JPH0276006U - - Google Patents

Info

Publication number
JPH0276006U
JPH0276006U JP15622988U JP15622988U JPH0276006U JP H0276006 U JPH0276006 U JP H0276006U JP 15622988 U JP15622988 U JP 15622988U JP 15622988 U JP15622988 U JP 15622988U JP H0276006 U JPH0276006 U JP H0276006U
Authority
JP
Japan
Prior art keywords
resin
pin
removal device
resin burr
burr removal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15622988U
Other languages
English (en)
Other versions
JP2514858Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988156229U priority Critical patent/JP2514858Y2/ja
Publication of JPH0276006U publication Critical patent/JPH0276006U/ja
Application granted granted Critical
Publication of JP2514858Y2 publication Critical patent/JP2514858Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Nonmetal Cutting Devices (AREA)

Description

【図面の簡単な説明】
第１図は本考案の実施例の正面図、第２図及び
第３図は本考案の実施例により樹脂バリを除去す
る状態の正面図、第４図は本考案の他の実施例の
正面図、第５図はモールド後のリードフレームの
断面図、第６図イ及びロは従来の樹脂バリ除去装
置により樹脂バリを除去した状態の断面図及び裏
面図を示す。 １，１１…ピン、２，３，１２…先端、６…リ
ードフレーム、８…樹脂バリ、９…端子。

Claims (1)

    【実用新案登録請求の範囲】
  1. 素子をリードフレームに接続した状態で樹脂モ
    ールドにより外装を形成したときに生じる樹脂バ
    リを、ピンを押圧することによつて除去しうる樹
    脂バリ除去装置において、先端が鋭角で、その尖
    つた部分が樹脂バリの端子により近い方に押圧さ
    れるピンを有することを特徴とする樹脂バリ除去
    装置。
JP1988156229U 1988-11-30 1988-11-30 樹脂バリ除去装置 Expired - Lifetime JP2514858Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988156229U JP2514858Y2 (ja) 1988-11-30 1988-11-30 樹脂バリ除去装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988156229U JP2514858Y2 (ja) 1988-11-30 1988-11-30 樹脂バリ除去装置

Publications (2)

Publication Number Publication Date
JPH0276006U true JPH0276006U (ja) 1990-06-11
JP2514858Y2 JP2514858Y2 (ja) 1996-10-23

Family

ID=31434583

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988156229U Expired - Lifetime JP2514858Y2 (ja) 1988-11-30 1988-11-30 樹脂バリ除去装置

Country Status (1)

Country Link
JP (1) JP2514858Y2 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100801150B1 (ko) * 2006-06-26 2008-02-11 (주)엠아이반도체 패키지된 반도체 및 전자부품의 몰딩수지 제거장치 및몰딩수지 제거방법

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5167357A (ja) * 1974-12-07 1976-06-10 Toyoda Gosei Kk Tenzopurasuchitsukuhagurumano barijokyohoho
JPS58124255A (ja) * 1982-01-21 1983-07-23 Toshiba Corp 半導体装置のリ−ドフレ−ム
JPS63107521A (ja) * 1986-10-24 1988-05-12 Hitachi Ltd ばり取り装置
JPS6450454A (en) * 1987-08-21 1989-02-27 Hitachi Ltd Manufacture of lead frame and semiconductor device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5167357A (ja) * 1974-12-07 1976-06-10 Toyoda Gosei Kk Tenzopurasuchitsukuhagurumano barijokyohoho
JPS58124255A (ja) * 1982-01-21 1983-07-23 Toshiba Corp 半導体装置のリ−ドフレ−ム
JPS63107521A (ja) * 1986-10-24 1988-05-12 Hitachi Ltd ばり取り装置
JPS6450454A (en) * 1987-08-21 1989-02-27 Hitachi Ltd Manufacture of lead frame and semiconductor device

Also Published As

Publication number Publication date
JP2514858Y2 (ja) 1996-10-23

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