JPH0273334U - - Google Patents

Info

Publication number
JPH0273334U
JPH0273334U JP15445688U JP15445688U JPH0273334U JP H0273334 U JPH0273334 U JP H0273334U JP 15445688 U JP15445688 U JP 15445688U JP 15445688 U JP15445688 U JP 15445688U JP H0273334 U JPH0273334 U JP H0273334U
Authority
JP
Japan
Prior art keywords
piezoelectric element
print head
lead wire
piezoelectric
adjacent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15445688U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP15445688U priority Critical patent/JPH0273334U/ja
Publication of JPH0273334U publication Critical patent/JPH0273334U/ja
Pending legal-status Critical Current

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  • Impact Printers (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図及び第2図は本考案の第一の実施例を説
明するための図であり、第1図は、圧電素子の配
列状態を示し、従来例に関する第9図と同様に、
明確化のために圧電素子と接続部のみを示した模
式図、第2A図は第1図に示した実施例の各圧電
素子を示す平面図、第2B図は同側面図、第2C
図は同正面図、第3図は本考案の第二の実施例を
説明するための第1図と同様な模式図、第4図及
び第5図は本考案の第三の実施例を説明するため
の図であり、第4図は第1図と同様な模式図、第
5A図は第4図に示した実施例の各圧電素子を示
す平面図、第5B図は同側面図、第5C図は同正
面図、第6図〜第9図は従来例を説明するための
図であり、第6A図は従来例の圧電素子を示す平
面図、第6B図は同側面図、第6C図は同正面図
、第7図は従来例の印字ユニツト、第8図は従来
例の印字ヘツドの縦断面図、第9図は第8図の
―線断面図であるが圧電素子の配列状態を明確
にするため圧電素子と接続部のみを示した模式図
である。 1……圧電素子1,5……リード線、6……接
続部、8a,8b……対向する側面、9…a,9
b……隣接する側面、C……中心。
1 and 2 are diagrams for explaining the first embodiment of the present invention, and FIG. 1 shows the arrangement state of piezoelectric elements, and similarly to FIG. 9 regarding the conventional example,
For clarity, FIG. 2A is a schematic diagram showing only the piezoelectric element and the connection part, FIG. 2A is a plan view showing each piezoelectric element of the embodiment shown in FIG. 1, FIG. 2B is a side view of the same, and FIG.
The figure is a front view of the same, Figure 3 is a schematic diagram similar to Figure 1 for explaining the second embodiment of the present invention, and Figures 4 and 5 are for explaining the third embodiment of the present invention. FIG. 4 is a schematic diagram similar to FIG. 1, FIG. 5A is a plan view showing each piezoelectric element of the embodiment shown in FIG. 4, FIG. 5B is a side view of the same, and FIG. FIG. 5C is a front view of the same, FIGS. 6 to 9 are diagrams for explaining the conventional example, FIG. 6A is a plan view showing the piezoelectric element of the conventional example, FIG. 6B is a side view of the same, and FIG. 7 is a front view of the same, FIG. 7 is a conventional printing unit, FIG. 8 is a vertical sectional view of a conventional printing head, and FIG. 9 is a sectional view taken along the line - in FIG. 8, showing the arrangement of piezoelectric elements. FIG. 2 is a schematic diagram showing only the piezoelectric element and the connection portion for clarity. DESCRIPTION OF SYMBOLS 1...Piezoelectric element 1, 5...Lead wire, 6...Connection part, 8a, 8b...Opposing side surface, 9...a, 9
b...adjacent side, C...center.

Claims (1)

【実用新案登録請求の範囲】 (1) 複数個並べて配列された横断面ほぼ矩形の
圧電素子にして各圧電素子が互いに対向する側面
及び該対向する側面に隣接する側面を有するもの
と、各圧電素子へ電圧を供給するリード線を備え
るドツトプリンタの印字ヘツドにおいて、各圧電
素子とリード線との接続部を圧電素子の前記隣接
する側面に設けたことを特徴とする、ドツトプリ
ンタの印字ヘツド。 (2) 円形又は円弧状に複数個並べて配列された
横断面ほぼ矩形の圧電素子と、各圧電素子へ電圧
を供給するリード線を有するドツトプリンタの印
字ヘツドにおいて、各圧電素子とリード線との接
続部を、相隣り合う圧電素子が対向する側面上に
おいて前記円形又は円弧の中心から遠い側の端部
に設けたことを特徴とする、ドツトプリンタの印
字ヘツド。
[Claims for Utility Model Registration] (1) A plurality of piezoelectric elements each having a substantially rectangular cross section arranged side by side, each piezoelectric element having a side surface facing each other and a side surface adjacent to the opposite side surface; A print head for a dot printer comprising lead wires for supplying voltage to the elements, characterized in that a connection portion between each piezoelectric element and the lead wire is provided on the adjacent side surface of the piezoelectric element. (2) Connection between each piezoelectric element and the lead wire in a print head of a dot printer that has a plurality of piezoelectric elements arranged in a circular or arc shape and each having a substantially rectangular cross section and a lead wire that supplies voltage to each piezoelectric element. A print head for a dot printer, characterized in that a portion is provided at an end of the circle or arc on the side far from the center on the side surface where adjacent piezoelectric elements face each other.
JP15445688U 1988-11-28 1988-11-28 Pending JPH0273334U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15445688U JPH0273334U (en) 1988-11-28 1988-11-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15445688U JPH0273334U (en) 1988-11-28 1988-11-28

Publications (1)

Publication Number Publication Date
JPH0273334U true JPH0273334U (en) 1990-06-05

Family

ID=31431200

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15445688U Pending JPH0273334U (en) 1988-11-28 1988-11-28

Country Status (1)

Country Link
JP (1) JPH0273334U (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS574345B2 (en) * 1976-06-07 1982-01-26
JPS57163579A (en) * 1981-02-25 1982-10-07 Honeywell Inf Systems Assembled body of electromagnet for mosaic printing head and its manufacture
JPS6038847A (en) * 1983-08-12 1985-02-28 Hitachi Ltd Resin-sealed semiconductor device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS574345B2 (en) * 1976-06-07 1982-01-26
JPS57163579A (en) * 1981-02-25 1982-10-07 Honeywell Inf Systems Assembled body of electromagnet for mosaic printing head and its manufacture
JPS6038847A (en) * 1983-08-12 1985-02-28 Hitachi Ltd Resin-sealed semiconductor device

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