JPH0264032U - - Google Patents
Info
- Publication number
- JPH0264032U JPH0264032U JP14266788U JP14266788U JPH0264032U JP H0264032 U JPH0264032 U JP H0264032U JP 14266788 U JP14266788 U JP 14266788U JP 14266788 U JP14266788 U JP 14266788U JP H0264032 U JPH0264032 U JP H0264032U
- Authority
- JP
- Japan
- Prior art keywords
- copper
- copper layer
- layer
- insulating resin
- clad laminate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 239000010949 copper Substances 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- 150000001879 copper Chemical class 0.000 claims 1
- 230000002093 peripheral effect Effects 0.000 claims 1
Landscapes
- Laminated Bodies (AREA)
Description
第１図、第２図はこの考案にかかる銅張り積層
板の実施例の構成をあらわす断面図である。
１……第１の銅層、２……絶縁樹脂層、３……
アルミニウム板、４……第２の銅層。
FIGS. 1 and 2 are cross-sectional views showing the structure of an embodiment of the copper-clad laminate according to this invention. 1... First copper layer, 2... Insulating resin layer, 3...
Aluminum plate, 4... second copper layer.
Claims (1)
と絶縁樹脂層の他面に形成された放熱体とからな
りこの放熱体は、放熱体の露出する周面に第２の
銅層を有し、この銅層で被覆されたアルミニウム
板でなる銅張り積層板。 (2) 第２の銅層の層厚が第１の銅層より厚いこ
とを特徴とする請求項(1)記載の銅張り積層板。[Claims for Utility Model Registration] (1) The heat sink consists of a first copper layer formed on one side of the insulating resin layer and a heat sink formed on the other side of the insulating resin layer. A copper-clad laminate comprising an aluminum plate having a second copper layer on its peripheral surface and covered with this copper layer. (2) The copper-clad laminate according to claim (1), wherein the second copper layer is thicker than the first copper layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14266788U JPH0264032U (en) | 1988-10-31 | 1988-10-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14266788U JPH0264032U (en) | 1988-10-31 | 1988-10-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0264032U true JPH0264032U (en) | 1990-05-14 |
Family
ID=31408811
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14266788U Pending JPH0264032U (en) | 1988-10-31 | 1988-10-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0264032U (en) |
-
1988
- 1988-10-31 JP JP14266788U patent/JPH0264032U/ja active Pending
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