JPH0275765U - - Google Patents

Info

Publication number
JPH0275765U
JPH0275765U JP15571088U JP15571088U JPH0275765U JP H0275765 U JPH0275765 U JP H0275765U JP 15571088 U JP15571088 U JP 15571088U JP 15571088 U JP15571088 U JP 15571088U JP H0275765 U JPH0275765 U JP H0275765U
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
groove
printed
broken
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15571088U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP15571088U priority Critical patent/JPH0275765U/ja
Publication of JPH0275765U publication Critical patent/JPH0275765U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structure Of Printed Boards (AREA)

Description

【図面の簡単な説明】
第１図は本考案の一実施例の斜視図、第２図は
従来の印刷配線基板の斜視図である。 １……プリント基板、２，３……プリント板表
面、４，５……Ｖ溝、６……Ｖ溝の残り部分、７
……貫通孔。

Claims (1)

    【実用新案登録請求の範囲】
  1. プリント基板上の部品取り付け後に折り取るこ
    とができるチヨコブレーク用のＶ溝を前記プリン
    ト基板の両面または片面に設けた印刷配線基板に
    おいて、前記Ｖ溝の任意の箇所に複数個の貫通孔
    を設けたことを特徴とする印刷配線基板。
JP15571088U 1988-11-29 1988-11-29 Pending JPH0275765U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15571088U JPH0275765U (ja) 1988-11-29 1988-11-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15571088U JPH0275765U (ja) 1988-11-29 1988-11-29

Publications (1)

Publication Number Publication Date
JPH0275765U true JPH0275765U (ja) 1990-06-11

Family

ID=31433584

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15571088U Pending JPH0275765U (ja) 1988-11-29 1988-11-29

Country Status (1)

Country Link
JP (1) JPH0275765U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013157432A (ja) * 2012-01-30 2013-08-15 Seiko Epson Corp 基板集合体、電子デバイス、及び基板集合体の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013157432A (ja) * 2012-01-30 2013-08-15 Seiko Epson Corp 基板集合体、電子デバイス、及び基板集合体の製造方法

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