JPH02765U - - Google Patents

Info

Publication number
JPH02765U
JPH02765U JP7705188U JP7705188U JPH02765U JP H02765 U JPH02765 U JP H02765U JP 7705188 U JP7705188 U JP 7705188U JP 7705188 U JP7705188 U JP 7705188U JP H02765 U JPH02765 U JP H02765U
Authority
JP
Japan
Prior art keywords
metal foil
clad laminate
insulating layer
adhesive layer
colored
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7705188U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP7705188U priority Critical patent/JPH02765U/ja
Publication of JPH02765U publication Critical patent/JPH02765U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structure Of Printed Boards (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案にかかる金属箔張積層板の断面
概略図、第２図は金属箔が回路パターンにエツチ
ング加工された後のプリント基板半加工品の斜視
図である。 １は金属箔、２は接着剤層、３は積層板である
。 FIG. 1 is a schematic cross-sectional view of a metal foil-clad laminate according to the present invention, and FIG. 2 is a perspective view of a blank printed circuit board after the metal foil has been etched into a circuit pattern. 1 is a metal foil, 2 is an adhesive layer, and 3 is a laminate.

Claims (1)

【実用新案登録請求の範囲】 (1) 絶縁層が不飽和ポリエステル樹脂、エポキ
シ樹脂、ビニルエステル樹脂またはそれらの混合
物と、紙基材またはガラス繊維基材からなる金属
箔張積層板において、金属箔に隣接する絶縁層お
よび／または接着剤層がＪＩＳ Ｚ ８７２１に
準拠した標準色票で５ＧＹから５Ｂを経由し５Ｒ
までの色相で明度８以下の有彩色または、明度７
以下の無彩色に着色されていることを特徴とする
金属箔張積層板。 (2) 金属箔に隣接する絶縁層および／または接
着剤層が顔料および／または染料により着色され
ている第１項記載の金属箔張積層板。 (3) 金属箔に隣接する絶縁層および／または接
着剤層が黒色に着色されている第１項または第２
項記載の金属箔張積層板。 (4) 金属箔に隣接する絶縁層および／または接
着剤層に、カーボンブラツクが添加されている第
１項ないし第３項のいずれかに記載の金属箔張積
層板。[Scope of Claim for Utility Model Registration] (1) In a metal foil-clad laminate in which the insulating layer is made of unsaturated polyester resin, epoxy resin, vinyl ester resin, or a mixture thereof, and a paper base material or a glass fiber base material, the metal foil The insulating layer and/or adhesive layer adjacent to the
Chromatic colors with a hue of up to and a brightness of 8 or less, or a brightness of 7
A metal foil-clad laminate characterized by being colored in the following achromatic color. (2) The metal foil-clad laminate according to item 1, wherein the insulating layer and/or adhesive layer adjacent to the metal foil is colored with a pigment and/or dye. (3) Item 1 or 2, in which the insulating layer and/or adhesive layer adjacent to the metal foil is colored black.
The metal foil-clad laminate described in Section 1. (4) The metal foil-clad laminate according to any one of items 1 to 3, wherein carbon black is added to the insulating layer and/or adhesive layer adjacent to the metal foil.
JP7705188U 1988-06-10 1988-06-10 Pending JPH02765U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7705188U JPH02765U (en) 1988-06-10 1988-06-10

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7705188U JPH02765U (en) 1988-06-10 1988-06-10

Publications (1)

Publication Number Publication Date
JPH02765U true JPH02765U (en) 1990-01-05

Family

ID=31302052

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7705188U Pending JPH02765U (en) 1988-06-10 1988-06-10

Country Status (1)

Country Link
JP (1) JPH02765U (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04100509U (en) * 1991-01-25 1992-08-31
WO2017029973A1 (en) * 2015-08-17 2017-02-23 住友電気工業株式会社 Printed wiring board and electronic component
WO2017029972A1 (en) * 2015-08-17 2017-02-23 住友電気工業株式会社 Printed wiring board and electronic component
WO2024247971A1 (en) * 2023-06-02 2024-12-05 京セラ株式会社 Multilayer substrate and antenna element

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5931093A (en) * 1982-08-14 1984-02-18 松下電工株式会社 Metal base printed circuit board

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5931093A (en) * 1982-08-14 1984-02-18 松下電工株式会社 Metal base printed circuit board

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04100509U (en) * 1991-01-25 1992-08-31
WO2017029973A1 (en) * 2015-08-17 2017-02-23 住友電気工業株式会社 Printed wiring board and electronic component
WO2017029972A1 (en) * 2015-08-17 2017-02-23 住友電気工業株式会社 Printed wiring board and electronic component
JPWO2017029973A1 (en) * 2015-08-17 2018-06-07 住友電気工業株式会社 Printed wiring boards and electronic components
JPWO2017029972A1 (en) * 2015-08-17 2018-06-07 住友電気工業株式会社 Printed wiring boards and electronic components
US10537017B2 (en) 2015-08-17 2020-01-14 Sumitomo Electric Industries, Ltd. Printed circuit board and electronic component
US10537020B2 (en) 2015-08-17 2020-01-14 Sumitomo Electric Industries, Ltd. Printed circuit board and electronic component
WO2024247971A1 (en) * 2023-06-02 2024-12-05 京セラ株式会社 Multilayer substrate and antenna element

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