JPH0263538U - - Google Patents
Info
- Publication number
- JPH0263538U JPH0263538U JP14333688U JP14333688U JPH0263538U JP H0263538 U JPH0263538 U JP H0263538U JP 14333688 U JP14333688 U JP 14333688U JP 14333688 U JP14333688 U JP 14333688U JP H0263538 U JPH0263538 U JP H0263538U
- Authority
- JP
- Japan
- Prior art keywords
- movable plate
- fixed plate
- plate
- main body
- head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000523 sample Substances 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims 2
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
Description
第１図はこの考案に係るプローブヘツドの一実
施例を示す概略側面図である。第２図は従来のプ
ローブヘツドを示す概略側面図である。
１１…ヘツド本体、１２…固定板、１４…可動
板、１５…ヒンジ、１７…ニードル、１８…スラ
イド式カウンタバランサ、２１…タツチセンサ。
FIG. 1 is a schematic side view showing an embodiment of the probe head according to this invention. FIG. 2 is a schematic side view of a conventional probe head. DESCRIPTION OF SYMBOLS 11... Head main body, 12... Fixed plate, 14... Movable plate, 15... Hinge, 17... Needle, 18... Sliding type counter balancer, 21... Touch sensor.
Claims (1)
をその１点を支点として揺動可能に支持し、 上記可動板の先端部に、半導体ウエーハに形成
された半導体素子の表面電極に先端を接触させる
導電性測子を設けると共に、 上記可動板の後端部にスライド式カウンタバラ
ンサを設け、 上記固定板と可動板との間にタツチセンサを設
けたことを特徴とするプローブヘツド。[Claims for Utility Model Registration] A movable plate is swingably supported on a fixed plate horizontally supported on the head main body, and a semiconductor formed on a semiconductor wafer is attached to the tip of the movable plate. It is characterized by providing a conductive probe whose tip contacts the surface electrode of the element, a sliding counter balancer at the rear end of the movable plate, and a touch sensor between the fixed plate and the movable plate. probe head.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14333688U JPH0263538U (en) | 1988-10-31 | 1988-10-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14333688U JPH0263538U (en) | 1988-10-31 | 1988-10-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0263538U true JPH0263538U (en) | 1990-05-11 |
Family
ID=31410066
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14333688U Pending JPH0263538U (en) | 1988-10-31 | 1988-10-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0263538U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001041979A (en) * | 1999-05-26 | 2001-02-16 | Nidec-Read Corp | Printed circuit board inspecting device and probe to be used for the same |
| JP2001249167A (en) * | 2000-03-06 | 2001-09-14 | Tokyo Weld Co Ltd | Measuring probe drive |
| JP2002323516A (en) * | 2001-04-26 | 2002-11-08 | Mitsubishi Materials Corp | Probe device |
-
1988
- 1988-10-31 JP JP14333688U patent/JPH0263538U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001041979A (en) * | 1999-05-26 | 2001-02-16 | Nidec-Read Corp | Printed circuit board inspecting device and probe to be used for the same |
| JP2001249167A (en) * | 2000-03-06 | 2001-09-14 | Tokyo Weld Co Ltd | Measuring probe drive |
| JP2002323516A (en) * | 2001-04-26 | 2002-11-08 | Mitsubishi Materials Corp | Probe device |