JPH0268493U - - Google Patents

Info

Publication number
JPH0268493U
JPH0268493U JP1988147930U JP14793088U JPH0268493U JP H0268493 U JPH0268493 U JP H0268493U JP 1988147930 U JP1988147930 U JP 1988147930U JP 14793088 U JP14793088 U JP 14793088U JP H0268493 U JPH0268493 U JP H0268493U
Authority
JP
Japan
Prior art keywords
heat sink
electronic component
aluminum heat
insulating coating
direct contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988147930U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988147930U priority Critical patent/JPH0268493U/ja
Publication of JPH0268493U publication Critical patent/JPH0268493U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Insulating Bodies (AREA)
JP1988147930U 1988-11-12 1988-11-12 Pending JPH0268493U (lt)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988147930U JPH0268493U (lt) 1988-11-12 1988-11-12

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988147930U JPH0268493U (lt) 1988-11-12 1988-11-12

Publications (1)

Publication Number Publication Date
JPH0268493U true JPH0268493U (lt) 1990-05-24

Family

ID=31418792

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988147930U Pending JPH0268493U (lt) 1988-11-12 1988-11-12

Country Status (1)

Country Link
JP (1) JPH0268493U (lt)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007194442A (ja) * 2006-01-20 2007-08-02 Fuji Electric Holdings Co Ltd 半導体装置
JP2011054607A (ja) * 2009-08-31 2011-03-17 Denso Corp 樹脂封止型半導体装置およびその製造方法
JP2012195492A (ja) * 2011-03-17 2012-10-11 Mitsubishi Electric Corp パワー半導体モジュール及びその取り付け構造
JP2023110904A (ja) * 2022-01-28 2023-08-09 トヨタ モーター エンジニアリング アンド マニュファクチャリング ノース アメリカ,インコーポレイティド パワーエレクトロニクスアセンブリ及びその製造方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007194442A (ja) * 2006-01-20 2007-08-02 Fuji Electric Holdings Co Ltd 半導体装置
JP2011054607A (ja) * 2009-08-31 2011-03-17 Denso Corp 樹脂封止型半導体装置およびその製造方法
JP2012195492A (ja) * 2011-03-17 2012-10-11 Mitsubishi Electric Corp パワー半導体モジュール及びその取り付け構造
JP2023110904A (ja) * 2022-01-28 2023-08-09 トヨタ モーター エンジニアリング アンド マニュファクチャリング ノース アメリカ,インコーポレイティド パワーエレクトロニクスアセンブリ及びその製造方法

Similar Documents

Publication Publication Date Title
JPS6280392U (lt)
JPH0338693U (lt)
JPH0187547U (lt)
JPH02127068U (lt)
JPS62118496U (lt)
JPS5974757U (ja) 放熱性に優れた回路基板
JPH0345679U (lt)
JPS61205145U (lt)
JPH0338653U (lt)
JPS6444641U (lt)
JPH0330458U (lt)
JPH01130592U (lt)
JPH0361371U (lt)
JPS63165852U (lt)
JPS6252989U (lt)
JPH0264032U (lt)
JPH0227759U (lt)
JPH0221748U (lt)
JPH01121969U (lt)
JPS6452248U (lt)
JPH02131395U (lt)
JPH02136332U (lt)
JPH01154689U (lt)
JPH02108359U (lt)
JPH01130591U (lt)