JPH02760U - - Google Patents
Info
- Publication number
- JPH02760U JPH02760U JP1988078506U JP7850688U JPH02760U JP H02760 U JPH02760 U JP H02760U JP 1988078506 U JP1988078506 U JP 1988078506U JP 7850688 U JP7850688 U JP 7850688U JP H02760 U JPH02760 U JP H02760U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor light
- heat sink
- thermal conductivity
- emitting element
- high thermal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003287 optical effect Effects 0.000 claims description 8
- 239000004065 semiconductor Substances 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 5
- 239000000463 material Substances 0.000 claims 4
- 229920002635 polyurethane Polymers 0.000 claims 1
- 239000004814 polyurethane Substances 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
- 239000000835 fiber Substances 0.000 description 1
Landscapes
- Optical Communication System (AREA)
- Optical Couplings Of Light Guides (AREA)
Description
第１図は本考案の一実施例の縦断面図、第２図
は従来のモジユールの縦断面図である。
１……Ｌ字型ブロツク、２，１２……ペルチエ
素子、３，１３……金属ケース、４……金属箱の
うち一部をくり抜かれた面板、５，１５……放熱
板、６，１６……半導体素子、７，１７……レン
ズ（光学部品）、８，１８……フアイバ（光学部
品）、９，１９……リード。
FIG. 1 is a longitudinal sectional view of an embodiment of the present invention, and FIG. 2 is a longitudinal sectional view of a conventional module. 1... L-shaped block, 2, 12... Peltier element, 3, 13... Metal case, 4... Face plate with a part cut out of the metal box, 5, 15... Heat sink, 6, 16 ...Semiconductor element, 7, 17... Lens (optical component), 8, 18... Fiber (optical component), 9, 19... Lead.
Claims (1)
導体発光素子又は前記半導体受光素子に関係する
光学部品と、前記半導体発光素子又は前記半導体
受光素子及び前記光学部品の少なくとも一部分を
搭載するペルチエ素子と、前記半導体発光素子又
は前記半導体受光素子、前記光学部品及び前記ペ
ルチエ素子を気密封止する金属箱と、前記金属箱
に貼付けられた放熱板とを有するＤＩＰ型光通信
用発光・受光モジユールにおいて、前記ペルチエ
素子を乗せる高熱伝導率材料より成るＬ字型ブロ
ツクと、高熱伝導率材料より成る放熱板が取り付
けられる前記金属箱の１面の少なくとも一部分が
くり抜かれており、前記Ｌ字型ブロツクが直接前
記高熱伝導率材料より成る放熱板へ達するように
構成されたことを特徴とするＤＩＰ型光通信用モ
ジユール。 a semiconductor light-emitting element or a semiconductor light-receiving element; an optical component related to the semiconductor light-emitting element or the semiconductor light-receiving element; a Peltier element on which at least a portion of the semiconductor light-emitting element or the semiconductor light-receiving element and the optical component are mounted; A light emitting/light receiving module for DIP optical communication, comprising a metal box for hermetically sealing a light emitting element or the semiconductor light receiving element, the optical component, and the Peltier element, and a heat sink attached to the metal box, wherein the Peltier element At least a portion of one side of the metal box to which an L-shaped block made of a high thermal conductivity material is mounted and a heat sink made of a high thermal conductivity material is attached is hollowed out, and the L-shaped block is directly attached to the high thermal conductivity material. 1. A DIP type optical communication module, characterized in that the DIP type optical communication module is configured to reach a heat sink made of a polyurethane material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988078506U JPH02760U (en) | 1988-06-13 | 1988-06-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988078506U JPH02760U (en) | 1988-06-13 | 1988-06-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02760U true JPH02760U (en) | 1990-01-05 |
Family
ID=31303428
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988078506U Pending JPH02760U (en) | 1988-06-13 | 1988-06-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02760U (en) |
-
1988
- 1988-06-13 JP JP1988078506U patent/JPH02760U/ja active Pending
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