JPH0270344A - Linear solder forming and supply method and device - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION (a) Industrial Application Fields The present invention is applicable to, for example, the case where a ring-shaped solder is supplied to the soldering position when a focusing ring is soldered to the lamp base of a halogen lamp. The present invention relates to a method and apparatus for forming and feeding linear solder suitable for forming solder into a ring shape and feeding it to a desired position.

(b) Prior Art In the manufacturing process of a halogen lamp, there is a step of soldering a focusing ring r to a base r of a lamp 2, as shown in FIG. In such a case, it is necessary to form the solder h fed in the form of a wire into a ring shape and then supply the solder to the position where the solder is to be soldered, that is, to the position above the focus ring around the lamp base f. , as shown in Fig. 7, the tip of the supplied nine wires of solder h is gripped by a claw that can move about one turn along the outer periphery of the forming rod a, and the claw is moved around the forming rod a. Then, the solder h was wrapped around the molded rod, molded, and cut at a predetermined position.

However, in this conventional forming method, the tip of the solder is grasped and the claw is rotated approximately once around the outer periphery of the forming rod, so the forming operation takes time, which hinders the speeding up of solder forming and supply. It has become.

(c) Problems to be Solved by the Invention The problems to be solved by the present invention are to provide a linear solder forming and supplying method and apparatus in which a pair of movable forming dies are simultaneously moved in opposite directions around the outer periphery of a stationary forming die. The goal is to speed up molding and supply by molding.

(d) Means for Solving the Problems One of the inventions of the present application is a method of forming linear solder into a ring shape, in which the linear solder is supplied tangentially to the outer periphery of a cylindrical stationary molding die. The linear solder is held by a holding device and the stationary molding die, the linear solder is cut to a predetermined length, and a pair of movable wires are cut along the outer periphery of the stationary molding die on both sides of the position where the linear solder is held. It is configured to move the molding die and mold the linear solder into a ring shape using the stationary molding die and the movable molding die on the outer periphery.

Another invention of the present application is configured to further move the soldering position directly below the stationary molding die and push the molded solder down to the molding position.

A linear solder forming apparatus according to another invention of the present application includes a cylindrical stationary forming die that can move up and down, and a supply device that supplies linear solder to the outer circumference of the stationary forming die for a predetermined length in a tangential direction. a holding device that holds the supplied solder in cooperation with the stationary molding die; and a pair of holding devices that move along the outer periphery of the stationary molding die to form the linear solder on the outer periphery of the stationary molding die. It is configured with a movable molding die.

A linear solder forming and supplying device according to still another invention of the present application further includes a pushing member that is movable relative to the stationary molding die and pushes the molded solder on the outer periphery of the stationary molding die. Configured with the necessary features.

(E) Effect In the above configuration, linear solder is supplied tangentially around the stationary molding die by the supply device, and the linear solder is held by the holding device in cooperation with the stationary molding die.

Thereafter, the pair of movable molding dies move along the outer periphery of the stationary molding die on opposite sides of the holding device to form the solder into a ring shape along the outer periphery of the static molding die. After the solder is formed, the pusher is operated to push down the solder and deliver it to the soldering position.

(f) Example Embodiments of the present invention will be described below with reference to the drawings.

In FIG. 1, a linear solder forming and feeding apparatus (hereinafter simply referred to as forming and feeding apparatus) (2) of the first embodiment is shown. This molding supply device 1 is broadly divided into a stationary molding die 2,
It is provided with a movable molding die 3 that moves along the outer periphery of the stationary molding die 2, a drive mechanism 4 for the movable molding die 3, a linear solder supply device 5, and a solder holding device 6.

The stationary molding die 2 is integrally formed with a cylindrical portion 21 and a tapered portion 22 that continues to the lower end of the cylindrical portion and widens toward the end. A recess 23 (FIG. 3) is formed in the lower surface of the stationary molding die 2. This stationary molding die 2 is supported so as to be movable up and down by a known mechanism such as a cylinder. Note that "stationary" here means that the solder is stationary during molding, but does not mean that the solder itself does not move at all.

