JPH02737U - - Google Patents
Info
- Publication number
- JPH02737U JPH02737U JP1988077006U JP7700688U JPH02737U JP H02737 U JPH02737 U JP H02737U JP 1988077006 U JP1988077006 U JP 1988077006U JP 7700688 U JP7700688 U JP 7700688U JP H02737 U JPH02737 U JP H02737U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- thermal conductive
- conductive grease
- semiconductor
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/073—Connecting or disconnecting of die-attach connectors
- H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/30—Die-attach connectors
Description
第１図はこの考案のヒートシンク付半導体装置
の一実施例を部分断面で示す正面図、第２図およ
び第３図はそれぞれ従来のヒートシンク付半導体
装置を示す正面図である。
なお図中１はヒートシンク、２は半導体、３は
パツケージ、１０は高分子系接着剤、１２は熱伝
導グリースである。その他図中同一符号は同一部
分を示すものとする。
FIG. 1 is a partially sectional front view showing an embodiment of the semiconductor device with a heat sink of this invention, and FIGS. 2 and 3 are front views showing conventional semiconductor devices with a heat sink, respectively. In the figure, 1 is a heat sink, 2 is a semiconductor, 3 is a package, 10 is a polymeric adhesive, and 12 is thermal conductive grease. In other figures, the same reference numerals indicate the same parts.
Claims (1)
のヒートシンクとの間に熱伝導グリースを充填状
態に使用し、かつこの熱伝導グリースの周囲には
これを覆うように上記パツケージとヒートシンク
との接着用高分子系接着剤を使用したことを特徴
とするヒートシンク付半導体装置。 Thermal conductive grease is used in a filled state between the surface of the package containing the semiconductor and the heat sink on it, and a high adhesive layer is placed around the thermal conductive grease to cover it. A semiconductor device with a heat sink characterized by using a molecular adhesive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988077006U JPH02737U (en) | 1988-06-10 | 1988-06-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988077006U JPH02737U (en) | 1988-06-10 | 1988-06-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02737U true JPH02737U (en) | 1990-01-05 |
Family
ID=31302010
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988077006U Pending JPH02737U (en) | 1988-06-10 | 1988-06-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02737U (en) |
-
1988
- 1988-06-10 JP JP1988077006U patent/JPH02737U/ja active Pending
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