JPH0272575U - - Google Patents
Info
- Publication number
- JPH0272575U JPH0272575U JP15170188U JP15170188U JPH0272575U JP H0272575 U JPH0272575 U JP H0272575U JP 15170188 U JP15170188 U JP 15170188U JP 15170188 U JP15170188 U JP 15170188U JP H0272575 U JPH0272575 U JP H0272575U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- cut
- unnecessary portion
- line
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structure Of Printed Boards (AREA)
Description
第１図は本考案のプリント配線基板の要部を示
す一部拡大した平面図、第２図はプリント配線基
板から不要部分を切除した状態を示す一部拡大し
た平面図、第３図は従来のプリント配線基板の要
部を示す一部拡大した平面図、第４図は第３図に
示すプリント配線基板から不要部分を切除した状
態を示す一部拡大した平面図である。
１……プリント配線基板、２……不要部分（除
去基板）、３……切断線、７……シルク印刷、８
ａ〜８ｂ……バリ。
Fig. 1 is a partially enlarged plan view showing the main parts of the printed wiring board of the present invention, Fig. 2 is a partially enlarged plan view showing the printed wiring board with unnecessary parts removed, and Fig. 3 is the conventional one. FIG. 4 is a partially enlarged plan view showing the main parts of the printed wiring board shown in FIG. 3, with unnecessary parts removed. 1... Printed wiring board, 2... Unnecessary part (removed board), 3... Cutting line, 7... Silk printing, 8
a~8b...Bali.
Claims (1)
シン目状の切断線が形成されたプリント配線基板
において、 前記不要部分の領域に、前記切断線に沿つて識
別可能な印刷部分が施されたことを特徴とするプ
リント配線基板。[Claims for Utility Model Registration] In a printed wiring board in which a perforation-like cutting line is formed along the cut-out portion to remove an unnecessary portion, the area of the unnecessary portion can be identified along the cut-off line. A printed wiring board characterized by having a printed part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15170188U JPH0272575U (en) | 1988-11-21 | 1988-11-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15170188U JPH0272575U (en) | 1988-11-21 | 1988-11-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0272575U true JPH0272575U (en) | 1990-06-01 |
Family
ID=31425980
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15170188U Pending JPH0272575U (en) | 1988-11-21 | 1988-11-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0272575U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017216385A (en) * | 2016-06-01 | 2017-12-07 | 三菱電機エンジニアリング株式会社 | Printed circuit board manufacturing method |
-
1988
- 1988-11-21 JP JP15170188U patent/JPH0272575U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017216385A (en) * | 2016-06-01 | 2017-12-07 | 三菱電機エンジニアリング株式会社 | Printed circuit board manufacturing method |