JPH0275746U - - Google Patents

Info

Publication number
JPH0275746U
JPH0275746U JP15474988U JP15474988U JPH0275746U JP H0275746 U JPH0275746 U JP H0275746U JP 15474988 U JP15474988 U JP 15474988U JP 15474988 U JP15474988 U JP 15474988U JP H0275746 U JPH0275746 U JP H0275746U
Authority
JP
Japan
Prior art keywords
flat package
laminated
terminal mounting
mounting electrode
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15474988U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP15474988U priority Critical patent/JPH0275746U/ja
Publication of JPH0275746U publication Critical patent/JPH0275746U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】
第１図は本考案の一実施例に係るＩＣ用積層パ
ツケージの使用態様を示す正面図、第２図は本実
施例に係るＩＣ用積層パツケージ本体にリード端
子を接続した状態を示す底面図、第３図は第２図
の要部拡大図、第４図は第３図の側面図、第５図
は従来のＩＣ用パツケージにリード端子を付着し
た状態を示す側面図である。 第１図は本考案の、１：ＩＣ用積層パツケージ
、２：リード端子、３：リード端子取付電極部、
４：プリント基板。

Claims (1)

    【実用新案登録請求の範囲】
  1. リード端子を配設して使用するＩＣ用フラツト
    パツケージに関し、前記ＩＣ用フラツトパツケー
    ジのリード端子取付電極部を、外周に沿つて複数
    の段差構造としたことを特徴とするＩＣ用積層パ
    ツケージ。
JP15474988U 1988-11-30 1988-11-30 Pending JPH0275746U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15474988U JPH0275746U (ja) 1988-11-30 1988-11-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15474988U JPH0275746U (ja) 1988-11-30 1988-11-30

Publications (1)

Publication Number Publication Date
JPH0275746U true JPH0275746U (ja) 1990-06-11

Family

ID=31431759

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15474988U Pending JPH0275746U (ja) 1988-11-30 1988-11-30

Country Status (1)

Country Link
JP (1) JPH0275746U (ja)

Similar Documents

Publication Publication Date Title
JPH0275746U (ja)
JPH0221754U (ja)
JPS61151337U (ja)
JPH01129877U (ja)
JPH0279055U (ja)
JPH0166763U (ja)
JPH0158955U (ja)
JPH01162273U (ja)
JPS6247171U (ja)
JPS6413155U (ja)
JPS6298271U (ja)
JPH0215745U (ja)
JPH0160577U (ja)
JPS63162547U (ja)
JPS6247144U (ja)
JPS62160468U (ja)
JPS6390859U (ja)
JPH0179853U (ja)
JPH0229538U (ja)
JPS6355506U (ja)
JPS6090846U (ja) 混成集積回路
JPS646029U (ja)
JPH0286168U (ja)
JPS6287483U (ja)
JPS6221547U (ja)