JPH027480A - Manufacture of piezoelectric ceramic - Google Patents
Manufacture of piezoelectric ceramicInfo
- Publication number
- JPH027480A JPH027480A JP63157408A JP15740888A JPH027480A JP H027480 A JPH027480 A JP H027480A JP 63157408 A JP63157408 A JP 63157408A JP 15740888 A JP15740888 A JP 15740888A JP H027480 A JPH027480 A JP H027480A
- Authority
- JP
- Japan
- Prior art keywords
- ink layer
- layer
- piezoelectric ceramic
- conductive ink
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 39
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- 239000000463 material Substances 0.000 claims abstract description 27
- 238000000034 method Methods 0.000 claims abstract description 14
- 239000010410 layer Substances 0.000 claims description 34
- 238000012546 transfer Methods 0.000 claims description 23
- 239000012790 adhesive layer Substances 0.000 claims description 9
- 238000007650 screen-printing Methods 0.000 claims description 3
- 239000010408 film Substances 0.000 abstract description 16
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract description 3
- 239000010409 thin film Substances 0.000 abstract description 2
- 238000013518 transcription Methods 0.000 abstract 8
- 230000035897 transcription Effects 0.000 abstract 8
- 238000010030 laminating Methods 0.000 abstract 1
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 229920000178 Acrylic resin Polymers 0.000 description 4
- 239000004925 Acrylic resin Substances 0.000 description 4
- 238000010304 firing Methods 0.000 description 4
- 238000007639 printing Methods 0.000 description 4
- 230000005684 electric field Effects 0.000 description 3
- 229920000877 Melamine resin Polymers 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 2
- 229920006122 polyamide resin Polymers 0.000 description 2
- 229920006267 polyester film Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920006284 nylon film Polymers 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- -1 polypropylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
Landscapes
- Transducers For Ultrasonic Waves (AREA)
Abstract
Description
この発明は、アコースティックエミシシッン信号を検出
するＡＥセンサーや超音波発振体として用いられる圧電
磁器の製造方法に関するものである。The present invention relates to a method of manufacturing a piezoelectric ceramic used as an AE sensor or an ultrasonic oscillator for detecting an acoustic emission signal.
従来、ＡＥセンサーや超音波発振体として用いられる圧
電磁器は酸化アルミニウム（Ａｆｆｉｘｅｓ）などの振
動板上に導体電極を形成し、この導体電極上に、あらか
じめチタン酸バリウム（ＢａＴｉＯｓ）などの圧電セラ
ミックをプレス成型したのち焼成したものを接着剤にて
貼り付は固定し、再び導体電極を形成し、次いで焼成し
て製造されていた（第４図参照）。Conventionally, piezoelectric ceramics used as AE sensors and ultrasonic oscillators have a conductive electrode formed on a diaphragm made of aluminum oxide (Affixes), and a piezoelectric ceramic such as barium titanate (BaTiOs) is placed on this conductive electrode in advance. The product was manufactured by press-molding and firing, pasting and fixing with adhesive, forming conductive electrodes again, and then firing (see Figure 4).
しかし、圧電セラミックは焼成体として使用するため、
振動板上に接着固定する際にクラックや割れを生じやす
いため薄膜化ができず、また柔軟性がないため貼り付は
作業上取り扱いにくく、さらに大面積化ができないなど
の問題があった。
また、ヒートサイクル試験や耐熱試験などを行うと、リ
ジッドな振動板と圧電セラミックとを固定しているので
接着剤にストレスがたまり、圧電磁器として不安定なも
のであった。
この発明は以上のような問題点を解決し、製造途中では
圧電セラミックが比較的柔軟性を有して取り扱いやすく
、また′ａ膜化しかつ大面積化することを可能にすると
ともに、振動板上に形成される導体電極や圧電セラミッ
クを一工程にて効率よく形成する方法を提供することを
目的とする。However, since piezoelectric ceramics are used as fired bodies,
When adhesively fixing it on the diaphragm, it tends to crack or break, so it cannot be made into a thin film, and since it is not flexible, it is difficult to work with when pasting, and furthermore, it cannot be applied to a large area. Furthermore, when heat cycle tests and heat resistance tests were performed, stress accumulated on the adhesive because the rigid diaphragm and piezoelectric ceramic were fixed, and the piezoelectric ceramic was unstable. This invention solves the above-mentioned problems, and makes it possible for piezoelectric ceramics to be relatively flexible and easy to handle during manufacturing, and to be made into a film with a large surface area. The purpose of the present invention is to provide a method for efficiently forming conductive electrodes and piezoelectric ceramics in one step.
