JPH0263571U - - Google Patents
Info
- Publication number
- JPH0263571U JPH0263571U JP14294288U JP14294288U JPH0263571U JP H0263571 U JPH0263571 U JP H0263571U JP 14294288 U JP14294288 U JP 14294288U JP 14294288 U JP14294288 U JP 14294288U JP H0263571 U JPH0263571 U JP H0263571U
- Authority
- JP
- Japan
- Prior art keywords
- soldering piece
- electronic component
- main body
- base
- notch
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 5
- 239000011800 void material Substances 0.000 claims 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図は本考案の第１の実施例を示す電子部品
の斜視図、第２図は同第２の実施例を示す同斜視
図、第３図は同第３の実施例を示す同斜視図、第
４図は従来例を示すと共に半田付片より本体に流
れる熱移動の様子を示す同斜視図である。
図中、１……本体、２……側端面、３……半田
付片、４……孔、５……切り込み。
FIG. 1 is a perspective view of an electronic component showing a first embodiment of the present invention, FIG. 2 is a perspective view of an electronic component showing a second embodiment, and FIG. 3 is a perspective view of an electronic component showing a third embodiment of the present invention. 4 are perspective views showing a conventional example and showing how heat flows from the soldering piece to the main body. In the figure, 1... main body, 2... side end surface, 3... soldering piece, 4... hole, 5... notch.
Claims (1)
突設せしめた半田付片の基部寄りに孔あるいは切
り込み等の空隙部を形成し、本体と半田付片間の
熱抵抗を大ならしめることを特徴とする電子部品
の半田付片基部の構造。 A feature is that a void such as a hole or notch is formed near the base of a soldering piece that protrudes from the main body of an electronic component to be inserted into a printed wiring board, thereby increasing the thermal resistance between the main body and the soldering piece. The structure of the base of a soldering piece of an electronic component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14294288U JPH0263571U (en) | 1988-10-31 | 1988-10-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14294288U JPH0263571U (en) | 1988-10-31 | 1988-10-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0263571U true JPH0263571U (en) | 1990-05-11 |
Family
ID=31409316
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14294288U Pending JPH0263571U (en) | 1988-10-31 | 1988-10-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0263571U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0560150U (en) * | 1991-12-27 | 1993-08-06 | アスモ株式会社 | Coil bobbin for stepping motor |
| JP2017183906A (en) * | 2016-03-29 | 2017-10-05 | 株式会社大真空 | Piezoelectric oscillator |
-
1988
- 1988-10-31 JP JP14294288U patent/JPH0263571U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0560150U (en) * | 1991-12-27 | 1993-08-06 | アスモ株式会社 | Coil bobbin for stepping motor |
| JP2017183906A (en) * | 2016-03-29 | 2017-10-05 | 株式会社大真空 | Piezoelectric oscillator |