JPH0269864U - - Google Patents
Info
- Publication number
- JPH0269864U JPH0269864U JP14809088U JP14809088U JPH0269864U JP H0269864 U JPH0269864 U JP H0269864U JP 14809088 U JP14809088 U JP 14809088U JP 14809088 U JP14809088 U JP 14809088U JP H0269864 U JPH0269864 U JP H0269864U
- Authority
- JP
- Japan
- Prior art keywords
- resin film
- conductive resin
- carrier tape
- lid material
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims 3
- 239000011347 resin Substances 0.000 claims 3
- 239000011231 conductive filler Substances 0.000 claims 1
- 239000012793 heat-sealing layer Substances 0.000 claims 1
- 238000010030 laminating Methods 0.000 claims 1
- 229920003002 synthetic resin Polymers 0.000 claims 1
- 239000000057 synthetic resin Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Packages (AREA)
- Packaging Frangible Articles (AREA)
Description
第１図は本考案のキヤリヤーテープ用蓋材の断
面を図解的に示す図、第２図は本考案のキヤリヤ
ーテープ用蓋材の使用を図解的に示す断面図、第
３図及び第４図は従来のキヤリヤーテープ用蓋材
の断面図を図解的に示す図である。
FIG. 1 is a cross-sectional view schematically showing the cover material for a carrier tape of the present invention, FIG. 2 is a cross-sectional view schematically showing the use of the cover material for a carrier tape of the present invention, and FIGS. FIG. 4 is a diagram schematically showing a cross-sectional view of a conventional lid material for a carrier tape.
Claims (1)
を積層し、該導電性樹脂フイルムの表面に易開封
性ヒートシール層を設けたことを特徴とするキヤ
リヤーテープ用蓋材。 (2) 導電性樹脂フイルムが導電性充填剤を含む
請求項１に記載のキヤリヤーテープ用蓋材。[Claims for Utility Model Registration] (1) For a carrier tape characterized by laminating a synthetic resin film and a conductive resin film, and providing an easily openable heat-sealing layer on the surface of the conductive resin film. Lid material. (2) The carrier tape lid material according to claim 1, wherein the conductive resin film contains a conductive filler.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14809088U JPH0269864U (en) | 1988-11-15 | 1988-11-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14809088U JPH0269864U (en) | 1988-11-15 | 1988-11-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0269864U true JPH0269864U (en) | 1990-05-28 |
Family
ID=31419092
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14809088U Pending JPH0269864U (en) | 1988-11-15 | 1988-11-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0269864U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011010453A1 (en) * | 2009-07-22 | 2011-01-27 | 住友ベークライト株式会社 | Cover tape for packaging electronic part and electronic part package |
| JP2011121602A (en) * | 2009-12-09 | 2011-06-23 | Denki Kagaku Kogyo Kk | Method for reducing peeling charge amount of carrier tape body |
-
1988
- 1988-11-15 JP JP14809088U patent/JPH0269864U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011010453A1 (en) * | 2009-07-22 | 2011-01-27 | 住友ベークライト株式会社 | Cover tape for packaging electronic part and electronic part package |
| CN102470964A (en) * | 2009-07-22 | 2012-05-23 | 住友电木株式会社 | Electronic component packaging upper tape and electronic component package |
| JP2011121602A (en) * | 2009-12-09 | 2011-06-23 | Denki Kagaku Kogyo Kk | Method for reducing peeling charge amount of carrier tape body |
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