この発明は、以上の目的を達成するために、圧電磁器の
製造方法を、剥離性を有するフィルム上に導電インキ層
・圧電セラミックインキ層・導電インキ層・接着層がス
クリーン印刷法にて順次積層された転写材を、振動板上
に熱あるいは圧力により接着し、次いでフィルムを剥鋪
し、その後焼成するように構成した。
図面を参照しながらこの発明をさらに詳しく説明する。
第１〜２図はこの発明の圧電磁器を示す斜視図、第３図
はこの発明に用いる転写材の断面図である。
１はフィルム、２は導電インキ層、３は圧電セラミック
インキ層、４は導電インキ層、５は接着層、６は転写材
、７は振動板、８は導体電極、９は圧電セラミックをそ
れぞれ示す。
転写材６は次のようにして得る。
まず、剥離性を有するフィルム１上に導電インキ層２を
形成する。ここで用いるフィルム１としては、通常の転
写材に用いられるものでよく、たとえばポリエステルフ
ィルム・ポリプロピレンフィルム・ナイロンフィルムな
どに、ワックスコートあるいはメラミンコート・シリコ
ンコートなどにより離型処理を施したものである。
導電インキＮ２としては、たとえば、マイグレーション
防止用としてＰｄを含有した八ｇをアクリル系樹脂に練
り込んだインキを、ロータリースクリーン印刷機などを
用いてフィルム１の上に印刷して形成する。スクリーン
印刷法を採用すると、厚膜印刷が可能であり、またスク
リーンのパターンの形状を変えるだけで任意の形状の導
電インキ層２を簡単に形成することができる。
次いで、圧電セラミックインキ層３を導電インキＮ２の
上に形成する。圧電セラミックインキ層３としては、た
とえば、ＰｂＴｉ０ｓ−ＰｂＺｒＯｓ系の圧電セラミッ
クの粉末をガラスフリットとともにアクリル系樹脂やポ
リビニルブチラール樹脂などに分散したインキを用い、
前記と同様の印刷法で形成する。
さらに、導電インキ層４を圧電セラミックインキ層３の
上に形成する。導電インキ層４は、前述の導電インキ層
２と同様のものを用いる。
最後に、接＠層５を導電インキ層４の上に形成する。接
着Ｎ５は、ポリアミド系樹脂などを前述と同様の印刷法
で形成する。
転写材６を構成する各層の厚みは、スクリーンのマスク
の厚さやメツシュの粗さを変えることで１〜数１００μ
ｍの任意の厚みに設定することができる。
このようにして得られた転写材６を、アルミナ（Ａ ｉ
！０３）製なとの振動板７に転写する。振動板７の上
に転写材６の接着層５側が接するように両者を重ね合わ
せ、次いで加熱されたロールやラバーなどで加圧して接
着層５を融着させる。この工程には、ロール転写機やア
ップダウン転写機を用いるとよい、最後にフィルム１を
剥離して、転写工程が終了する。
次いで、転写材６の各層が転写された振動板７を焼成す
る。この焼成工程によって、転写材６の形成時に転写材
の各層に混合された存機成分を分解除去するとともに、
無機成分どうしを強固に固めて圧電磁器を形成すること
ができる。焼成温度としては、８００〜１２００℃が適
当である。
このようにして、圧電磁器が完成する（第１図参照）。
また、第３図のように転写材を構成し、第２図のように
導電層インキＮ４が転写物の表面にでてくるような圧電
磁器とするすると、導体電極８にリード線を接続するこ
とが容易になる。
また、この圧電磁器の導体電ｐｉＢ部にリード線を介し
て高電圧印加端子を接続し、抗電界以上の電界を印加し
、約１００°Ｃのシリコンオイル中にて分解処理すると
、圧電セラミック９の双極子モーメントの方向を電界に
対して一定の方向に整列させることができる。このよう
にして圧電磁器は振動エネルギーと電気エネルギーを双
方向に変換する振動子となる。In order to achieve the above object, this invention provides a method for manufacturing piezoelectric ceramics in which a conductive ink layer, a piezoelectric ceramic ink layer, a conductive ink layer, and an adhesive layer are sequentially laminated on a peelable film using a screen printing method. The transferred transfer material was adhered onto the diaphragm by heat or pressure, and then the film was peeled off and then baked. The present invention will be explained in more detail with reference to the drawings. 1 and 2 are perspective views showing the piezoelectric ceramic of this invention, and FIG. 3 is a sectional view of a transfer material used in this invention. 1 is a film, 2 is a conductive ink layer, 3 is a piezoelectric ceramic ink layer, 4 is a conductive ink layer, 5 is an adhesive layer, 6 is a transfer material, 7 is a diaphragm, 8 is a conductive electrode, and 9 is a piezoelectric ceramic. . The transfer material 6 is obtained as follows. First, a conductive ink layer 2 is formed on a releasable film 1. The film 1 used here may be one used for ordinary transfer materials, such as a polyester film, polypropylene film, nylon film, etc., which has been subjected to a release treatment with a wax coat, a melamine coat, a silicon coat, etc. . The conductive ink N2 is formed by printing, for example, on the film 1 using a rotary screen printer or the like, an ink obtained by kneading 8 g of Pd into an acrylic resin to prevent migration. By employing the screen printing method, thick film printing is possible, and the conductive ink layer 2 of any shape can be easily formed by simply changing the shape of the screen pattern. A piezoelectric ceramic ink layer 3 is then formed on the conductive ink N2. As the piezoelectric ceramic ink layer 3, for example, an ink in which PbTiOs-PbZrOs piezoelectric ceramic powder is dispersed in acrylic resin or polyvinyl butyral resin together with glass frit is used.