The drive mechanism 4 includes a movable frame 41 that can reciprocate horizontally toward a stationary molding die, a pair of arc-shaped molding arms 42 rotatably attached to the movable frame 41 by pins 43, and molding arms 42. and a spring 44 that presses them in a direction toward each other. The arc-shaped molding arms 42 are arranged symmetrically so as to convex outward, and the arc-shaped movable molding die 3 is fixed to the tip thereof.

A roller 45 is rotatably attached to each forming arm 42. This roller 45 is adapted to engage with a cam 48 fixed to a piston rod 47 of a cylinder 46 provided on the rotating frame 41.

The cam thus engages the roller 45 and opens the forming arm 42 by its action.

Note that the movable molding die 3 may be rotatably attached to the molding arm 42 without being fixed to it.

The supply device 5 includes a solder feeding chuck 51 that pinches the solder and feeds it linearly toward a stationary molding die using a pair of members 511 and 512, and a pair of members 521 and 522 that hold down the solder fed out by the solder feeding chuck 51. It is equipped with a solder holding device 52, a cutter 53 having a guide member 531 for passing the solder through a straight hole, and a blade 532 for cutting the linear solder h in cooperation with the guide member 531. The device for operating the solder feed chuck, presser device, and cutter may have a known structure such as a cylinder.

The holding device 6 consists of a rod 61 which is adapted to be moved towards the stationary molding die 2 by means of a cylinder or the like.

A sleeve-shaped pushing member 7 is provided on the outer periphery of the stationary molding die 2 so as to be movable in the axial direction with respect to the stationary molding die 2 . This pushing member 7 is a stationary molding die 2
It moves up and down together with the robot, and can be moved independently by a drive device (not shown) such as a single cylinder.

In the apparatus having the above configuration, the linear solder h is supplied to the supply device 5.
is supplied to the outer periphery of the cylindrical portion 21 of the stationary molding die 2 in a tangential direction as shown in FIGS. 1 and 2 [A]. At this time, the movable frame 41 of the drive mechanism 4 is moving forward, and the pair of molding arms 42 are moved forward.

The solder h is arranged so that approximately the center of the required length is located at the stationary molding die 2. When the solder h is supplied, the rod 61 of the holding device 6 and the stationary molding die hold the solder, and then the cutter 63 cuts it at a predetermined position.

After that, when the movable frame 41 moves away from the stationary molding die 2 in the direction of the arrow x (FIG. 2 [B]), the molding arms are pulled in the direction toward each other by the spring 44, so the movable molding die 3 moves away from the stationary molding die 2. As shown in FIG. 2 [B] and [CI],
Solder h is molded on the outer periphery of the static molding die 2. When the molding is completed, the solder h moves backward and releases the holding of the solder h, but the solder h does not fall due to the action of the tapered portion 22 and remains at that position. Thereafter, the cam 48 of the drive mechanism 4 is moved by the cylinder 46 as shown by the arrow Y in FIG.
, and the pair of rollers 45 are separated. Therefore, the pair of forming arms 42 are opened as shown in the figure.

Next, the soldering position, i.e., the focusing ring r of the lamp l, is brought directly below the stationary molding die 2, as shown in FIG. 3 [A]. Then, the stationary molding die 2 and the sleeve-shaped pushing member 7 on its outer periphery are lowered as shown in FIG. 3 [81]. At this time, the metal piece S protruding from the upper end of the die f enters the recess 23 at the lower end of the stationary molding die 2.

Thereafter, only the pushing member 7 is lowered to push and supply the molded solder h onto the focus ring r of the lamp l.

When the supply of solder is completed, only the pushing member 7 rises, and then the stationary molding die 2 and the pushing member 7 rise to their original positions.

