制約される
・入射光の透過率
・膨張係数、ヤング率：イメージセンサ素子基板との釣
り合い（応力発生防止）
（２）接着剤の要求特性が厳しい
・熱応力の緩和が必要
・接着１３頼性
（３）イメージセンサ駆動回路、プリアンプ回路が別に
必要になる。(1) The material of the insulating substrate is restricted - Transmittance of incident light, coefficient of expansion, Young's modulus: balance with the image sensor element substrate (prevention of stress generation) (2) Strict required characteristics of adhesive - Thermal stress (3) An image sensor drive circuit and a preamplifier circuit are required separately.
・透明な絶縁基板上への素子実装が困難・接続点が２か
所あるため信頼性が不安（４）モールド流れ防止用のダ
ムとなる構造物及びその付加工程が必要になる。- Difficulty mounting elements on a transparent insulating substrate - Reliability is uncertain because there are two connection points (4) A structure that serves as a dam to prevent mold flow and its additional process are required.
そこで、この様な問題点を解決したものとして、第７図
に示したように、片面に接着剤層若しくは粘着剤層（５
）を有するプラスチックフィルム（６）の接着若しくは
粘着面に、導体パターン（４）およびイメージセンサ素
子（２）を取り囲める大きさの穴（３）を有する絶縁物
基板（１）と、当該穴の中にイメージセンサ素子が固定
され、この両者がアルミニウムまたは金のワイヤー（７
）で電気的に接続され、さらに、このイメージセンサ素
子及びワイヤーの保護のために有機高分子材料（１８、
以下モールドと記す。）が素子表面及びワイヤーにボッ
ティングされている構造を持つイメージセンサが発明さ
れた。（以上を、従来例−２とする。）
〔発明が解決しようとする課題〕
しかし、従来技術においては、以下に記すような問題点
が認められる。すなわち、従来例−２は、従来例−１に
比べて品質、コスト、納期などあらゆる面で優れている
が、モールド剤の使用において、
（１）耐食性の点から使用可能な材料が限定されてしま
う。Therefore, as a solution to these problems, as shown in Fig. 7, an adhesive layer or adhesive layer (5
) with an insulating substrate (1) having a hole (3) large enough to surround the conductive pattern (4) and the image sensor element (2) on the adhesive or adhesive side of the plastic film (6), and The image sensor element is fixed inside, and both are connected by aluminum or gold wire (7
), and furthermore, an organic polymer material (18,
Hereinafter referred to as mold. ) has been invented, which has a structure in which bots are placed on the element surface and wires. (The above is referred to as Prior Art Example-2.) [Problems to be Solved by the Invention] However, the following problems are recognized in the prior art. In other words, Conventional Example-2 is superior to Conventional Example-1 in all aspects such as quality, cost, and delivery time, but in the use of molding agents, (1) Usable materials are limited due to corrosion resistance. Put it away.
（２）耐食性の比較的優れたシリコーン系を用いると、
材料によっては製品の熱衝撃試験で絶縁物基板とイメー
ジセンサ素子を接続したアルミニウムもしくは金のワイ
ヤーが屈曲し、切断されてしまう。これは、従来例−２
における絶縁物基板とイメージセンサ素子の膨張係数の
差が極めて大きいく前者が後者の５０倍程度）場合に見
られるため、これらの組み合わせが限定されてしまう。(2) Using a silicone system with relatively excellent corrosion resistance,
Depending on the material, the aluminum or gold wire that connects the insulator substrate and image sensor element may bend and break during the thermal shock test of the product. This is conventional example-2
Since the difference in expansion coefficient between the insulating substrate and the image sensor element is extremely large (the former being about 50 times that of the latter), the combinations thereof are limited.
という点である。That is the point.
そこで、本発明はこの様な問題点を解決したもので、そ
の目的は、従来例−２の特徴を生かしながら、使用でき
る絶縁物基板の範囲を広げてコスト的に有利な物を使用
可能にし、信頼性も十分確保されたイメージセンサを与
えることにある。Therefore, the present invention has solved these problems, and its purpose is to expand the range of usable insulating substrates and make it possible to use cost-effective ones while taking advantage of the characteristics of Conventional Example-2. The object of the present invention is to provide an image sensor with sufficient reliability.
