JPH0265346U - - Google Patents
Info
- Publication number
- JPH0265346U JPH0265346U JP14407588U JP14407588U JPH0265346U JP H0265346 U JPH0265346 U JP H0265346U JP 14407588 U JP14407588 U JP 14407588U JP 14407588 U JP14407588 U JP 14407588U JP H0265346 U JPH0265346 U JP H0265346U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- circuit board
- exterior resin
- flow prevention
- prevention wall
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図ａおよびｂはそれぞれ本考案の一実施例
を示す混成集積回路装置の斜視図およびそのＡ―
Ａ′断面図、第２図は本考案の他の実施例を示す
混成集積回路装置の断面図、第３図ａおよびｂは
それぞれ従来の混成集積回路装置の斜視図および
そのＢ―Ｂ′断面図である。
１……集積回路基板、２……外装樹脂、３……
樹脂流れ防止壁、４……リード部、５……外装樹
脂塗布面の境界線、６……リード、７……樹脂の
はい上がり層、８……第１の樹脂流れ防止壁、９
……第２の樹脂流れ防止壁。
1A and 1B are perspective views of a hybrid integrated circuit device showing an embodiment of the present invention, and FIGS.
A' sectional view, FIG. 2 is a sectional view of a hybrid integrated circuit device showing another embodiment of the present invention, and FIGS. 3 a and b are respectively a perspective view of a conventional hybrid integrated circuit device and its B-B' sectional view. It is a diagram. 1... Integrated circuit board, 2... Exterior resin, 3...
Resin flow prevention wall, 4... Lead portion, 5... Boundary line of exterior resin coated surface, 6... Lead, 7... Resin crawling layer, 8... First resin flow prevention wall, 9
...Second resin flow prevention wall.
Claims (1)
集積回路基板の側辺から引出されるリードと、前
記集積回路基板上を被覆する外装樹脂とを含み、
前記集積回路基板の外装樹脂塗布面の境界線上に
樹脂の流れ防止壁を設けることを特徴とする混成
集積回路装置。 The integrated circuit board includes an integrated circuit board on which a semiconductor chip is mounted, a lead drawn out from a side of the integrated circuit board, and an exterior resin covering the integrated circuit board,
A hybrid integrated circuit device characterized in that a resin flow prevention wall is provided on the boundary line of the exterior resin coated surface of the integrated circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14407588U JPH0265346U (en) | 1988-11-02 | 1988-11-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14407588U JPH0265346U (en) | 1988-11-02 | 1988-11-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0265346U true JPH0265346U (en) | 1990-05-16 |
Family
ID=31411461
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14407588U Pending JPH0265346U (en) | 1988-11-02 | 1988-11-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0265346U (en) |
-
1988
- 1988-11-02 JP JP14407588U patent/JPH0265346U/ja active Pending