JPH0263597U - - Google Patents
Info
- Publication number
- JPH0263597U JPH0263597U JP14286488U JP14286488U JPH0263597U JP H0263597 U JPH0263597 U JP H0263597U JP 14286488 U JP14286488 U JP 14286488U JP 14286488 U JP14286488 U JP 14286488U JP H0263597 U JPH0263597 U JP H0263597U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- heat sink
- mounting structure
- back side
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図ａは本考案の一実施例の部品実装構造を
示す側面図、第１図ｂは第１図ａの裏面を示す平
面図、第２図、第３図はいずれも従来の実装構造
を示す斜視図、第４図は複数のトランジスタを同
一放熱板で放熱させる場合の従来の実装構造を示
す斜視図、第５図はメタルコアプリント基板を用
いた従来の放熱構造を示す斜視図である。
１，１１，１５，１８…プリント基板、２，９
，１３，１７…放熱板、３，８，１２，１６，１
９…トランジスタ、４，１０，１４…ネジ、５，
６…電気部品、７…穴、２０…メタルコアプリン
ト板。
Figure 1a is a side view showing a component mounting structure according to an embodiment of the present invention, Figure 1b is a plan view showing the back side of Figure 1a, and Figures 2 and 3 are conventional mounting structures. FIG. 4 is a perspective view showing a conventional mounting structure in which multiple transistors are dissipated using the same heat sink, and FIG. 5 is a perspective view showing a conventional heat dissipation structure using a metal core printed circuit board. . 1, 11, 15, 18...Printed circuit board, 2, 9
, 13, 17... Heat sink, 3, 8, 12, 16, 1
9... Transistor, 4, 10, 14... Screw, 5,
6... Electrical parts, 7... Holes, 20... Metal core printed board.
Claims (1)
に、放熱板を配置し、前記放熱板上にさらに電子
部品を配置して前記プリント基板に固定したこと
を特徴とする部品実装構造。 A component mounting structure characterized in that a heat sink is arranged on the back side of a printed circuit board on which electrical components are mounted, and electronic components are further arranged on the heat sink and fixed to the printed circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14286488U JPH0263597U (en) | 1988-10-31 | 1988-10-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14286488U JPH0263597U (en) | 1988-10-31 | 1988-10-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0263597U true JPH0263597U (en) | 1990-05-11 |
Family
ID=31409174
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14286488U Pending JPH0263597U (en) | 1988-10-31 | 1988-10-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0263597U (en) |
-
1988
- 1988-10-31 JP JP14286488U patent/JPH0263597U/ja active Pending
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