It is formed by the same printing method as above. Furthermore, a conductive ink layer 4 is formed on the piezoelectric ceramic ink layer 3. The conductive ink layer 4 is the same as the conductive ink layer 2 described above. Finally, a contact layer 5 is formed on the conductive ink layer 4. The adhesive N5 is formed of polyamide resin or the like using the same printing method as described above. The thickness of each layer constituting the transfer material 6 can be varied from 1 to several 100 μm by changing the thickness of the screen mask and the roughness of the mesh.
It can be set to an arbitrary thickness of m. The transfer material 6 thus obtained was coated with alumina (A i
! 03) Transfer it to the diaphragm 7 made of aluminum. The transfer material 6 is placed on top of the diaphragm 7 so that the adhesive layer 5 side is in contact with the diaphragm 7, and then pressure is applied with a heated roll, rubber, etc. to fuse the adhesive layer 5. A roll transfer machine or an up-down transfer machine may be used for this process.Finally, the film 1 is peeled off to complete the transfer process. Next, the diaphragm 7 to which each layer of the transfer material 6 has been transferred is fired. Through this baking process, the residual components mixed in each layer of the transfer material during the formation of the transfer material 6 are decomposed and removed, and
Piezoelectric ceramics can be formed by solidifying inorganic components. A suitable firing temperature is 800 to 1200°C. In this way, the piezoelectric ceramic is completed (see Figure 1). Furthermore, if the transfer material is configured as shown in FIG. 3 and is made of piezoelectric ceramic such that the conductive layer ink N4 appears on the surface of the transfer material as shown in FIG. 2, a lead wire is connected to the conductive electrode 8. It becomes easier. In addition, when a high voltage application terminal is connected to the conductor electric piB portion of this piezoelectric ceramic via a lead wire, an electric field higher than the coercive electric field is applied, and decomposition treatment is performed in silicone oil at about 100°C, the piezoelectric ceramic 9 The direction of the dipole moment of can be aligned in a constant direction with respect to the electric field. In this way, the piezoelectric ceramic becomes a vibrator that bidirectionally converts vibrational energy and electrical energy.
フィルムとして、ポリエステルフィルムにメラミンコー
トを行ったものを使用し、Ｐｄを含有したＡｇをアクリ
ル系樹脂を練り込んだ導電インキ層、ＰｂＴｉ０ｚ−Ｐ
ｂＺｒＯｓ系の圧電セラミックの粉末をガラスフリット
とともにアクリル系樹脂に分散した圧電セラミックイン
キ層、前述の導電インキ層と同様の導電インキ層、ポリ
アミド系樹脂の接着層を順次形成して転写材を得た。
このようにして得られた転写材をアルミナ（ＡＩ！ｚｏ
ｉ）製の振動板ニ２２０’Ｃ，１００ｋｇ／ｃｎ＋”（
７）条件下で転写した。
次いで、この転写物を８００〜１２００″Ｃで焼成して
圧Ｔｉ磁器を完成した。A melamine-coated polyester film was used as the film, and a conductive ink layer in which Pd-containing Ag was kneaded with acrylic resin, PbTi0z-P
A transfer material was obtained by sequentially forming a piezoelectric ceramic ink layer in which bZrOs-based piezoelectric ceramic powder was dispersed in an acrylic resin together with glass frit, a conductive ink layer similar to the above-mentioned conductive ink layer, and an adhesive layer of polyamide resin. . The transfer material obtained in this way is coated with alumina (AI!zo
i) diaphragm Ni220'C, 100kg/cn+" (
7) Transferred under the following conditions. Next, this transferred material was fired at 800 to 1200''C to complete pressure Ti porcelain.