When the stationary molding die 2 returns to the predetermined position, the molding arm 42
In the open state as shown in FIG. 2 [01], the movable frame 41 moves in the direction of arrow Z in the same figure, and moves the movable molding die 3 toward the holding device. Thereafter, only the cam 48 is moved in the direction opposite to the arrow Y, so that the forming arm 42 and the movable forming die 3 are in the position shown in FIG. 2 (81).

4 and 5, a variation of the stationary molding die and holding device is shown. This stationary molding die 2a is entirely formed into a cylindrical shape, and the holding bag Tt6a is
attached to a. This holding device 6a is a holding arm 61a rotatably attached to the stationary molding die 2a.
and a spring 62a that presses the holding arm,
When supplying solder, press the holding arm side of the holding arm 61a.

The pushing member 7a has a groove 71a that escapes the holding device.
is formed.

(G) Effects According to the present invention, the following effects can be achieved.

■ Molding can be done quickly because it is only necessary to move the pair of movable molding dies approximately the length of a semicircle along the outer periphery of the stationary molding die.

■ After lowering the stationary molding die, the molded solder can be supplied simply by lowering the pushing member, making molding and supplying of solder simple and quick.

(2) According to the embodiment shown in FIG. 1, the structure can be simplified because the formed solder can be prevented from falling due to the action of the tapered portion.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of a linear solder forming and supplying apparatus according to the present invention, FIG. 2 is an explanatory diagram of the forming operation of the apparatus of FIG. 1, and FIG. 3 is an explanatory diagram of the supplying operation of the apparatus of FIG. 1. 4 and 5 are views showing a modified example of a stationary molding die and a holding device, FIG. 6 is a view showing a focus ring of a lamp, and FIG. 7 is a view showing a conventional molding device. l; Molding supply device 2.2a: Stationary molding die 3.3a: Movable molding die 4: Drive mechanism 41: Movable frame 42: Molding arm 5: Feeding device 6.6a: Holding device 7: Pushing member (four other people)

Claims (1)

[Claims] 1. In a method of forming linear solder into a ring shape, the linear solder is supplied tangentially to the outer periphery of a cylindrical stationary molding die, and the linear solder is connected to a holding device and the stationary molding die. Hold the linear solder with a molding die, cut the linear solder to a predetermined length, move a pair of movable molding dies along the outer periphery of the stationary molding die on both sides of the position where the linear solder is held, and stop it on the outer periphery. A method for forming linear solder, comprising forming the linear solder into a ring shape using a forming die and the movable forming die. 2. In the method of forming linear solder into a ring shape and then supplying the solder to a soldering position, the linear solder is supplied tangentially to the outer periphery of a cylindrical stationary molding die to hold the linear solder. The linear solder is held by a device and the static molding die, the linear solder is cut to a predetermined length, and a pair of movable molding dies are moved along the outer periphery of the static molding die on both sides of the position where the linear solder is held. forming the linear solder into a ring shape on the outer periphery using a stationary forming die and the movable forming die, moving the soldering position directly below the stationary forming die, and pushing down the formed solder to the forming position. A method for forming and supplying linear solder, which is characterized by: 3. A cylindrical stationary molding die that can move up and down, a supply device that supplies a predetermined length of linear solder to the outer periphery of the stationary molding die in a tangential direction, and a feeding device that supplies the supplied solder to the stationary molding die. A linear solder forming apparatus comprising a holding device that cooperates to hold the linear solder, and a pair of movable forming dies that move along the outer periphery of the stationary forming die and form the linear solder on the outer periphery of the stationary forming die. . 4. A cylindrical stationary molding die that can move up and down, a supply device that supplies a predetermined length of linear solder to the outer periphery of the static molding die in a tangential direction, and a feeding device that supplies the supplied solder to the stationary molding die. a pair of movable molding dies that move along the outer periphery of the stationary molding die to form the linear solder onto the outer periphery of the static molding die; A linear solder forming and supplying device comprising a pushing member which is movably provided to push the formed solder on the outer periphery of the stationary forming die.