本発明のイメージセンサは、片面に接着剤層若しくは粘
着剤層を有するプラスチックフィルムの接着若しくは粘
着面に、導体パターンおよびイメージセンサ素子を取り
囲める大きさの穴を有する絶縁物基板と、当該穴の中に
イメージセンサ素子が固定され、この両者が電気的に接
続され、イメージセンサ素子及び電気的接続部が有機高
分子材料でおおわれている構造を持つイメージセンサに
おいて、上記の有機高分子材料がシリコーン系の化合物
で、かつ硬化後の硬度がショアＡｌｉ！度で２０以下で
あることを特徴とする。The image sensor of the present invention includes an insulating substrate having a hole large enough to surround a conductive pattern and an image sensor element on the adhesive or adhesive surface of a plastic film having an adhesive layer or an adhesive layer on one side, and In an image sensor having a structure in which an image sensor element is fixed inside, the two are electrically connected, and the image sensor element and the electrical connection part are covered with an organic polymer material, the organic polymer material is silicone. system compound, and the hardness after curing is Shore Ali! It is characterized by being 20 or less in degrees.
なお本発明で用いられる有機高分子材料は特許請求の範
囲を満たしていれば、着色されていたり、フィラーが含
まれていてもよい、また硬化物はゴム状ばかりでなくゲ
ル状でも良い。絶縁物基板は有機、無機を問わず選択で
きるが、穴加工等の面を考慮すると有機物の方がより望
ましく、半田付けなどの加熱工程を考慮して耐熱性の良
いもの（ガラエボ、超エンプラ等）を選定する必要があ
る、さらに、この絶縁物基板の表面にはＩＣや抵抗、コ
ンデンサなどの素子が実装されていてもよい。絶縁物基
板に設けられる穴の形状は、特許請求の範囲に述べられ
た要件さえ満たしていれば、特に制約はない。また、本
発明で用いられるプラスチックフィルム材料およびそれ
が有する接着剤若しくは粘着剤の材質は、その光学的な
特性（光線透過率、屈＃ｙｒ率等）、物理的特性（耐熱
性、熱膨張係数、ヤング率等）、耐候性、耐食性等が、
適用されるイメージセンサの仕様を満たせるものであれ
ばその種類、組み合わせに制約を受けない。The organic polymer material used in the present invention may be colored or contain fillers as long as it satisfies the scope of the claims, and the cured material may be not only rubber-like but also gel-like. The insulator substrate can be either organic or inorganic, but organic materials are more desirable in terms of hole processing, etc., and materials with good heat resistance (Glaevo, super engineering plastics, etc.) are preferred in consideration of heating processes such as soldering. ).Furthermore, elements such as ICs, resistors, and capacitors may be mounted on the surface of this insulating substrate. There are no particular restrictions on the shape of the hole provided in the insulating substrate as long as it satisfies the requirements stated in the claims. In addition, the plastic film material used in the present invention and the material of the adhesive or pressure-sensitive adhesive it has have optical properties (light transmittance, refractive index, etc.), physical properties (heat resistance, coefficient of thermal expansion, etc.). , Young's modulus, etc.), weather resistance, corrosion resistance, etc.
There are no restrictions on the type or combination of image sensors as long as they meet the specifications of the applied image sensor.
以下、実施例にしたがって本発明をさらに詳しく説明す
る。Hereinafter, the present invention will be explained in more detail according to Examples.
〔実施例−１〕
本発明をセンサチップ２本をつないで使用するボトム方
式の密着型イメージセンサに通用した。[Example 1] The present invention was applied to a bottom-type contact image sensor in which two sensor chips are connected.
その構造は第１図（ａ）および（ｂ）に示したようなも
のである。すなわち、絶縁物基板（１）として、ガラス
エポキシ項層板を用い、その表面に導体パターン（４）
および、ラインセンサ素子（２）を取り囲める大きさの
穴（３）を設けた。Its structure is as shown in FIGS. 1(a) and 1(b). That is, a glass epoxy layered plate is used as the insulator substrate (1), and a conductive pattern (4) is formed on the surface of the glass epoxy layered plate.
A hole (3) large enough to surround the line sensor element (2) was provided.