この発明は、剥離性を有するフィルム上に導電インキ層
・圧電セラミックインキ層・導電インキ層・接着層が順
次積層された転写材を用い、振動板上に転写し、次いで
焼成するように構成された圧電磁器の製造方法であり、
圧電セラミックインキ層を焼成されていない状態で振動
板上に接着固定するものであるから、適当な柔軟性を有
しており、加工中にクラックやひび割れが生じることが
なく、したがって薄膜化かつ大面積化が可能である。ま
た、焼成工程が一回ですむので、工程数的にも有利であ
る。また、接着剤を用いず、接着層にて振動板に接着す
るので、接着剤がはみ出したりすることがない、また、
所望する任意の形状にパターン化することも容易であり
、金型が不要となる。このように、取り扱いが容易で、
作業性・量産性に優れたものである。This invention uses a transfer material in which a conductive ink layer, a piezoelectric ceramic ink layer, a conductive ink layer, and an adhesive layer are sequentially laminated on a removable film, and is transferred onto a diaphragm and then fired. A method for manufacturing piezoelectric ceramics,
Since the piezoelectric ceramic ink layer is bonded and fixed on the diaphragm in an unfired state, it has appropriate flexibility and does not cause cracks or crazing during processing, so it can be made thinner and larger. Can be converted into area. Furthermore, since only one firing step is required, it is advantageous in terms of the number of steps. In addition, since it is bonded to the diaphragm with an adhesive layer without using adhesive, there is no possibility that the adhesive will protrude.
It is also easy to pattern into any desired shape, eliminating the need for a mold. In this way, it is easy to handle,
It has excellent workability and mass production.
第１〜２図はこの発明の圧電磁器を示す斜視図、第３図
はこの発明に用いる転写材の断面図、第４図は従来の圧
電磁器を示す斜視図である。
１・・・フィルム、２・・・導電インキ層、３・・・圧
電セラミックインキ層、４・・・導電インキ層、５・・
・接着層、６・・・転写材、７・・・振動板、８・・・
導体電極、９・・・圧電セラミック。
特許出願人 日本写真印′刷株式会社1 and 2 are perspective views showing a piezoelectric ceramic according to the present invention, FIG. 3 is a sectional view of a transfer material used in the present invention, and FIG. 4 is a perspective view showing a conventional piezoelectric ceramic. DESCRIPTION OF SYMBOLS 1... Film, 2... Conductive ink layer, 3... Piezoelectric ceramic ink layer, 4... Conductive ink layer, 5...
・Adhesive layer, 6... Transfer material, 7... Vibration plate, 8...
Conductor electrode, 9...piezoelectric ceramic. Patent applicant Nippon Shashin Printing Co., Ltd.
Claims (1)
２）・圧電セラミックインキ層（３）・導電インキ層（
４）・接着層（５）がスクリーン印刷法にて順次積層さ
れた転写材（６）を、振動板（７）上に熱あるいは圧力
により接着し、次いでフィルム（１）を剥離し、その後
焼成することを特徴とする圧電磁器の製造方法。1. A conductive ink layer (
2)・Piezoelectric ceramic ink layer (3)・Conductive ink layer (
4)・The transfer material (6), in which the adhesive layer (5) is sequentially laminated by screen printing method, is adhered onto the diaphragm (7) by heat or pressure, then the film (1) is peeled off, and then baked. A method for manufacturing piezoelectric ceramics, characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63157408A JPH027480A (en) | 1988-06-24 | 1988-06-24 | Manufacture of piezoelectric ceramic |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63157408A JPH027480A (en) | 1988-06-24 | 1988-06-24 | Manufacture of piezoelectric ceramic |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH027480A true JPH027480A (en) | 1990-01-11 |
Family
ID=15648978
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63157408A Pending JPH027480A (en) | 1988-06-24 | 1988-06-24 | Manufacture of piezoelectric ceramic |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH027480A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI664754B (en) * | 2016-03-25 | 2019-07-01 | 日商日本碍子股份有限公司 | Joint body and elastic wave device |
-
1988
- 1988-06-24 JP JP63157408A patent/JPH027480A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI664754B (en) * | 2016-03-25 | 2019-07-01 | 日商日本碍子股份有限公司 | Joint body and elastic wave device |
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