JPH0273788U - - Google Patents
Info
- Publication number
- JPH0273788U JPH0273788U JP15315188U JP15315188U JPH0273788U JP H0273788 U JPH0273788 U JP H0273788U JP 15315188 U JP15315188 U JP 15315188U JP 15315188 U JP15315188 U JP 15315188U JP H0273788 U JPH0273788 U JP H0273788U
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- electronic device
- circuit board
- heat sink
- dissipation plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims description 4
- 238000001816 cooling Methods 0.000 claims description 2
- 229910001285 shape-memory alloy Inorganic materials 0.000 claims 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Description
第１図は本考案の一実施例の平面図、第２図は
第１図の実施例の側面図、第３図は第２図のガイ
ドスプリング２の運用状態を拡大して示す側面図
、第４図は第２図のガイドスプリング２の冷却状
態を拡大して示す側面図、第５図は従来の材料に
よるガイドスプリングを利用して放熱板付きプリ
ント基本を電子機器用筐体に収納した状態を示す
側面図である。
１……放熱板付きプリント基板、２，３……ガ
イドスプリング、４……電子機器用筐体カバー、
５……電子機器用筐体、６……マザーボード、７
……マザーボード側コネクタ、８……プリント基
板用コネクタ、９……固定ネジ。
1 is a plan view of an embodiment of the present invention, FIG. 2 is a side view of the embodiment of FIG. 1, and FIG. 3 is an enlarged side view of the operating state of the guide spring 2 of FIG. Fig. 4 is an enlarged side view showing the cooling state of the guide spring 2 in Fig. 2, and Fig. 5 shows a printed basic unit with a heat dissipation plate housed in an electronic device casing using a guide spring made of conventional materials. It is a side view which shows a state. 1... Printed circuit board with heat sink, 2, 3... Guide spring, 4... Housing cover for electronic equipment,
5... Housing for electronic equipment, 6... Motherboard, 7
... Motherboard side connector, 8 ... Printed circuit board connector, 9 ... Fixing screw.
Claims (1)
着固定する放熱板付きプリント基板を板バネとし
て固定する固定用ガイドスプリングにおいて、 電子機器の動作時の加熱状態にあつては前記放
熱板付きプリント基板の動作発熱を放熱板と密着
接合する電子機器用筐体の伝導を介して受けて前
記放熱板付きプリント基板を電子機器用筐体に圧
着固定する板バネに変形し、電子機器を非動作時
の冷却状態にあつては前記板バネ形状を失つて前
記放熱板付きプリント基板との間に隙間を生ずる
ように形状記憶せしめた形状記憶合金部材で構成
したことを特徴とする放熱板付きプリント基板の
固定用ガイドスプリング。[Scope of Claim for Utility Model Registration] A fixing guide spring that fixes a printed circuit board with a heat dissipation plate as a leaf spring by pressing and fixing the printed circuit board with a heat dissipation plate to an electronic device housing, which is in a heated state during operation of the electronic device. The printed circuit board with the heat sink is transformed into a leaf spring that receives the heat generated by the operation of the printed circuit board with the heat sink through conduction of the electronic device casing that is closely joined to the heat sink and fixes the printed circuit board with the heat sink to the electronic device casing. and that the electronic device is constructed of a shape memory alloy member that has a shape memory so that when the electronic device is in a cooling state when not in operation, it loses the leaf spring shape and creates a gap between the electronic device and the printed circuit board with the heat dissipation plate. Features a guide spring for fixing printed circuit boards with a heat sink.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15315188U JPH0273788U (en) | 1988-11-24 | 1988-11-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15315188U JPH0273788U (en) | 1988-11-24 | 1988-11-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0273788U true JPH0273788U (en) | 1990-06-05 |
Family
ID=31428731
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15315188U Pending JPH0273788U (en) | 1988-11-24 | 1988-11-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0273788U (en) |
-
1988
- 1988-11-24 JP JP15315188U patent/JPH0273788U/ja active Pending
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