絶縁物基板およびラインセンサ素子の固定用の材料とし
て表面にシリコーン系の粘着剤（５）が塗布されたポリ
エステル系（ＰＥＴ＝ポリエチレンテレフタレート）の
フィルム（６）を用い、この表面にラインセンサ用素子
および上記の絶縁物基板を粘着固定し、アルミニウムワ
イヤー（７）でラインセンサ素子と絶縁物基板を接続し
導通をとっ、た。さらに、有機高分子材料として硬化後
の硬度がショアＡで５であるｆ寸前重合タイプのシリコ
ーン樹脂を用いてラインセンサ素子および接続部の保護
を行った。本実施例によって形成されたラインセンサは
、従来のものと比較して、従来例−２における利点を持
ちながら、特に耐熱衝撃性の向上が可能になった。A polyester (PET = polyethylene terephthalate) film (6) whose surface is coated with a silicone adhesive (5) is used as a material for fixing the insulator substrate and the line sensor element, and the line sensor element is attached to the surface of this film (6). Then, the above insulating substrate was fixed with adhesive, and the line sensor element and the insulating substrate were connected with an aluminum wire (7) to establish continuity. Furthermore, the line sensor element and the connecting portion were protected by using a nearly f-polymerization type silicone resin having a hardness of Shore A of 5 after curing as an organic polymer material. The line sensor formed according to this embodiment has the advantages of Conventional Example-2 compared to the conventional one, and can particularly improve thermal shock resistance.
以下に従来用いていた有機高分子材料と、本発明の高分
子材料との耐熱衝撃性、と耐湿性の比較を示す。A comparison of thermal shock resistance and moisture resistance between conventionally used organic polymer materials and the polymer material of the present invention will be shown below.
なお、以下の実施例においても同様のメリットが得られ
た。Note that similar merits were obtained in the following examples as well.
〔実施例−２〕
本発明を、２本のセンサチップをつないだ大型のボトム
タイプのラインセンサに用いた。その構造で２本のセン
サ素子は機械的に精度良く並べられており、つなぎ部に
紫外線硬化型のアクリル系接着剤を充填して光学的−様
性を確保した。他は実施例−１と同様であるので、この
構造においてはセンサチップおよびワイヤーにかかる熱
応力は極めて大きくなることが予想された。従って、有
機高分子材料としてショア硬度０のゲル状付加重合型シ
リコーンを用いた。これにより、極めて耐熱衝撃性の良
いラインセンサが得られた。[Example 2] The present invention was used in a large bottom type line sensor in which two sensor chips were connected. With this structure, the two sensor elements are mechanically aligned with high precision, and the joints are filled with UV-curable acrylic adhesive to ensure optical properties. Since the other aspects were the same as in Example-1, it was expected that the thermal stress applied to the sensor chip and wire would be extremely large in this structure. Therefore, a gel-like addition-polymerized silicone with a Shore hardness of 0 was used as the organic polymer material. As a result, a line sensor with extremely good thermal shock resistance was obtained.
〔実施例−３〕
実施例−１において、絶縁物基板およびラインセンサ素
子の固定用の材料として、表面にエポキシ系の接着剤が
塗布されたポリエーテルサルフォン（ＰＥＳ）フィルム
を用い、有機高分子材料としてショア硬度Ａ２０の１滴
型縮合型シリコーンを用いた。[Example 3] In Example 1, a polyether sulfone (PES) film coated with an epoxy adhesive on the surface was used as the material for fixing the insulator substrate and the line sensor element, and an organic polymer One drop type condensation type silicone with Shore hardness of A20 was used as the molecular material.
〔実施例−４〕
実施例−２に準じたものを、３本のセンサ素子からなる
大型イメージセンサに通用した。[Example 4] A device similar to Example 2 was applied to a large-sized image sensor consisting of three sensor elements.
以上に述べたように、本発明によれば、従来例−２が有
する
■部品点数の削減
■実装工程の削減と納期短縮
■センサ素子への応力緩和および接続点の減少による接
続信頼性向上
■モジュールの薄型化可能
といった利点に加え、
■使用できる絶縁物基板の範囲を極めて広くまで広げて
コスト的に有利な物を使用可能にする
■熱応力に対する信頼性も充分確保できるといった効果
がイメージセンサにもたらされる。As described above, according to the present invention, the advantages of Conventional Example-2 are: ■ Reduction in the number of parts ■ Reduction in the number of mounting steps and shortening of delivery time ■ Improvement in connection reliability due to relaxation of stress on the sensor element and reduction in connection points ■ In addition to the advantage of being able to make the module thinner, the image sensor also has the following advantages: ■It greatly expands the range of insulator substrates that can be used, making it possible to use cost-effective materials ■It also ensures sufficient reliability against thermal stress. brought to you.
