JPH0268432U - - Google Patents
Info
- Publication number
- JPH0268432U JPH0268432U JP14916188U JP14916188U JPH0268432U JP H0268432 U JPH0268432 U JP H0268432U JP 14916188 U JP14916188 U JP 14916188U JP 14916188 U JP14916188 U JP 14916188U JP H0268432 U JPH0268432 U JP H0268432U
- Authority
- JP
- Japan
- Prior art keywords
- molded
- capacitor element
- standoff
- insulating material
- solid electrolytic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003990 capacitor Substances 0.000 claims description 6
- 239000007787 solid Substances 0.000 claims description 3
- 239000011810 insulating material Substances 0.000 claims 2
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
第１図ａ，ｂは本考案の一実施例の側面図およ
び底面図、第２図ａ，ｂは本考案の他の実施例の
側面図および底面図、第３図ａ，ｂは従来のチツ
プ形固体電解コンデンサの一例の側面図および底
面図である。
１……陽極リード端子、２……陰極リード端子
、３……絶縁部材、４……スタンドオフ。
Figures 1 a and b are side and bottom views of one embodiment of the present invention, Figures 2 a and b are side and bottom views of another embodiment of the present invention, and Figures 3 a and b are views of the conventional FIG. 2 is a side view and a bottom view of an example of a chip-type solid electrolytic capacitor. 1... Anode lead terminal, 2... Cathode lead terminal, 3... Insulating member, 4... Standoff.
Claims (1)
的・機械的に取り出し、接続部を含むコンデンサ
素子およびスタンドオフを樹脂等の絶縁部材でモ
ールド成型等されたチツプ形固体電解コンデンサ
において、前記絶縁部材でモールド成型されたス
タンドオフの位置を製品の縦軸または横軸の中心
線に対していずれか片方にずらして非対称となる
ように位置させ、かつ形状を平板状から突起状に
したことを特徴とするチツプ形固体電解コンデン
サ。 In a chip-type solid electrolytic capacitor in which the positive and cathode lead terminals are electrically and mechanically taken out from the capacitor element, and the capacitor element including the connection part and the standoffs are molded with an insulating material such as resin, the capacitor element and the standoff are molded with the insulating material. The molded standoff is positioned asymmetrically by shifting it to either the center line of the vertical or horizontal axis of the product, and the shape is changed from a flat plate to a protruding shape. Chip type solid electrolytic capacitor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14916188U JPH0268432U (en) | 1988-11-15 | 1988-11-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14916188U JPH0268432U (en) | 1988-11-15 | 1988-11-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0268432U true JPH0268432U (en) | 1990-05-24 |
Family
ID=31421139
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14916188U Pending JPH0268432U (en) | 1988-11-15 | 1988-11-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0268432U (en) |
-
1988
- 1988-11-15 JP JP14916188U patent/JPH0268432U/ja active Pending