また、本明細書では、ボトムタイプのリニアイメージセ
ンサおよびラインセンサのみについて説明してきたが、
ボトムタイプのエリアイメージセンサなどの池のボトム
タイプのイメージセンサにも適用可能で、同様な効果も
期待できる。Furthermore, in this specification, only bottom-type linear image sensors and line sensors have been described;
It can also be applied to bottom-type image sensors such as bottom-type area image sensors, and similar effects can be expected.
（ａ）および平面図（ｂ）である。(a) and a plan view (b).
１・・・絶縁物基板
２・・・ラインセンサ素子
３・・・穴
４・・・導体パターン
５・・・粘着剤（または、接着剤）
６・・・フィルム
７・・・ワイヤー
８・・・有機高分子材料
９・・・石英ガラス棒
第２図は、ラインセンサ素子の構成の概略を示す斜視図
である。1... Insulator substrate 2... Line sensor element 3... Hole 4... Conductor pattern 5... Adhesive (or adhesive) 6... Film 7... Wire 8... -Organic polymer material 9...quartz glass rod FIG. 2 is a perspective view showing the outline of the configuration of the line sensor element.
１０・・・基板
１１・・・受光素子
第３因は、トップタイプ方式の概念を示す断面図である
。10... Substrate 11... Light receiving element The third factor is a sectional view showing the concept of the top type system.
１０・・・基板
１１・・・受光素子
第４図は、ボトムタイプ方式の概念を示す断面図である
。10... Substrate 11... Light receiving element FIG. 4 is a sectional view showing the concept of the bottom type system.
１０・・・基板
１１・・・受光素子
第５図は、従来のボトムタイプのイメージセンサの構造
を示す断面図である。10... Substrate 11... Light receiving element FIG. 5 is a sectional view showing the structure of a conventional bottom type image sensor.
１２・・・導体パターン １３・・・絶縁物基板 １４・・・イメージセンサ素子 １５・・・接着剤 １６・・・ワイヤー １７・・・有機高分子材料 １８・・・ダムとなる構造物 以上 （ｂ＞12... Conductor pattern 13... Insulator substrate 14...Image sensor element 15...Adhesive 16...Wire 17...Organic polymer material 18...Structure that becomes a dam that's all (b>
Claims (1)
チックフィルムの接着若しくは粘着面に、導体パターン
およびイメージセンサ素子を取り囲める大きさの穴を有
する絶縁物基板と、当該穴の中にイメージセンサ素子が
固定され、この両者が電気的に接続され、イメージセン
サ素子及び電気的接続部が有機高分子材料でおおわれて
いる構造を持つイメージセンサにおいて、上記の有機高
分子材料がシリコーン系の化合物で、かつ硬化後の硬度
がショアＡ硬度で２０以下であることを特徴とするイメ
ージセンサ。(1) An insulator substrate having a hole large enough to surround a conductive pattern and an image sensor element on the adhesive or adhesive side of a plastic film having an adhesive layer or an adhesive layer on one side, and an image sensor inside the hole. In an image sensor having a structure in which the element is fixed, the two are electrically connected, and the image sensor element and the electrical connection part are covered with an organic polymer material, the above organic polymer material is a silicone-based compound. , and has a hardness of 20 or less in Shore A hardness after curing.
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63214443A JPH0263166A (en) | 1988-08-29 | 1988-08-29 | Image sensor |
| DE89114371T DE68911420T2 (en) | 1988-08-18 | 1989-08-03 | Solid state imaging device. |
| EP89114371A EP0355522B1 (en) | 1988-08-18 | 1989-08-03 | Solid state image pickup device |
| US07/393,729 US5068713A (en) | 1988-08-18 | 1989-08-15 | Solid state image sensing device |
| HK106497A HK106497A (en) | 1988-08-18 | 1997-06-26 | Solid state image pickup device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63214443A JPH0263166A (en) | 1988-08-29 | 1988-08-29 | Image sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0263166A true JPH0263166A (en) | 1990-03-02 |
Family
ID=16655858
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63214443A Pending JPH0263166A (en) | 1988-08-18 | 1988-08-29 | Image sensor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0263166A (en) |
-
1988
- 1988-08-29 JP JP63214443A patent/JPH0263166A/en active Pending
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